Chip replacement method

Abstract

A chip replacement method disclosed by the present invention is suitable for replacing a ball grid array (BGA) packaging chip, belongs to the mainboard maintenance technology field, and comprises thefollowing steps of providing a ball grid array soldering station; setting a temperature curve that the BGA soldering station works; fixing a mainboard on the BGA soldering station, and aligning a to-be-replaced chip on the mainboard at a wind inlet and a wind outlet of the BGA soldering station; starting the BGA soldering station, enabling the BGA soldering station to heat the to-be-replaced chipaccording to the temperature curve, and operating the BGA soldering station when the actual working temperature of the BGA soldering station and the highest temperature of the temperature curve have the preset temperature difference to enable the BGA soldering station to keep a current working temperature; taking out the to-be-replaced chip from the mainboard, and cleaning the soldering tin on a pad corresponding to the to-be-replaced chip; turning off the BGA soldering station, and placing a substituting chip on the pad; starting the BGA soldering station, and enabling the BGA soldering station to solder the substituting chip on the mainboard according to the temperature curve. The beneficial effects of the above technical scheme are that the BGA chip replacement time is short, the soldering yield is high, and the BGA chip replacement efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of mainboard maintenance, in particular to a chip replacement method suitable for replacing solder ball array packaged chips. Background technique [0002] With the continuous development of BGA devices (ball grid array package devices), the market demand increases and the product production capacity continues to increase. It is also difficult for SMT placement technology to avoid the emergence of defective BGA chips. Due to the high price of BGA chips, it is necessary to rework and replace BGA chips in order to reduce costs and improve product yield. At present, the industry usually uses the following two solutions to replace BGA chips: [0003] Option 1: use BGA soldering station: it takes about 4 minutes to remove the BGA chip by heating; it takes about 12 minutes to remove the motherboard after the BGA soldering station returns to normal temperature, and use electric chromium iron and tin suction tape t...

AI Technical Summary

Problems solved by technology

[0005] According to the above-mentioned problems existing in the prior art, a chip replacement method suitable for replacing solder ball array packaged chips is now provided, aiming at solving the problems of long time-consuming replacement of BGA chips and low soldering pass rate in the prior art

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