40results about "Conductive material electric discharge removal" patented technology

A flexible printed circuit is described that includes a flexible supporting substrate having a first face and a second face. A conductive material is deposited by vacuum deposition on at least one of the first face or the second face of the flexible supporting substrate. A flexible conductive circuit is formed on the conductive material by electrical discharge machining. The flexible conductive circuit defines a plurality of electrical component placement circuits to which electrical components may be attached. The flexible printed circuit can be rolled or folded. The flexible printed circuit can also be made in sizes much larger than is currently possible with other competing technologies.

The invention provides an electrolytic regeneration device, wherein, a regeneration unit (19) includes a tubular portion (23) having the inner circumferential surface (31) functioning as an anode, and a cathode (25) provided inside the tubular portion and extending along the extension direction of the tubular portion in a state of separation from the inner circumferential surface. The treatment liquid used for desmearing treatment is fed through a gap between the inner circumferential surface (31) of the tubular portion (23) and the cathode (25). A feed-side conduit (15) is connected by a downstream end portion (15b) thereof to the tubular portion (23) and guides the treatment liquid discharged from a desmearing treatment tank (13) into a regeneration unit (19). A return-side conduit (17) is connected by an upstream end portion (17a) thereof to the tubular portion (23) and guides the treatment liquid discharged from the regeneration unit (19) into the desmearing treatment tank (13). Via the above way, the electrolytic regeneration device is capable of realizing miniaturization and reducing total liquid amount.

A circuit board is provided with an insulating substrate (1) and a circuit (3) formed on the insulating substrate (1). The circuit is provided with a plated base layer (4) whereupon a pattern is formed by irradiating a metal thin film (2) applied on a surface of the insulating substrate (1) with a laser beam (L) along the profile of the circuit (3) and partially removing the metal thin film (2) from the profile of the circuit (3). The circuit is also provided with a Cu-plated layer (5), an Ni-plated layer (6) and an Au-plated layer (7), which are formed by metal plating, on a surface of the plated base layer (4) in this order from the side of the plated base layer. Between the Ni-plated layer (6) and the Au-plated layer (7), a first intermediate plated layer (8) having a less noble metal than Au with respect to reference electrode potential is formed in contact with the Au-plated layer, and a second intermediate plated layer (9) having a more noble metal than the metal in the first intermediate plated layer with respect to the reference electrode potential is formed in contact with the first intermediate plated layer (8).

By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure fineness of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer (4). This photosensitive paste layer (4) is plotted by a laser beam (8) so as to form a plotted area (7). The photosensitive paste layer (4) is developed and an exposed area (4a) or an unexposed area (4b) is removed so as to form a circuit pattern (17). This circuit pattern (17) is sintered to form a circuit pattern (20) composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a greensheet (2) is used as the substrate, it is possible to form a ceramic substrate (18) having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object.

The invention relates to a method for embedding at least one component into a printed circuit board, comprising the steps of providing a lower metallic conductor foil (1) applied on a first metallic supporting layer (2), forming recessed alignment marks (3) in the conductor foil (1), applying an adhesive layer (4) in a registered manner in relation to the alignment marks (3), and placing a component (5) with the rear side thereof on the adhesive layer (4) with connection areas (6) facing upwards, curing the adhesive layer, embedding the component (5) into an insulating layer (11), applying a metallic upper conductor foil (9) and an upper metallic supporting layer (10), consolidating the construction, removing the supporting layers (2, 10), exposing the alignment marks (3) of the lower conductor foil (1) by removing the insulating layer (11), producing cutouts (12) ending at the lower conductor foil (1), producing holes (13) to the connection areas (6) of the component (5) in a registered manner in relation to the alignment marks, and applying a conductor layer to the top side of the construction, producing contact-connections (14) in the holes (13) to the connection areas (6) of the component (5), and structuring the conductor layer for producing conductor tracks (15).

The invention provides a process for producing a glass substrate (10) having a circuit pattern (26), which includes a circuit pattern formation step of forming a thin film layer (12) on a glass substrate and then irradiating the thin film layer with laser light (22) to form a circuit pattern on the glass substrate; a low-melting point glass deposition step of depositing a low-melting point glass (28) having a softening point of from 450 to 630° C. on the glass substrate having the circuit pattern formed thereon; and a sintering step of sintering the low-melting point glass to form a low-melting point glass layer (32) comprising the low-melting point glass sintered on the glass substrate having the circuit pattern formed thereon and to form a compatible layer (34) between the glass substrate and the low-melting point glass layer.

A process is described in which surfaces of foamed plastics are provided with electrical conductor tracks, with the aid of selectively ablating processes.

The process permits low-cost production of moldings from plastic with conductor tracks integrated on the surface.

The products of the process may be used in the electrical and electronics industries, for example.

A circuit board comprising a resin molded article which includes a metal powder coated by an insulation film and a metal conductor which is formed by metal deposition over a circuit pattern drawn by laser beam irradiation on the surface of the resin molded article through electroless plating, and the method of producing the same.

The invention discloses double-position alternating type numerical control high-speed printed circuit board electric spark etching equipment, belongs to the field of circuit boards, and solves the problems that in the prior art, when conductive materials of a printed circuit board are etched in an electric spark mode, generated impurities are partially mixed in a liquid medium and partially attached to the surface of the circuit board, impurities need to be removed after the circuit board is taken out, and etching is interrupted when an electrode tip needs to be replaced in the assembling process in the etching process. When the liquid medium is discharged, the liquid medium is dragged to perform one-way surging, on one hand, impurities mixed with the liquid medium are dragged to surge away from the circuit board and be discharged along with the liquid medium, and on the other hand, the impurities attached to the surface of the printed circuit board are slightly brushed to be separated from the surface of the circuit board and discharged along with the liquid medium. Through cooperation of the two etching mechanisms, electrode tip replacement is achieved, and the etching process is uninterrupted.

The invention provides a printed circuit board and a method of manufacturing the same. The printed circuit board includes an insulating layer and a circuit layer disposed on the insulating layer. The circuit layer includes a first circuit pattern and a second circuit pattern. Each of the first circuit pattern and the second circuit pattern has a first side surface, a second side surface opposite to the first side surface, and a top surface connected to an end of the first side surface and an end of the second side surface when viewed from a cross section. The first side surface of the first circuit pattern and the first side surface of the second circuit pattern face each other. A height of the first side surface of the first circuit pattern is greater than a height of the second side surface of the first circuit pattern, and a height of the first side surface of the second circuit pattern is greater than a height of the second side surface of the second circuit pattern.