Manufacturing method for insulation structure of power electronic device

Abstract

The invention discloses a manufacturing method for an insulation structure of a power electronic device, and belongs to the technical field of power electronics. The manufacturing method comprises the steps of providing a heat sink, a copper substrate, an insulation layer, a chip and pins; installing the insulation layer at a top part of the copper substrate; installing the chip on the insulation layer; electrically connecting the pins and the chip; and installing the copper substrate on a heat sink. According to the manufacturing method for the insulation structure of the power electronic device, the insulation layer is arranged on the copper substrate, thus, a current generated by the chip cannot be transferred to the copper substrate, the copper substrate is electrically insulated, and correspondingly, the insulation layer is unnecessary to arrange between the copper substrate and the heat sink. With the insulation structure of the power electronic device, manufactured by the method, the heat conduction effect of the copper substrate to the heat sink is better on the condition that the normal use function of the power electronic device is ensured, and the normal use of the power electronic device is more favorably ensured.

Description

technical field [0001] The invention belongs to the technical field of power electronics, and in particular relates to a method for manufacturing an insulating structure of a power electronic device. Background technique [0002] Copper substrate is the most expensive power electronic device among metal substrates. Its thermal conductivity is many times better than that of aluminum substrates and iron substrates. It is suitable for high-frequency circuits and areas with large changes in high and low temperature, as well as heat dissipation of precision communication equipment and architectural decoration industries. . [0003] The copper substrate is a conductive layer, and the copper substrate is usually mounted on a heat sink. In the application of many power electronic devices, the copper substrate needs to be insulated and protected. [0004] In the process of realizing the present invention, the applicant finds that there are at least the following deficiencies in the ...

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Problems solved by technology

[0005] In the prior art, the method of insulating and protecting the copper substrate is usually to install an insulating layer on the side of the copper substrate facing the heat sink. The insulating layer can be a ceramic sheet or an insulating rubber sleeve. Although this method has played a certain role Insulation protection, but it has a great impact on the heat conduction of the copper substrate, affecting the normal use of power electronic devices

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