The invention relates to a fan-out packaging structure and the production technology of a high power device. The fan-out packaging structure is characterized by comprising a core board, wherein a groove body of the core board is provided with a chip, the core board, the chip, a lower-layer medium material and an upper-layer medium material are stitched together, the upper-layer medium material is arranged above the back surface of the core board, the surface of the upper-layer medium material is provided with a metal layer, the upper-layer medium material is provided with an opening, the opening is arranged above the back surface of the chip, a heat sink is filled in the opening, the lower surface of the lower-layer medium material is provided with a welding resistance layer, the welding resistance layer is provided with an RDL line layer, a welding disc of the RDL line layer is provided with a BGA ball, the lower-layer medium material is provided with a laser blind hole, the laser blind hole is filled with a plated metal, the RDL line layer is mutually connected with the welding disc on the front surface of the chip through the plated metal in the laser blind hole, and the surface of the chip is wrapped in a resin layer. The fan-out packaging structure solves a heat radiation problem existing in fan-out packaging of the high power device, the technology is simple, and the fan-out packaging structure is compatible with multiple chips.