66results about How to "Suppress electromagnetic radiation" patented technology

In a connector to be mounted to a connection object, an insulating housing holds a first and a second contact and has a receiving portion for receiving and holding a circuit board with an electronic element mounted thereon. The first contact has a first contacting portion to be contacted with a mating connector and a first elastic contacting portion brought into elastic contact with the circuit board. The second contact has a second contacting portion to be connected to the connection object and a second elastic contacting portion brought into elastic contact with the circuit board. Conductive first and conductive second connecting portions are disposed on the circuit board to be connected to the first and the second elastic contacting portions, respectively. In addition, a pair of ground patterns is disposed on the circuit board with the first and the second connecting portions interposed therebetween.

A differential transmission circuit includes a grounded conductive layer, a pair of transmission line conductors, a conductive film and a via hole which connects the grounded conductive layer to the conductive film. The differential transmission circuit further includes a straight-line region which is present in the differential transmission circuit through which a differential transmission signal output by a driving circuit is transmitted and in which the pair of transmission line conductors extends parallel so as to have a first width, and a band rejection filter region in which the pair of transmission line conductors planarly overlaps the conductive film and extends parallel so as to have a second width narrower than the first width and a common mode of the differential transmission signal is attenuated at one of the frequencies which are natural number multiples of a frequency corresponding to the predetermined bit rate.

The invention provides an aerogel composite material with a heat insulation and stealth function and a preparation method of the aerogel composite material, and belongs to the technical field of aerogel composite materials. The aerogel composite material comprises a nano-fiber aerogel matrix layer, a nano-fiber aerogel conductive layer and a nano-fiber aerogel heat insulation layer. According to the invention, under the condition of not using an adhesive, the effective fixation of aerogel particles and the tight combination between the base material and each functional layer can be realized by utilizing the unique hydrophilicity and pore structure of the nanofibers, and the heat insulation performance of the base material layer and the heat insulation layer is utilized; the electromagnetic shielding and controllable heat transmission performance of the conducting layer can achieve the heat insulation and electromagnetic infrared double-shielding synergistic function, and the invention has application prospects in the fields of national defense military industry and functional textiles.

The invention relates to an electromagnetic shielding package body which includes: a substrate; at least two chips which are disposed on the substrate; a shielding body which is made of a shielding gel and covers the chips and separate the chips from one another so as to provide electromagnetic shielding between the chips and the environment and among the chips, wherein the shielding body is grounded through a conductor; and an insulating layer which is made of an insulating gel, wherein the insulating layer is coated to a conductive structure of the chips, in supposedly electrical insulation from the shielding body, and/or is coated to a conductive structure of the substrate, in supposedly electrical insulation from the shielding body, such that the conductive structure and the shielding body are electrically insulated. The invention also relates to a method for manufacturing such electromagnetic shielding package body.

The invention relates to the circuit board wiring technology field and discloses a circuit board, a distribution method of surface-layer high-speed difference lines and communication equipment. The circuit board comprises a routing layer, a grounding metal layer and a dielectric layer located between the routing layer and the grounding metal layer. At least one pair of difference lines and ground lines are formed in the routing layer. Two sides of each pair of the difference lines are provided with the ground lines. In the ground lines of the two sides of each pair of the difference lines, the ground lines and the grounding metal layer are connected through a plurality of via holes. In the via hole corresponding to one side ground line, a distance between each via hole and an edge of one side of the one side ground line is less than 2000 micrometers, wherein the edge faces towards one side of the difference line. A distance between the any two adjacent via holes is less than 2000 micrometers. By using the circuit board, an electromagnetic interference generated by the difference lines during high frequency signal transmission can be reduced.

The invention discloses a circuit board shielding method and the electronic apparatus applying the method. The method comprise: arranging two areas with good connection near the electronic circuit needing shielding on the inner circuit board, connecting shielding wire or thin sheet metal which is exactly upon the electronic circuit. Consequently, by adopting shielding wire or thin sheet metal instead of current metal shielding case, the electromagnetic radiation of the circuit board is inhibited effectively by a simple structure, thereby the invention achieves the evident advantages of good manufacturability and low cost; further more, by arranging inserting structures on both sides of the shielding wire or thin sheet metal, and connecting and fixing with circuit board by inserting, the electronic apparatus maintenance is made more convenient.

A printed wiring board device used for electronic equipment, such as the information equipment, etc. A printed wiring board (10) has a power source layer (11) and a ground layer (12) and is mounted with active elements (3 and 4), such as digital ICs, etc. A first capacitor (1) which conductively couples the layers (11 and 12) with each other at a high frequency is provided in the peripheral section of one end side or the other end side of the section of the board (10) where the layers (11 and 12) are faced to each other. Second capacitors (2) which respectively supply transient currents to the active elements (3 and 4) are provided between the power supply pins (3V and 4V) of the elements (3 and 4) and the ground layer (12) near the elements (3 and 4). Therefore, the electromagnetic radiation caused by the power source layer (11) and the ground layer (12) of the printed wiring board (10) can be suppressed easily and remarkably.

The invention relates to the field of electronic devices, in particular to a miniaturized power divider. The miniaturized power divider comprises two power dividing branches, micro-strip connecting units, a medium plate and a plurality of metal conductive via holes, each power dividing branch comprises a forward circuit and a reverse circuit which are connected through the corresponding micro-strip connecting unit, each forward circuit comprises forward micro-strip-coplanar waveguide transmission units which are connected end to end, and each reverse circuit comprises reverse micro-strip-coplanar waveguide transmission units which are connected end to end; each forward micro-strip-coplanar waveguide transmission unit comprises a micro-strip transmission line section and a coplanar waveguide transmission line section which are connected end to end through the corresponding metal conductive via holes, each micro-strip transmission line section is located at the top of the medium plate, and each coplanar waveguide transmission line section is located at the bottom of the medium plate; each reverse micro-strip-coplanar waveguide transmission unit comprises a micro-strip transmission line section and a coplanar waveguide transmission line section which are connected end to end through the corresponding metal conductive via holes, each micro-strip transmission line section is locatedat the top of the medium plate, and each coplanar waveguide transmission line section is located at the bottom of the medium plate. The miniaturized power divider has the advantages that the double-layer micro-strip-coplanar waveguide Z-shaped cross transmission lines are adopted, and miniaturization of the power divider is achieved.

An electromagnetic shielding structure includes a first shielding material disposed at a first location with respect to at least one radiation source and a second shielding material attached with the first shielding material by fastening means. The second shielding material is disposed at a second location with respect to the at least one electromagnetic radiation source so as to define a predetermined gap between the first shielding material and the second shielding material. The first shielding material shields at least part of first frequency electromagnetic radiations generated from the at least one electromagnetic radiation source and penetrating through the second shielding material and the predetermined gap. The second shielding material shields at least part of second frequency electromagnetic radiations generated from the at least one electromagnetic radiation source.

The invention discloses a Hall sensor device with temperature compensation. The Hall sensor device comprises a power supply circuit, a main Hall sensor circuit, an auxiliary Hall sensor circuit and an output filter circuit; the output end of the auxiliary Hall sensor circuit is used for driving a Hall sensor coil; each Hall sensor circuit comprises a Hall sensor, a voltage limiting circuit, a same-direction proportion circuit and a driving power amplification circuit which are connected in sequence; and the output ends of the two driving power amplification circuits are respectively connected with the output filter circuit. The Hall sensor device has a power supply reverse connection protection function and a function of inhibiting external power supply fluctuation, has a function of reducing power supply ripples, has a same-direction proportion circuit function, has a function of suppressing electromagnetic compatibility, has a function of inhibiting electromagnetic radiation, has a function that a coil magnetic field of the sensor and an external bus are used for forming a closed-loop system, and has a function of automatically compensating the temperature performance is realized.

The invention discloses a millimeter-wave wideband low-sidelobe horn antenna. A rectangular feeding waveguide, a rectangular circular transition segment, a round stepped transition segment, a round radiation aperture surface are sequentially arranged along a transferring direction of an electromagnetic wave to form an electromagnetic radiation region, wherein the rectangular circular transition segment is used for achieving conversion from the rectangular feeding waveguide to the round stepped transition segment, the round stepped transition segment is used for gradually expanding a round aperture surface of the last stage of the rectangular round transition segment to the tail-stage aperture surface by a plurality of steps, and a matching segment is extended from the tail-stage aperture surface at equal width to form the round radiation aperture surface. The horn antenna employs a stepped transition radiation segment to substitute a continuous transition radiation segment, a structureof a wave limitation groove is integrated at the periphery of the radiation aperture surface, the proposed antenna has the integrated structure characteristic and can be implemented purely by a conventional mechanical processing technology, other complicated processed are not needed to help, subsequent splicing assembly is not needed, the product consistency is good, and a single piece is low incost, wide in frequency band and low in radiation sidelobe.