107 results about "Dissipated power" patented technology

A lighting system includes one or more methods and systems to control dissipation of excess power in the lighting system when the power into a switching power converter from a leading edge, phase-cut dimmer is greater than the power out of the switching power converter. In at least one embodiment, the lighting system includes a controller that controls dissipation of excess energy in the lighting system to prevent a premature disconnection of the phase-cut dimmer. In at least one embodiment, the controller actively controls power dissipation by generating one or more signals to actively and selectively control power dissipation in the lighting system. By actively and selectively controlling power dissipation in the lighting system, the controller intentionally dissipates power when the power into the lighting system should be greater than the power out to a lamp of the lighting system. In at least one embodiment, the controller creates one or more intermixed and / or interspersed power dissipation phases with one or more switching power converter charging and / or flyback phases.

Certain aspects of the present disclosure relate to a technique for touch temperature management of a wireless communications device based on power dissipated over time, and possibly internal temperature readings. For example, the information about power dissipated over time can be utilized along with monitored internal temperatures of a device's internal circuitry to reduce transmit power and / or data rates as required in order to keep a surface temperature of the wireless device below a specified limit. A knowledge of how the device's touch temperature varies with the dissipated power and a knowledge of the power dissipation history can be utilized to determine when to reduce the transmit power in order to avoid overheating (e.g., exceeding the touch temperature limit).

An intrinsically safe LED display device with an array of LED circuit cells is provided. Each cell comprises a LED or a group of LEDs, which are individually made intrinsically safe in a conventional way, by limiting a dissipated power through the LED circuit cell by means of a resistor or group of resistors in series with the LED or group of LEDs. In addition a switching type PTCs with a switching temperature between 80 and 125 degrees centigrade are added in each cell, in series with the resistors or group of resistors of the LED circuit cells respectively, in thermal contact with the resistor or group of resistors of the LED circuit cell. In this way intrinsic safety is provided for mutual heating of adjoining LED circuit cells wherein the LEDs or groups of LEDs are short circuited.

A fan control system for a computer system is provided. The fan control system includes a power sensor and a controller. The power sensor detects the power dissipated by a target device in the computer system. The controller calculates a suggested airflow speed required for the target device and thus outputs a control signal for controlling a fan within the computer system according to at least the dissipated power.

A fan control system for a computer system is provided. The fan control system includes a power sensor and a controller. The power sensor detects the power dissipated by a target device in the computer system. The controller calculates a suggested airflow speed required for the target device and thus outputs a control signal for controlling a fan within the computer system according to at least the dissipated power.

The invention relates to an evaporator for cooling a chip and a manufacture method thereof. The evaporator combines a micro-porous surface coat with a plurality of small-scale passageways. An evaporator main body consists of an upper cover plate and a lower base plate. The two ends of the upper cover plate of the evaporator are provided with a cooling liquid inlet and a cooling liquid outlet. The two ends of the lower base plate of the evaporator are respectively provided with an empty cavity; and the lower base plate is machined with a plurality of parallel ribs to form into the plurality of parallel small-scale passageways for flowing cooling liquid. The bottom surface of each small-scale passageway is coated with a layer of micro-porous surface coat for greatly intensifying the boiling phase-change heat transmission of the cooling liquid. The evaporator is glued with a heating electronic chip through a layer of heat-conductive silicone grease, heats up the cooling liquid which flows the passageways therein, absorbs the dissipated power of the electronic chip in the form of flowing boiling heat transmission, has the characteristics of small flow resistance, compact structure and low cost, has strong cooling performance, and is applied to cooling the electronic chip with high dissipated power.

Apparatus is described for controlling an electric heater incorporating at least one electric heating element (2A, 2B, 2C) and energized from a single voltage alternating current supply (8). The apparatus includes a control knob (15) for manually selecting any one of a predetermined number of power settings for the heater from the voltage supply (8), the power settings varying progressively between a minimum power setting and a maximum power setting. The apparatus further includes a controller (10) adapted and arranged to supply to the electric heater within a predetermined constant time interval in each power setting a first dissipated power level and a second dissipated power level. The first dissipated power level comprises a first selected proportion of half cycles in a predetermined number of half cycles of the voltage supply and the second dissipated power level comprises a second selected proportion of half cycles in a predetermined number of half cycles of the voltage supply. In a plurality of power settings the second selected proportion is different to the first selected proportion. There is no more than one change between the first and second dissipated power levels within the predetermined constant time interval.

A peripheral device receiving a command and power from a body device, wherein the power consumption can be reduced while maintaining a required function. The peripheral device comprises a functional unit that functions according to a command from the body device; a power control unit that controls the power consumption of the functional unit; a power profile information memory in which a power profile information list containing one or more pieces of power profile information is stored; and an interface unit that sends and receives the power profile information and a command about the functional unit to and from the body device. The interface unit sends the power profile information list to the body device in response to a request from the body device, and the power control unit controls the power consumption of the functional unit according to information selected from the power profile information received from the body device.

From a prescribed starting value, the emitting power of an obstacle detection beam increases or decreases according to a prescribed function at a prescribed rate. The received signal reflected from an obstacle is compared to a prescribed threshold. Once the received reflected power rises or falls to the threshold, the emitting power is not further increased or decreased respectively, but is maintained constant. Thereby, consumed and dissipated power is reduced, unnecessary excessive power use is avoided, and the detection range of the obstacle detection beam is adapted to the prevailing situation.

A method for controlling the constant power dissipation of a memory cell includes initially measuring the resistance of the memory cell, and subsequently controlling a source to apply a variable level of current or voltage to the memory cell. The variable level of the applied current or voltage is determined in proportion to the measured resistance of the memory cell so as to result in a predefined level of power dissipation within the memory cell, said dissipated power operable to heat the memory cell.

The apparatus, of the field of electrical engineering, comprises a DC voltage source (DCVS), a DC-to-pulse voltage converter (DCPVC), a pulse-to-DC voltage converter (PDCVC), a DC stabilizer (DCS) and a control circuit (CC). The DCPVC is connected to the DCVC by its inputs and to the PDCVC by its outputs. A PDCVC output is connected to the DCPVC first control input and to a DCS first input, whose second input is connected to a DCVS positive output and whose first output is an apparatus output. A CC first input is connected to the PDCVC output, a CC second input is connected to a DCS second output, a CC first output is connected to a DCVS negative output, and a CC second output is connected to a DCPVC second control input.The result is the stabilization of dissipation power in the stabilizer.

The present invention relates to a thermostatic control method for a chip and an over-temperature protecting circuit thereof, belonging to the power integrated power management IC chip field. The method converts the dissipating power generated by output current of the chip into variation of the internal temperature of the chip through a thermal resistor. Afterwards, the variation of the temperature of the chip is converted into variation of a voltage signal. After the voltage signal is amplified, the output current of the chip is controlled so that the dissipating power of the chip is adjusted and the thermostatic control of the chip is realized. The over-temperature protecting circuit is a closed loop control system formed by a temperature detecting circuit, a constant temperature amplifier and a power-to-temperature converting module. The method quantizes the entire process of 'temperature variation' of the chip by the transmission function of a continuous time domain so as to design a temperature adjusting circuit based on the closed-loop control. The method and the circuit realize that the maximization of the output power is ensured on the premise that the chip has no overheat risk when the chip requires overheat protection.

A system for managing the operation of a semiconductor device in accordance with varying load conditions that affect the power being dissipated by the semiconductor device, includes a sensor for measuring a temperature related to the junction temperature of an operating semiconductor device; electronic components for measuring the real-time operating load conditions of the operating semiconductor device; and a computer that is adapted by computer executable program instructions to perform the steps of:(a) determining the power being dissipated by the operating semiconductor device in accordance with the measured real-time operating load conditions of the semiconductor device;(b) determining a dynamic temperature cutback threshold for the operating semiconductor device in accordance with the determination of the power being dissipated; and(c) managing the operation of the semiconductor device in accordance with the measured temperature and the dynamic temperature cutback threshold.

The invention belongs to the technical field of semiconductor reliability and discloses a thermal resistance obtaining method. The method comprises the following steps: manufacturing an active region diffused resistor on the silicon membrane of a MOS device; obtaining the resistor temperature features of the resistor; obtaining the resistance of the resistor when the MOS device works; based on the resistor temperature features, obtaining the temperature of the resistor; obtaining the temperature difference [delta] T prior to and after when the MOS device works and the thermal dissipation power [delta] P of the MOS device; based on the formula Rth=[delta] T / [delta] P, calculating the thermal resistance Rth. The invention provides a reliable and accurate high thermal resistance obtaining method.

The invention discloses a charging circuit used for a mobile power supply and a mobile power supply. The charging circuit comprises a charging interface used for receiving an external input power supply, a discharging interface used for external connection with a load, a built-in cell used for storing electric energy, and a detection circuit used for detecting plugging states of the charging interface and the discharging interface. When the detection circuit detects that an input power supply accesses the charging interface, the input power supply is utilized to charge a load connected onto the discharging interface directly, the cell is controlled to stop charging the load. The mobile power supply utilizes an external input power supply to charge a load inserted into the mobile power supply directly when an input power supply is connected, thus the dissipation power of the mobile power supply can be lowered greatly, the heating value of the mobile power supply is lowered, that performances of an electronic device inside the mobile power supply cannot be lowered caused by too high working temperature is ensured, and the working reliability of the mobile power supply is raised.

The invention discloses a system and method for testing light-electricity-heat integration of an LED device. The system comprises a computer (010), an ARM control circuit (020), an optic testing system (030), a transient thermal testing system (040) and a thermostatic bath (050). The computer (010) is respectively connected with the ARM control circuit (020) and the transient thermal testing system (040) through signal wires (070), the ARM control circuit (020) is respectively connected with the transient thermal testing system (040) and the optic testing system (030) through signal wires (070), and the thermostatic bath (050) is respectively connected with the optic testing system (030) and the transient thermal testing system (040) through signal wires (070). According to the system for testing light-electricity-heat integration of the LED device, optical parameters, electricity parameters and thermal parameters of the LED device are measured at the same time, the luminous power in the measured optical parameters can be adopted, so that electric power exerted by a transient heat resistance testing system on the LED device is corrected, the actual wasted power of the LED device is obtained, and therefore an integration test of light, electricity and heat of the LED device is achieved, and the accuracy of the transient thermal resistance test of the LED device is improved.

A method of dissipating power in a propelled machine having a hydromechanical transmission includes converting undesired power to retarding power, and driving an engine with at least a portion of the retarding power prior to substantially dissipating power with any other power-dissipating device.

A rise time and / or a fall time of a driving voltage are set to be not less than {fraction (1 / 20)} of a period of natural oscillation of an ink-jet head. This suppresses a driving voltage, an amount of generated heat, and dissipated power, which increase when there is a loss due to a resistor component of a charge / discharge system, such as wiring or switching elements, caused by a large current that is flown when the driving voltage rises or falls sharply. The rise time and / or fall time may be made not more than ⅓ of the period of natural oscillation. In this way, 80% or higher efficiency can be ensured for the oscillation energy of piezoelectric elements, which increases as the rise or fall of the driving voltage becomes sharper. Further, the rise time and / or fall time may be set in the vicinity of {fraction (1 / 20)} of the period of natural oscillation. In this way, the ejection energy of the piezoelectric elements can be saturated almost completely. As a result, less driving voltage, less heat, and less power are required to drive piezoelectric elements, which are used in ink-jet recording apparatuses and other types of apparatuses.

A telecommunications satellite stabilized on three axes includes a set of dissipative equipment constituting a payload of the satellite. The satellite includes support data transmission antennas and is substantially parallelepipedal in shape with the panels forming two opposite faces, east and west faces. The panels form two additional opposite faces, north and south faces, and include radiator surfaces on their external faces. The radiator surfaces are configured to cool the electronic equipment of the satellite. The equipment installed on the north and south panels dissipate thermal power corresponding to less than 25% of the total dissipated power.

The invention relates to an electric heating controller and a control method thereof. The electric heating controller comprises an electric heating part, a switch circuit and a drive circuit, and is characterized by further comprising a low-voltage detection circuit and a main control chip MCU (microprogrammed control unit), wherein the switch circuit is used for controlling switching on-off of an alternating current power supply, the drive circuit is arranged on the switch circuit, and the main control chip MCU is at least provided with a timer. The control method of the electric heating controller comprises the following steps of: quickly carrying out switching on-off control of an electric heating part during a shorter period to realize regulation of heating power of the electric heating part; and simultaneously, preventing a flicker effect of a lighting device caused by instant and quick change of power of the electric heating part by utilizing a soft-start and soft-switching-off gradual-change power regulating method in an initial stage and a finishing stage for controlling the switching on-off, and also avoiding uncomfortableness of a user on light change. According to the invention, infinite power regulation can be realized, the comfortable experience of the user is improved, dissipation power of heating of the switch circuit is less compared with that in a chopping scheme, simultaneously a flicker problem is effectively avoided by utilizing soft starting and soft switching-off, and practical application effect is good.

The invention is suitable for the technical field of control, and provides a heating control method, a heating device and a computer storage medium, and the method comprises the steps: calculating a theoretical power value according to a target temperature and a target flow rate in a heating instruction when the heating instruction is monitored; obtaining a dissipation power coefficient, and calculating an actual power value according to the power dissipation coefficient and the theoretical power value; and controlling the heating device to heat according to the actual power value and the target outflow volume in the heating instruction. By means of the method, the heating time of the water dispenser can be effectively shortened, and power consumption is reduced.

The invention relates to a method, a device and magnetic resonance equipment for stabilizing quiescent operating points of radio-frequency amplifiers. The method comprises the following steps: sampling drain current of the radio-frequency amplifier real-timely, calculating a real-time power supply power of the radio-frequency amplifier according to real-timely sampled drain-source electrode voltage of the drain current and the radio-frequency amplifier, calculating the heat dissipation power of the radio-frequency amplifier according to effective power of the radio-frequency amplifier and the calculated real-time power supply power, confirming compensation bias voltage used for eliminating the quiescent operating point drifting due to junction temperature rising of the radio-frequency amplifier according to the heat dissipation power and equivalent thermal resistance of the radio-frequency amplifier, exerting the compensation bias voltage and original bias voltage to a grid-source electrode of the radio-frequency amplifier together, and enabling the quiescent operating points of the radio-frequency amplifier to be kept stable. Through the invention, the stability of the quiescent operating points of RF (Radio Frequency) amplifiers in MR (Magnetic Resonance) equipment can be kept.

Incorporates at least one thermal switch (5) in series with the heating resistor (4) of the module located on the frame (1) of said resistors (4) that cuts off current to the resistor (4) when the heater power control circuit fails. The thermal switch (5) can be between the heating resistor (4) and the earth connection of the support (6), or between the heating resistor (4) and the power supply (3) of the module. The module allows a closed-loop control using as variable the temperature of one of the resistors (4), whose resistivity can change with the temperature. Similarly, the electronic control circuit can also be integrated in the heater frame (1), allowing a closed-loop control of the dissipated power using as control variable the temperature of the frame (1).

The invention discloses a dual-purpose switching circuit for preventing reverse connection and suppressing boot surge current, which comprises a delay circuit, a driving circuit, a switching device and a reverse-connection-proof and surge-suppressing circuit. The output end of the delay circuit is connected with the input end of the driving circuit, the output end of the driving circuit is connected with the switching device, and the anti-reverse connection and surge suppression circuit are connected in parallel with the switching device. The inrush current suppression circuit and the anti-reverse connection circuit are combined together. Compared with the prior art scheme in which the electromagnetic relay is used as the switching element, the circuit is small in size, and and the drive circuit is simple and reliable; Compared with the scheme of controlling the conduction state of the MOS transistor to suppress the inrush current, the circuit is more suitable for medium and high poweroccasions due to the limited dissipation power of the MOS transistor, and does not need to accurately control the conduction state of the MOS transistor. The invention has the characteristics of small volume and simple and reliable driving circuit.

The invention discloses a method for testing node temperature rise of a switch tube in a switch power source and relates to the electric power electronic test technology field. The method for testing node temperature rise of a switch tube in a switch power source comprises the steps of fixing a temperature probe on a switch tube surface shell and collecting device surface temperature Tc; capturing voltage and current waveforms of the switch tube within a single period by using high-precision voltage and current probes through a oscilloscope, automatically generating a power consumption curve, and obtaining dissipation power Ploss; obtaining and completing temperature rise [delta]Tj from the surface shell to a node according to capture of a switching period, a Pon waveform and a Poff waveform in an actual measurement process; obtaining switch tube node temperature Tj; obtaining a result by comparing the switch tube node temperature Tj with a derated standard temperature scope. The method for testing node temperature rise of a switch tube in a switch power source is characterized in that precise, full and accurate properties of test data are realized; authoritativeness of the test data is fulfilled; the method can help determining a test result of a prototype test phase, and the method can help with roduct reliability analysis.