238results about How to "Reduce attachment" patented technology

A method and system is directed to providing authentication of a message, such as email, and the like, by combining Public Key encryption and the Internet Domain Name System (the “DNS”). A domain owner may validate that an email originates from an authorized sender within their domain by using a private key component to digitally sign email outbound from its domain. Employing a public key component, along with a selector, an email recipient may check the validity of the signature, and thus determine that the email originated from a sender authorized by the domain owner. In one embodiment, the public key component used to verify an email signature may be “advertised” or otherwise made available via a TXT record in the DNS.

Methods for altering the N-glycosylation pattern of proteins in higher plants are provided. The methods comprise introducing into the plant a recombinant construct that provides for the inhibition of expression of α1,3-fucosyltransferase (FucT) and β1,2-xylosyltransferase (XylT) in a plant. Use of these constructs to inhibit or suppress expression of both of these enzymes, and isoforms thereof, advantageously provides for the production of endogenous and heterologous proteins having a “humanized” N-glycosylation pattern without impacting plant growth and development. Stably transformed higher plants having this protein N-glycosylation pattern are provided. Glycoprotein compositions, including monoclonal antibody compositions, having substantially homogeneous glycosylation profiles, and which are substantially homogeneous for the G0 glycoform, are also provided.

A stage apparatus in which a rectangular substrate which is levitated over a stage is transferred such that a pair of sides of the rectangular substrate are substantially parallel to a transfer direction and the other pair of sides of the rectangular substrate are substantially perpendicular to the transfer direction. The stage includes a plurality of gas spray ports to spray a gas and a plurality of suction ports to attract the rectangular substrate by suction. The rectangular substrate is levitated at a predetermined height from the surface of the stage in a substantially horizontal posture by means of suction of a suction mechanism through the plurality of suction ports and gas spray of a gas spray mechanism through the plurality of gas spray ports. The plurality of suction ports are arranged on the stage such that, when the rectangular substrate is being transferred over the stage, the leading end of the rectangular substrate in the transfer direction does not simultaneously cover not less than a predetermined number of suction ports and the trailing end of the rectangular substrate in the transfer direction does not simultaneously open not less than a predetermined number of suction ports to the atmosphere, so as for variations in suction pressure in the suction ports to fall within an allowable range.

Orthodontic attachment devices for interacting with an orthodontic appliance are described. Described herein are orthodontic attachment devices that include one or more features to improve the bonding to the teeth, improve the appearance of the orthodontic attachment device, improve the transfer of force from the orthodontic appliance to the tooth / teeth, improve the connection between the orthodontic attachment device and the orthodontic appliance, improve the ease and ability of removal of the appliance from the teeth, reduce the weight of the orthodontic attachment device, increase the stability of the connection of the orthodontic attachment device on the tooth, and / or reduce the number of steps for applying the orthodontic attachment device to the patient's teeth.

A leadless plastic chip carrier is fabricated by selectively etching a leadframe strip to reduce a thickness of the strip at a portion thereof. Selectively masking the surface of the leadframe strip using a mask, follows selectively etching, to provide exposed areas of the surface at the portion and contact pad areas on leadframe the strip. At least one layer of metal is deposited on the exposed areas to define a die attach pad on the portion of the leadframe strip with reduced thickness and to define contact pads on the surface of the strip. At least one semiconductor die is mounted to the die attach pad, followed by wire bonding the at least one semiconductor die to ones of the contact pads. The at least one semiconductor die, the wire bonds, and the contact pads are covered with an overmold material and the leadframe strip is etched to thereby remove the leadframe strip. The leadless plastic chip carrier is singulated from the leadframe strip.

A heating apparatus 2 comprises a housing 20; a flat heating chamber 4 which is provided in the housing 2 and adapted to heat a wafer W used as a substrate, with one side of the heating chamber 4 opening for carrying in and carrying out the wafer; and a heating plates 44, 45 provided in the heating chamber 4 such that the wafer W can be heated from both above and below. A cooling plate 3 is provided in the housing 20 located in the vicinity of the opening of the heating chamber 4, for cooling the wafer W after being heated by the heating plates 44, 45. Additionally, a carrying means is provided in the housing 20 for carrying the wafer W between an upper position of the cooling plate 3 and the interior of the heating chamber 4 such that a heat treatment for the wafer W can be performed with the wafer W being held in the heating chamber 4.

A mask frame assembly for depositing a deposition material on a deposition substrate comprises a mask frame including an opening and frames surrounding the opening, and a mask coupled on the mask frame. A deformation prevention unit is formed on at least one region of the mask. Since the deformation prevention unit is formed on a peripheral portion of a deposition pattern in the mask, deformation of the mask in a vertical direction may be reduced. Accordingly, defective attaching of the mask to the substrate may be reduced.