A W-band millimeter wave chip multilayer dielectric substrate comprises a first ground layer, a first dielectric layer, a second ground layer, a second dielectric layer, a control layer, a third dielectric layer, a power supply layer, a fourth dielectric layer, a third ground layer, a fifth dielectric layer, a radio frequency layer, a sixth dielectric layer, a fourth ground layer, a seventh dielectric layer and an antenna layer. The fourth ground layer is connected with the second end of the radio frequency layer through a vertical through hole; the first end of the radio frequency layer is connected with the third ground layer, the power supply layer, the control layer, the second ground layer and the first ground layer through vertical through holes; the radio frequency layer is of a multi-section microstrip line structure with different impedances. The structure of the metal layer is reasonably planned, the radio frequency layer is arranged between the two ground layers, and the shielding columns are arranged around the signal transmission structure, so that high-density wiring is carried out between the same layer or different layers while the anti-interference performance of radio frequency signals is guaranteed, and the dielectric substrate is suitable for the application scene of the antenna and chip integrated packaging interconnection structure. And the requirements of complex functions, high integration level and light weight at present are met.