308results about How to "Easy to rework" patented technology

An optical fiber connector includes a connector housing, a ferrule and a clamping assembly. The connector hosing has a front end and a rear end. The ferrule is disposed in the connector housing and projects from the front end of the connector housing. The clamping assembly is disposed in the connector housing for mounting the ferrule, and includes a hollow housing and a cam member, wherein the cam member includes a groove adapted to clamp a terminating fiber when a cam effect between the hollow housing and the cam member is generated and further the cam effect causes the groove of the cam member to generate a clamping force.

The invention provides an insulating and heat-conducting double-sided adhesive tape and a preparation method thereof. In the insulating and heat-conducting double-sided adhesive tape, the outer layers on both sides are release paper, and a single layer of insulating and heat-conducting adhesive is arranged between the two layers of release paper. Or the outer layers on both sides are release paper, a single-layer substrate is arranged between the two layers of release paper, and an insulating and heat-conducting adhesive is arranged between the substrate and the release paper. The preparation method is as follows: mixing heat-conducting medium and solvent, adding insulating heat-conducting glue, stirring, coating and drying, and the preparation is completed. The adhesive tape of the invention has the advantages of good thermal conductivity, electrical insulation, stability at room temperature, easy die-cutting, reworkable characteristics, and easy operation.

A coupler for interfacing a light source, such as a laser, and a fiber optic cable is disclosed. The coupler includes a slide mount having a channel that is adapted to receive optical fibers. The channel extends from a proximal end of the slide mount to a distal end of the slide mount. The proximal end of the slide mount is adapted to fit into an aperture of the light source and the distal end of the slide mount is adapted to transmit light to the fiber optic cable. The coupler also includes a clamp that is mounted on the slide mount adjacent to its proximal end. The clamp covers at least a portion of the channel, thereby securing the optical fibers within the channel without the use of an adhesive.

A modularized probe head for modularly assembling on a probe card is configured for probing a semiconductor wafer under test. The probe head includes a silicon substrate having an active surface and an opposing back surface. The back surface of the silicon substrate is attached on a holder. The silicon substrate has a plurality of peripheral bond pads and contact pads on its active surface. At least a probing chip is mounted on the active surface of the silicon substrate. The probing chip has probing tips and side electrodes. The side electrodes are connected with the contact pads by means of solder material. The peripheral bonding pads of the silicon substrate are connected with a flexible printed circuit for electrically connecting to a multi-layer printed circuit board of a probe card.

The present invention relates to an intelligent test device for a substrate, comprising a main case, a detection turntable, a feeding mechanism, a contact detection mechanism for testing the OFF-pressure of contacts from spring pieces, a discharging mechanism and an electric control box, the detection turntable, the feeding mechanism, the contact detection mechanism and the discharging mechanism being all ON-connected to the electric control box. The test device of the present invention can complete the OFF-pressure detection of the longitudinal and transverse contacts of the substrate automatically without requiring any manual operation, thus the test device of the present invention is easy to use, and the detection accuracy and the detection efficiency are high. Furthermore, the ex-factory pass rate of products is guaranteed, the cost is reduced and defective substrates can be classified and sorted automatically.

The invention discloses a mobile environment-friendly paint spraying booth in the technical field of paint spraying. The paint spraying booth comprises a paint spraying booth body and a transport vehicle; an inner cavity of the paint spraying booth body is divided by a dividing plate into a paint spraying chamber located on the right side and a drying chamber located on the left side; a driving mechanism is mounted in the center of the inner wall of the top of the paint spraying chamber; a dust sensor is mounted on the back side of the inner wall of the top of the paint spraying chamber; the top end of a filtering box is connected with the bottom end of an air inlet pipe; the top end of the air inlet pipe extends to the top of an inner cavity of the paint spraying chamber; an air inlet cover is mounted at the top end of the air inlet pipe; and the bottom of a hydraulic cylinder I is connected with a detecting mechanism through a telescopic rod I. According to the paint spraying booth,an upper paint spraying pipe cooperates with side paint spraying devices on two sides, clamped workpieces are rotated by 180 degrees by two rotation motors, and two-side paint spraying is performed onthe workpieces, so that the paint spraying efficiency for the workpieces is improved effectively; and the workpieces after paint spraying are dried by the aid of a fan with heat produced by a heatingresistance wire II during working, so that environmental pollution caused by waste gas and waste liquids which are produced during paint spraying is avoided.

A layered chip package includes: a main body including a plurality of layer portions; wiring disposed on a side surface of the main body; a plurality of first terminals disposed on a top surface of the main body; and a plurality of second terminals disposed on a bottom surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end faces of the plurality of electrodes of the plurality of layer portions, and to the plurality of first and second terminals.

A method of producing a composite heat dissipating structure by depositing a slurry of graphene particles upon a copper foil, drying the slurry to form a layer of graphene in contact with the copper foil, and consolidating the layer of graphene under pressure to reduce the thickness of the graphene layer and recovering the composite heat dissipating structure. Heat dissipating copper foils and composite heat dissipating structures and electronic devices incorporating the same are also disclosed herein.

The invention discloses a curved screen and flat panel display module full-lamination method, which comprises the following steps: designing and manufacturing a frame, fixing a frame-pasting curved screen and the frame through a positioning fixture, injecting liquid optical cement, putting a flat panel liquid crystal display module, fixing through the positioning fixture to form an integrated screen, putting the positioning fixture and the integrated screen into a heating device and carrying out heating curing, removing the positioning fixture and the integrated screen out of the heating device after completing the above steps, dismounting the positioning fixture, removing spilled cement residue at the edge of the frame and completing lamination. The invention also discloses a curved screen and flat panel display module full-laminated integrated screen prepared according to the above processing method. By arranging the frame between the curved screen and the flat panel liquid crystal display module, lamination of a curved-surface product is converted into traditional flat-panel type lamination. The operation steps are simple. Investment in equipment and fixture is less. Batch production is convenient to realize.

The invention relates to a backlight module which comprises a strengthened adhesive tap, a light source assembly and a light guide plate. The strengthened adhesive tap is bent to form a shade, a supporting part extends out from the bottom of the shade, and the shade is provided with an opening; the light source assembly is attached to the shade and is arranged in the shade; and the light guide plate is provided with an incident surface, a bottom surface adjacent to the incident surface and an exit surface, a part of the bottom surface is opposite to the supporting part, and the incident surface is placed at the position of the opening. In the assembly of the backlight module, the backlight module can be directly attached to other members through the shade and can be assembled conveniently. In addition, when reworking is required, reworking can be carried out easily just by tearing off the strengthened adhesive tap without the locking of screws.

A method and apparatus for performing story analysis are described including accepting a story, segmenting the received story into a plurality of scenes, detecting characters for each scene in the story, analyzing a relationship of each set of characters in the each scene of the story, by parsing, tagging and filtering descriptive text and words of dialog between the each set of characters to calculate a number of dialogs between each the set of characters and a number of words in each dialog between each the set of characters, determining an importance of each character in the each scene of the story, determining an interaction characterization for the each character in the each scene of the story using the importance of the each character and generating character relationship data responsive to the importance of each character in the each scene of the story and the interaction characterization for the each character in the each scene of the story.

A hollow shielding structure for different types of circuit elements is provided. The hollow shielding structure includes at least one element mounted on a printed circuit board (PCB), a shield dam surrounding the at least one element, and a shield cover is configured to be electrically coupled to an upper portion of the shield dam and cover the at least one element, with a gap formed between the at least one element and the shield cover.

The invention discloses a luminous key, a luminous key switch assembly and a key structure with a removable key cap, wherein, the luminous key is applied to the luminous key switch assembly and comprises a light guide body and the key cap; the light guide body is combined in the key cap, touches a switching element through a press convex block and receives light from a light source through a light receiving structure so that the light is guided to depart from the top surface of the key cap through a light outgoing structure; and the edge of the key cap stretches to form two connecting pieces, and the connecting pieces are clamped by a clamping element on the internal surface of a shell so as to support the key cap at the key hole of the shell, thus realizing tool-free rapid assembly of the key cap.

A heat spreader (10) for a display device, such as a plasma display panel, a light emitting diode or a liquid crystal display, comprising at least one sheet of compressed particles of exfoliated graphite having a surface area greater than the surface area of that part of the back surface of the display device where a localized region of higher temperature is generated.

This invention discloses a sort of manufacturing method of the back-light module, and this module consists of the light board and the reflector plate. This method makes the light halftone dot to be fixed in the surface of the firing plate, and it makes the face of the reflector plate which has the light halftone dot to be glued in the light board close in the assembly of the back-light module. The manufacturing working procedure which adopts this invention is convenient, it saves the space of the manufacture, it is propitious to advance the manufacturing efficiency, it advances the crop, and its cost is low correspondingly.

There is disclosed a rework process for a photoresist film over a substrate having at least a first antireflection silicone resin film and the photoresist film over the first silicone resin film comprising: at least removing the photoresist film with a solvent while leaving the first silicone resin film unremoved; forming a second antireflection silicone resin film over the first silicone resin film; and forming a photoresist film again over the second silicone resin film. There can be provided a rework process for a photoresist film that can be conducted more easily at lower cost and provide more certainly an excellent resist pattern.

A method of remanufacturing a cartridge detachably mountable in an electrophotographic image-forming apparatus body and composed of styrene-based resin compositions at least in part, characterized by including the steps of: (1) dividing the cartridge into at least two parts; and (2) bonding at least one of the divided parts with another one of the divided parts and / or a component other than the divided parts by use of a terpene solvent.

The invention discloses a display device and a backlight module. The display device comprises a liquid crystal panel, a backlight module and a control circuit board. The backlight module is arranged under the liquid crystal panel, wherein the backlight module comprises a light source and a frame. The frame is provided with a limiting structure; and the limiting structure is provided with an extending part and a limiting part, wherein the extending part is connected with the limiting part. The control circuit board is arranged under the backlight module, wherein at least one part of the limiting part covers the control circuit board in order that the control circuit board is fixed on the backlight module.

A fan includes an impeller, a motor, a plurality of first engaging members and a plurality of second engaging members. The impeller includes a hub and a plurality of blades disposed around the hub. The motor includes a rotor housing coupled with the hub, and the motor is for driving the impeller to rotate. The first engaging members are disposed on an inner side of the top surface of the hub, and the second engaging members are disposed on the top surface of the housing. When the impeller and the rotor housing are assembled, the second engaging members are disposed corresponding to the first engaging members, so that parts of the first engaging members are engaged into and assembled with the second engaging members.

According to a polarized glasses type stereoscopic image display device and a fabrication method thereof in accordance with the present invention, a light blocking pattern may be formed on a rear surface of the color filter substrate to enhance vertical viewing angle and aperture ratio. Moreover a light blocking pattern may be formed of a metal having a large hardness instead of resin BM and a step height from the rear surface ITO may be removed to prevent a scratch due to an abrasive belt.

A metal bump structure for use in a driver IC includes a metal bump disposed on a matrix, an optional capping layer disposed on the metal bump to completely cover the metal bump and a protective layer disposed on the metal bump to completely cover and protect the metal bump or the optional capping layer and so that the metal bump is not exposed to an ambient atmosphere. The protective layer or the optional capping layer may have a fringe disposed on the matrix.

An arrangement for connecting the terminal contacts of an electronic component to electrical contacts formed on a printed circuit board. An at least partly flexible conductor support having a plurality of interconnects provides an electrical connection between the terminal contacts of the electronic component and the electrical contacts of the printed circuit board such that a portion of the conductor support that is connected to the printed circuit board is arranged on an end face of the printed circuit board and extends perpendicularly in relation to the upper and lower surfaces of the printed circuit board. Furthermore, a conductor support formed with relatively narrow middle portion is provided to facilitate such an arrangement.

Apparatus and methods for replacing worn out liners in material classifying cyclones which include segmented inlet housing liners that are removable through the opened top thereof. In a first embodiment, a stacked array of the especially configured liners are supported on a lifting ring in the conical housing of the cyclone and lifting straps are used to extract the lifting ring and the liners. In a second embodiment, a special hoist is inserted into the liners and operated to clamp onto the liners and hold them in the stacked array and then the hoist and the attached liners are extracted. In either embodiment, the liners are extracted without removing the cyclone from its operating position and completely disassembling the cyclone. The extracted liners are moved to a work station for replacement as needed. Refurbished liner arrays are inserted into the cyclone by using the lifting ring or the special hoist.