The invention relates to a
semiconductor packaging structure comprising a
dielectric layer, a
metal layer, a plurality of
metal posts,
semiconductor chips and packaging
colloid, wherein the
metal is arranged on the
dielectric layer and comprises a
chip accommodating
gasket and a plurality of path lines, each
path line comprises a line body, a welded
gasket extending to the periphery of the
chip accommodating
gasket and an opposite
path line terminal; each metal post passes through the
dielectric layer, one end of each metal post is connected with the
chip accommodating gasket and the respective
path line terminal, and the other end of the metal post protrudes out of the
dielectric layer; the
semiconductor chips are arranged on the chip accommodating gasket and electrically connected with the respective welded packets; and the packaging
colloid is used for covering the semiconductor chips,
welding wires, the metal layer and the
dielectric layer. In the semiconductor packaging structure, a chip accommodating side is provided with the path lines with the welded gaskets, so that the
welding wires are not too long and are prevented from cross and tightness, and a phenomenon of solder bridge is difficult to generate when the semiconductor packaging structure is welded to a circuit board because the metal posts protrude out of the bottom surface of the
dielectric layer. The inventionalso provides a making method of the semiconductor packaging structure.