The invention discloses the
chip packaging mode that a large-power LED and a support are solidified through composite iron glue. Firstly, the support is sufficiently cleaned through IPA and ACE, a backside plating reflection layer is led to a large-power LED
chip process according to a DBR technology which is basically introduced in
wafer factories currently, the LED
chip is fixed to the support through the energy-saving and environment-friendly composite iron glue with good heat dissipation effect, after
drying and solidification, electrodes of the LED chip are connected with leading wires of the support, fluorescent
powder is evenly stirred in colloids, the large-power LED chip and pins of the large-power LED chip are wrapped with the fluorescent
powder and the colloids, and then
drying is carried out, the colloids are solidified, and the support is inserted into an
aluminum substrate finally. The method is easy and feasible, saves energy and protects the environment; under the current situation that the DBR backside plating technology is basically utilized in large-power LEDs currently, because silver colloids are replaced by the composite iron glue, packaging cost and effect of
metal in the collides on human bodies and the environment are reduced, and strong economical efficiency and practical value are achieved.