31results about How to "Improve transistor characteristics" patented technology

A manufacturing method of a thin film transistor having at least a gate electrode, a gate insulation film, an oxide semiconductor layer, a first insulation film, a source electrode, a drain electrode, and a second insulation film on a substrate, including: forming the gate electrode on the substrate; forming the gate insulation film on the gate electrode; forming a semiconductor layer including amorphous oxide on the gate insulation film; patterning the gate insulation film; patterning the oxide semiconductor layer; reducing the oxide semiconductor layer in resistance by forming the first insulation film on the oxide semiconductor layer in the atmosphere not including an oxidized gas; patterning the first insulation film and forming a contact hole between the source electrode and the drain electrode and the oxide semiconductor layer; forming a source electrode layer and a drain electrode layer in the oxide semiconductor layer through the contact hole; forming the source electrode and the drain electrode through the contact hole and allowing the first insulation film to be exposed; patterning the exposed first insulation film and allowing a channel region of the oxide semiconductor layer to be exposed; and increasing the channel region in resistance by forming the second insulation film on the surface including the channel region of the oxide semiconductor layer in the atmosphere including an oxidized gas.

Aspects of the invention can provide a thin-film transistor having good transistor characteristics and operable with a low driving voltage, a method of producing such a thin-film transistor, a high-reliability electronic circuit, a display, and an electronic device. In an exemplary thin-film transistor according to the invention, a gate electrode can be formed on a substrate via an underlying layer, and a gate insulating layer can be formed on the substrate such that the gate electrode is covered with the gate insulating layer. A source electrode and a drain electrode are formed on the gate insulating layer such that they are separated from each other by a gap formed just above the gate electrode. An organic semiconductor layer can be formed thereon such that the electrodes are covered with the organic semiconductor layer. A region between the electrodes of the organic semiconductor layer functions as a channel region. A protective layer can be arranged on the organic semiconductor layer. This thin-film transistor is characterized in that the organic semiconductor layer is formed after the gate insulating layer is formed, and the gate insulating layer has the capability of causing the organic semiconductor layer to be aligned.

A semiconductor device with p-channel MOS transistor having: a gate insulating film of nitrogen-containing silicon oxide; a gate electrode of boron-containing silicon; side wall spacers on side walls of the gate electrode, comprising silicon oxide; an interlayer insulating film having a planarized surface; a wiring trench and a contact via hole formed in the interlayer insulating film; a copper wiring pattern including an underlying barrier layer and an upper level copper region, and filled in the wiring trench; and a silicon carbide layer covering the copper wiring pattern. A semiconductor device has the transistor structure capable of suppressing NBTI deterioration.

A thin-film transistor includes a source electrode, a drain electrode arranged apart from the source electrode, an organic semiconductor layer arranged between the source electrode and the drain electrode so as to establish connection of the source electrode and the drain electrode, a first insulating layer arranged on one surface side of the organic semiconductor layer, a gate electrode arranged on a side of the first insulating layer opposite that on which the organic semiconductor layer lie, and a second insulating layer arranged on a side of the organic semiconductor layer opposite that on which the first insulating layer lie. The organic semiconductor layer contains an organic semiconductor material having p-type semiconducting properties. The second insulating layer contains one or more compounds of the following formula (1), so that electrons are fed from the second insulating layer into the organic semiconductor layer:wherein R1 and R2 independently represent a substituted or unsubstituted alkylene group; X1, X2, X3 and X4 each represent a hydrogen atom or an electron-donating group; and n represents 100 to 100,000, wherein at least one of X1, X2, X3 and X4 represents an electron-donating group.