36results about How to "Shorten the connection path" patented technology

A semiconductor package substrate with embedded chip and a fabrication method thereof are provided. A first insulating layer is applied on a metallic board, and formed with at least one opening for exposing a portion of the metallic board. At least one semiconductor chip is mounted on the exposed portion of the metallic board. A support plate is mounted on the first insulating layer, and formed with a through cavity at a position corresponding to the opening of the first insulating layer, for receiving the chip in the through cavity. A second insulating layer is applied on the chip and the support plate. Insulating materials of the insulating layers fill a gap between the chip and the support plate. A circuit layer is formed on the second insulating layer, wherein the circuit layer is electrically connected to the chip by conductive structures formed in the second insulating layer.

A semiconductor package substrate with embedded chip and a fabrication method thereof are provided. A first insulating layer is applied on a metallic board, and formed with at least one opening for exposing a portion of the metallic board. At least one semiconductor chip is mounted on the exposed portion of the metallic board. A support plate is mounted on the first insulating layer, and formed with a through cavity at a position corresponding to the opening of the first insulating layer, for receiving the chip in the through cavity. A second insulating layer is applied on the chip and the support plate. Insulating materials of the insulating layers fill a gap between the chip and the support plate. A circuit layer is formed on the second insulating layer, wherein the circuit layer is electrically connected to the chip by conductive structures formed in the second insulating layer.

A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

A semiconductor package and a fabrication method are disclosed. The fabrication method includes applying a sacrificial layer on one surface of a metal carrier, applying an insulation layer on the sacrificial layer, and forming through holes in the sacrificial layer and the insulation layer to expose the metal carrier; forming a conductive metallic layer in each through hole; forming a patterned circuit layer on the insulation layer to be electrically connected to the conductive metallic layer; mounting at least a chip on the insulation layer and electrically connecting the chip to the patterned circuit layer; forming an encapsulant to encapsulate the chip and the patterned circuit layer; and removing the metal carrier and the sacrificial layer to expose the insulation layer and conductive metallic layer to allow the conductive metallic layer to protrude from the insulation layer. In the present invention, the distance between the semiconductor package and the external device is increased, and thermal stress caused by difference between the thermal expansion coefficients is reduced, so as to enhance the reliability of the product.

A vehicle includes a motor housing accommodating motors for driving wheels, and a power control unit fixed on the motor housing. The power control unit includes: a stacked unit in which multiple power modules accommodating power semiconductor elements for electric power conversion and multiple coolers are stacked; and reactors. The stacked unit is disposed in the case of the power control unit such that the stacking direction of the power modules and the coolers is directed toward the vehicle-longitudinal direction. The reactors are disposed in the case so as not to overlap with the stacked unit as viewed from the stacking direction.

A prismatic sealed battery has a prismatic battery case (3) which includes a plurality of prismatic containers (4) coupled in a row via partitions (5), electrode plate assemblies (8), and collectors (10) which are joined to lead portions on both sides of the electrode plate assemblies (8). Each container (4) contains the electrode plate assembly (8) to which said collectors 10 are joined. An opening (21) is formed in at least one side wall (20) of the prismatic battery case (3) and in a position where each partition (5) is disposed, in such a manner as to face the containers (4) on both sides, and a conductive connection member (23) disposed in the opening (21) is connected to the collectors (10, 10) on both sides of the partition (5). Since the current-carrying path between the electrode plate assemblies (8) becomes short, internal resistance decreases, and hence internal resistance per cell (2) is reduced. Even and full use of the whole electrode plate assembly (8) achieves higher power output.

An electronic device is provided, in which semiconductor components are structurally identical among one another and have two groups of contact connections arranged on opposite main areas on a printed circuit board. Components are arranged in a manner laterally offset in a direction parallel to the printed circuit board area in such a way that, on opposite main areas, a group of first contact connections of a semiconductor component fitted on one main area is in each case arranged in the same region of the printed circuit board as a group of first contact connections of a semiconductor chip arranged on the opposite main area. Likewise, the groups of second contact connections of the semiconductor chips arranged on opposite main areas in each case attain congruence.

The utility model provides a battery pack which is provided with a battery (1), a circuit board (5) and an end part shell (6), wherein the circuit board (5) is provided with a charge and discharge protecting circuit, and is arranged on the end surface (3) of the battery; the end part shell (6) is provided with an external connecting terminal (7); the circuit board (5) is contained and arranged in the inside of the end part shell (6), both ends of the end part shell (6) are respectively combined with a head part (12a), and penetrated screws (12) are fixedly screwed in both ends of the end surface (3) of the battery (1) so as to fix the end part shell (6). The utility model realizes the battery pack which has the advantages of compact structure, small connecting resistance, high reliability and high productive efficiency.

A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess.

An external heat exchanger and the accumulator tank are disposed in the circulation path of a heat medium. In the air conditioner for a vehicle, the external heat exchanger is disposed in a sideways position between member front ends of a pair of left and right side members, extending in the vehicle longitudinal direction, with the heat-exchanging surface facing forward in the vehicle. The accumulator tank is disposed in a front corner area that is formed in a position that is to the outside in the vehicle width direction from the member front end of one side member of the pair of left and right side members, and that is in front of a vehicle wheel house covering a front tire.

A chip package including a semiconductor substrate is provided. A recess is in the semiconductor substrate and adjoins a side edge of the semiconductor substrate, wherein the semiconductor substrate has at least one spacer protruding from the bottom of the recess. A conducting layer is disposed on the semiconductor substrate and extends into the recess.

The invention relates to a semiconductor device and a forming method thereof. The semiconductor device comprises: a substrate which comprises a unit region and a peripheral region; a first interlayer insulating layer and a second interlayer insulating layer which are formed on the substrate in the unit area and the peripheral area, wherein the first interlayer insulating layer and the second interlayer insulating layer are arranged at intervals in the direction perpendicular to the substrate; a columnar capacitor array comprising columnar capacitors which are arranged at intervals, wherein the columnar capacitors are formed in the first interlayer insulating layer and the second interlayer insulating layer of the unit area; and a contact structure formed in the first interlayer insulating layer and the second interlayer insulating layer of the peripheral region. According to the invention, the contact structure is arranged in the first interlayer insulating layer and the second interlayer insulating layer, so that the connection path of the contact structure can be effectively shortened, the space of the columnar capacitor array is effectively utilized, the arrangement density of each structure in the semiconductor device is improved, and the integration level of the semiconductor device is improved.

The present disclosure provides a power cord plug, a power cord structure and an electrical device for a power cord, and the power cord plug includes: a shell, and a communication device and an antenna arranged in the shell. According to the power cord plug provided by the present disclosure, as the communication device and the antenna are arranged in the shell of the power cord plug, the communication device is far away from the electrical device, so the communication ability of the communication device will not be shielded by the metal shell of the electrical device, and will not be affected by a motor, a circuit board, coils, a magnetron and other factors in the electrical device, or affected by the high temperature caused by the operation of the equipment, accordingly the communication device works in a good environment, and the working reliability and stability of the communication device are guaranteed.

A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. A first copper layer and a second copper layer are in turn deposited over the dielectric material layer and solder materials, and the first and second copper layers are patterned to form a plurality of conductive traces each of which has a terminal coated with a metal layer. A chip is mounted on the conductive traces and electrically connected to the terminals by bonding wires, with the dielectric material layer and solder materials being exposed to the outside. This package structure can flexibly arrange the conductive traces and effectively shorten the bonding wires, thereby improve trace routability and quality of electrical connection for the semiconductor package.

The utility model provides a battery pack which is provided with a battery (1), a circuit board (5) and an end part shell (6), wherein the circuit board (5) is provided with a charge and discharge protecting circuit, and is arranged on the end surface (3) of the battery; the end part shell (6) is provided with an external connecting terminal (7); the circuit board (5) is contained and arranged in the inside of the end part shell (6), both ends of the end part shell (6) are respectively combined with a head part (12a), and penetrated screws (12) are fixedly screwed in both ends of the end surface (3) of the battery (1) so as to fix the end part shell (6). The utility model realizes the battery pack which has the advantages of compact structure, small connecting resistance, high reliability and high productive efficiency.

A semiconductor package includes a first substrate, a second substrate, a conductive component, an electronic component and a passive component. The conductive component is disposed between the first substrate and the second substrate, and the first substrate and the second substrate are separated from each other by an interval. The electronic component and the passive component are disposed within the interval. In this way, a conductive path between the electronic component and the passive component is shorter, a connection path between the electronic component and the passive component can be shortened, and signal transmission is faster.

The invention provides a groove type MOSFET device and a preparation method thereof. According to the groove type MOSFET device, the metal connecting part is arranged in the groove and located on the insulating layer, and the metal connecting part penetrates through the insulating layer at the bottom of the groove, a grid electrode and a gate oxide layer, so that an electric field protection part can be directly connected with the source electrode through the metal connecting part, namely, the electric field protection part is connected with the source electrode in a metal interconnection mode. The arrangement can greatly reduce the connection path, reduce the resistance, and finally improve the switching response of the device.

The invention relates to a laminated busbar structure suitable for parallel connection and modular application of discrete devices, belonging to the technical field of semiconductor devices. The laminated busbar includes an AC output busbar, a positive busbar and a negative busbar, wherein the negative busbar is used to connect the power device of the lower bridge arm and the negative terminal of the capacitor module, and the positive busbar is used to connect the power device of the upper bridge arm As well as the positive terminal of the capacitor module, the AC output busbar is connected to the positive busbar through the power device of the upper bridge arm, and connected to the negative busbar through the power device of the lower bridge arm. A laminated busbar structure suitable for parallel connection is formed by combining multiple laminated busbar units and multiple sets of discrete devices, which reduces the parasitic inductance and the difference in inductance of each branch is small, and can be reduced by increasing the number of devices in the vertical direction It is suitable for various current levels, and the entire busbar structure can be copied horizontally to form a three-phase system, which is convenient for assembly and maintenance. This modular feature makes the patented busbar structure more widely applicable.

The invention discloses a sealing apparatus, a bipolar battery and a single battery. The sealing apparatus comprises a groove body, soft adsorption strips and a sealing upper cover which covers the upward side of the groove body; the groove body comprises two oppositely arranged groove walls; a groove wall positioning groove is formed in each of the two ends of each groove wall separately; a liquid binder is adsorbed and cured in each soft adsorption strip; the two ends of each soft adsorption strip are embedded into a pair of groove wall positioning grooves with opposite groove openings; multiple soft adsorption strips which are embedded into the groove wall positioning grooves in a stacked manner and the groove wall positioning grooves form a sealing end cover on the port of the groove body; the soft adsorption strips and the groove wall positioning grooves, the adjacent soft adsorption strips, the soft adsorption strip on the uppermost layer and the sealing upper cover, and the softadsorption strip on the lowest layer and the groove bottom are all in interference fit; and the groove body, the sealing end cover and the sealing upper cover form a sealed space. By virtue of the sealing apparatus, the connecting path of the adjacent single batteries can be greatly shortened, thereby lowering the internal resistance of the batteries, controlling temperature rise of the batteries, and further improving the discharging performance and prolonging the service life of the batteries.

An external heat exchanger and the accumulator tank are disposed in the circulation path of a heat medium. In the air conditioner for a vehicle, the external heat exchanger is disposed in a sideways position between member front ends of a pair of left and right side members, extending in the vehicle longitudinal direction, with the heat-exchanging surface facing forward in the vehicle. The accumulator tank is disposed in a front corner area that is formed in a position that is to the outside in the vehicle width direction from the member front end of one side member of the pair of left and right side members, and that is in front of a vehicle wheel house covering a front tire.

The invention discloses a sealing device, a bipolar battery and a single battery. The sealing device includes: a tank body, a soft adsorption strip and a sealing upper cover arranged above the tank body. The tank body includes two oppositely arranged tank walls, each Both ends of each groove wall are provided with a groove wall positioning groove; the liquid adhesive is adsorbed and solidified in the soft adsorption strip, and the two ends of the soft adsorption strip are embedded in a pair of groove wall positioning grooves opposite to the notch. The soft adsorption strip embedded in the positioning groove of the groove wall and the sealing end cover of the port of the groove body are formed by stacking the soft adsorption strip embedded in the positioning groove of the groove wall, and the soft adsorption strip and the positioning groove of the groove wall, between adjacent soft adsorption strips, and the uppermost layer The soft adsorption strips of the top layer and the sealing upper cover, and the soft adsorption strips of the lowermost layer are all interference fit with the bottom of the tank; the tank body, the sealing end cover and the sealing upper cover form a sealed space. The sealing device can greatly shorten the connection path of adjacent cells, thereby reducing the internal resistance of the battery, suppressing the temperature rise of the battery, and further improving the discharge performance and service life of the battery.

The invention relates to a half bridge module 1 in a traction inverter for a power electronics unit in an electric or hybrid vehicle, comprising a substrate 3, semiconductor switching elements 4 on a first side 3a of the substrate 3, power connections 9, to which power lines that conduct electrical traction energy can be connected, signal connections 10, to which signal lines can be connected for switching the semiconductor switching elements 4, and a casting compound 12, which encompasses the substrate 3 and the semiconductor switching elements 4 on the first side 3a of the substrate 3, wherein the power connections 9 and the signal connections 10 can all be accessed from the first side 3a of the substrate 3, such that the power connections 9 and the signal connections 10 extend through the casting compound 12, seen from the first side 3a of the substrate 3, and are located within a base area spanning the substrate 3, seen from the direction they pass through the casting compound 12.

The invention provides a power module. The power module comprises a transformer, a first switch unit and a second switch unit; the transformer comprises a magnetic core and a flat winding wrapping a wrapping post of the magnetic core; the flat winding comprises a first winding, the first end of the first winding is electrically connected with the first switch unit and located on the first side face of the wrapping post, and when viewed in the direction perpendicular to the first side face, the projections of the first switch unit, the first end of the first winding and the wrapping post on thefirst side face are overlapped; and the second end of the first winding is electrically connected with the second switch unit and located on the second side face of the wrapping post, and the projections of the second switch unit, the second end of the first winding and the wrapping post on the second side face are overlapped when viewed in the direction perpendicular to the second side face. According to the power module provided by the invention, the winding loss is reduced, the occupied area of the power module is reduced, and the heat dissipation effect is improved.