212results about How to "Difficult to separate" patented technology

A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of the bake plate when the substrate is placed on the bake plate, and exhaust bores for exhausting gas from the minute space. The substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores.

A method of making a lead frame and a partially patterned lead frame package with near-chip scale packaging (CSP) lead-counts is disclosed, wherein the method lends itself to better automation of the manufacturing line as well as to improving the quality and reliability of the packages produced therefrom. This is accomplished by performing a major portion of the manufacturing process steps with a partially patterned strip of metal formed into a web-like lead frame on one side, in contrast with the conventional fully etched stencil-like lead frames, so that the web-like lead frame, which is solid and flat on the other side is also rigid mechanically and robust thermally to perform without distortion or deformation during the chip-attach and wire bond processes. The bottom side of the metal lead frame is patterned to isolate the chip-pad and the wire bond contacts only after the front side, including the chip and wires, is hermetically sealed with an encapsulant. The resultant package being electrically isolated enables strip testing and reliable singulation without having to cut into any additional metal. The use of the instant partially patterned lead frame in making ELP, ELPF and ELGA-type CSPs is also disclosed.

A connector includes a socket having a generally rectangular shape, the socket including socket contacts, lock mechanisms and retainer mechanisms; and a header having a generally rectangular shape, the header including header contacts and lock mechanisms and being couplable with the socket. The lock mechanisms of the socket and the header are respectively formed from the socket contacts and the header contacts, the lock mechanisms of the socket being formed by cutting away a portion of the socket contacts. The lock mechanisms of the header also serve as retainer mechanisms thereof. The lock mechanisms of the socket and the header are arranged substantially in the same row as the socket contacts and the header contacts and positioned near four corners of the socket and the header, respectively. The lock mechanisms of the socket and the header are configured to keep the socket and the header in a coupled state.

The present invention is intended to detachably retain a memory card (1) and connect a terminal formed on a terminal surface (1a) of the memory card (1) to the terminal on a substrate (21) so as to be capable of data exchange. There are provided a housing (2) having a terminal surface abutting portion (3) to be abutted to the terminal surface (1a) of the memory card (1) and guiding walls (4), (4) extending upward from lateral ends of the terminal surface abutting portion (3) for laterally positioning the memory card (1); and tabs (10) having resilient supporting strips (12), (12) on top and bottom and being attached to the respective guiding walls (4) by being fitted from the outside so as to clamp the tops and bottoms of the guiding walls (4), (4) for pushing the lateral ends of the memory card (1) against the terminal surface abutting portion (3) by the supporting strips (12).

In a sensor and a radar for measuring the distance and the moving speed of a target by radiating a radio frequency, particularly a millimeter wave, compatibility between cost reduction and high detection performance has been conventionally a significant problem. In the present invention, the frequency of a transmitted signal changes during a fixed time while performing digitally-frequency-modulation on frequency sweeping straight lines extending, with different slopes relative to the time axis, from plural slightly different initial values serving as starting points, the signal is transmitted after being modulated so as to periodically repeat the sweep time serving as a unit, signal components corresponding to the respective sweeping slopes are digitally sampled, in synchronization with the transmitted modulation signal, from a received signal which is reflected and returned from a target, and the received signal is analyzed.

A substrate heat treatment apparatus for heat-treating a substrate includes a bake plate having projections on an upper surface thereof, a seal unit disposed peripherally of the upper surface of the bake plate for closing a lateral area of a minute space formed between a lower surface of the substrate and the upper surface of the bake plate when the substrate is placed on the bake plate, and exhaust bores for exhausting gas from the minute space. The substrate placed on the bake plate is heat-treated in a state of the gas exhausted from the minute space through the exhaust bores.