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252 results about "Absorption edge" patented technology

An absorption edge, absorption discontinuity or absorption limit is a sharp discontinuity in the absorption spectrum of a substance. These discontinuities occur at wavelengths where the energy of an absorbed photon corresponds to an electronic transition or ionization potential. When the quantum energy of the incident radiation becomes smaller than the work required to eject an electron from one or other quantum states in the constituent absorbing atom, the incident radiation ceases to be absorbed by that state. For example, incident radiation on an atom of a wavelength that has a corresponding energy just below the binding energy of the K-shell electron in that atom cannot eject the K-shell electron.

Organic electroluminescence device and method of manufacture

An organic electroluminescence device of the present invention comprises a light emitting layer held between electrodes, the light emitting layer containing at least a host material and a dye or pigment. The light emitting layer further comprises an additive exhibiting an absorption edge of which energy level is higher than that of an absorption edge of the dye or pigment, but the difference of the energy levels being less than 120 kJ / mol, having no lone pair, and including at least two aromatic rings. The additive of the present invention is selected from a group consisting of phenyl-substituted anthracenes, naphthyl-substituted anthracenes, naphthyl-substituted naphthalenes, pyrenes, and a naphthacene derivatives.
Owner:IBM CORP

Method for controlling threshold voltage of semiconductor element

A method for controlling the threshold voltage of a semiconductor element having at least a semiconductor as a component is characterized in including a process to measure one of a threshold voltage and a characteristic value serving as an index for the threshold voltage; a process to determine one of the irradiation intensity, irradiation time, and wavelength of the light for irradiating the semiconductor based on one of the measured threshold voltage and the measured characteristic value serving as the index for the threshold voltage; and a process to irradiate light whose one of the irradiation intensity, irradiation time, and wavelength has been determined onto the semiconductor; wherein the light irradiating the semiconductor is a light having a longer wavelength than the wavelength of the absorption edge of the semiconductor, and the threshold voltage is changed by the irradiation of the light.
Owner:CANON KK

Method for manufacturing semiconductor device or apparatus, and apparatus for manufacturing the same

A method for manufacturing a semiconductor device or apparatus having at least a semiconductor as a component, characterized by including irradiating the semiconductor with light having a longer wavelength than the absorption edge wavelength of the semiconductor to change the threshold voltage of the semiconductor device or apparatus, and checking the threshold voltage of the semiconductor device or apparatus, after or during irradiation with the light, to determine whether the threshold voltage is in a predetermined range, during manufacturing the semiconductor device or apparatus.
Owner:CANON KK

Method for determining the temperature of semiconductor substrates from bandgap spectra

An optical method for measuring the temperature of a substrate material with a temperature dependent band edge. In this method both the position and the width of the knee of the band edge spectrum of the substrate are used to determine temperature. The width of the knee is used to correct for the spurious shifts in the position of the knee caused by: (i) thin film interference in a deposited layer on the substrate; (ii) anisotropic scattering at the back of the substrate; (iii) the spectral variation in the absorptance of deposited layers that absorb in the vicinity of the band edge of the substrate; and (iv) the spectral dependence in the optical response of the wavelength selective detection system used to obtain the band edge spectrum of the substrate. The adjusted position of the knee is used to calculate the substrate temperature from a predetermined calibration curve. This algorithm is suitable for real-time applications as the information needed to correct the knee position is obtained from the spectrum itself. Using a model for the temperature dependent shape of the absorption edge in GaAs and InP, the effect of substrate thickness and the optical geometry of the method used to determine the band edge spectrum, are incorporated into the calibration curve.
Owner:JOHNSON SHANE R +1

Achromatic fresnel optics based lithography for short wavelength electromagnetic radiations

A lithography apparatus having achromatic Fresnel objective (AFO) that combines a Fresnel zone plate and a refractive Fresnel lens. The zone plate provides high resolution for imaging and focusing, while the refractive lens takes advantage of the refraction index change properties of appropriate elements near absorption edges to recombine the electromagnetic radiation of different energies dispersed by the zone plate. This compound lens effectively solves the high chromatic aberration problem of zone plates. The lithography apparatus allows the use of short wavelength radiation in the 1-15 nm spectral range to print high resolution features as small as 20 nm.
Owner:XRADIA

Laser-based method and system for memory link processing with picosecond lasers

A laser-based method of removing a target link structure of a circuit fabricated on a substrate includes generating a pulsed laser output at a pre-determined wavelength less than an absorption edge of the substrate. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target structure to reduce the reflectivity of the target structure and efficiently couple the focused laser output into the target structure to remove the link without damaging the substrate.
Owner:GSI LUMONICS CORP

Aluminophosphate glass containing copper (II) oxide and uses thereof for light filtering

Aluminophosphate glasses containing copper(II) oxide having a low transmission in the near infrared range with a steep absorption edge, as well as a very uniform high transparency in the visible range and excellent chemical durability under conditions of exposure to elevated temperature and high relative humidity, are particularly suitable as filter glasses for use in CCD and CMOS camera and detector applications and as filter glass, e.g., for goggles and color displays. The glass comprising, in % by weight on an oxide basis: 65-80 of P2O5; 4-20 of Al2O3; 0-<5.5 of B2O3, 0-2.1 of La2O3; 0-2.1 of Y2O3, 0-3 of SiO2; >2-12.5 of Li2O; 0-6 of Na2O; 0-4 of K2O; 0-2.5 of Rb2O; 0-2.5 of Cs2O; 0-7.9 of MgO; 0-5 of CaO; 0-5 of SrO; 0-10 of BaO; 0-8 of ZnO; 0-5 ZrO2, 5-15 of CuO; and 0-0.5 of V2O5, wherein the sum of alkaline-earth metal oxides+ZnO (ΣR′O) is <18; and the sum of CuO+V2O5 is 5-15.
Owner:SCHOTT CORP

Lithium mixed metal oxide

A lithium mixed metal oxide containing Li, Mn and M (M represents at least one metal element, and is free from Li or Mn), and having a peak around 1.5 Å (peak A), a peak around 2.5 Å (peak B), and the value of IB / IA is not less than 0.15 and not more than 0.9 in a radial distribution function obtained by subjecting an extended X-ray absorption fine structure (EXAFS) spectrum at K absorption edge of Mn in the oxide to the Fourier transformation, wherein IA is the intensity of peak A and IB is the intensity of peak B.
Owner:SUMITOMO CHEM CO LTD

Method of processing optical device wafer

A method of processing an optical device wafer having an optical device layer including an n-type semiconductor layer and a p-type semiconductor layer stacked over a sapphire substrate, a buffer layer therebetween, allowing peeling of the sapphire substrate. The method includes joining a transfer substrate to the optical device layer, breaking the buffer layer by irradiation with a pulsed laser beam from the sapphire substrate side of the wafer with the transfer substrate joined to the optical device layer, and peeling the sapphire substrate from the optical device wafer with the buffer layer broken, transferring the optical device layer onto the transfer substrate. The pulsed laser beam has a wavelength longer than an absorption edge of the sapphire substrate and shorter than an absorption edge of the buffer layer, and a pulse width set so that a thermal diffusion length will be not more than 200 nm.
Owner:DISCO CORP
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