Fan-out package structure and its production process
A technology of packaging structure and production process, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of packaging thermal management performance limitations, complex process, low performance, etc., to enhance market application competitiveness, Good yield and reliability, low cost effect
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[0034] The present invention will be further described below in conjunction with specific drawings.
[0035] The present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure are shown. These embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these examples are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that although a relatively complete manufacturing process of a chip package device will be described below, some process steps are optional and there are alternative implementations.
[0036] Such as Figure 9 As shown: the fan-out packaging structure includes a core board 1, and a slot body 2 connecting the front and back sides of the core board 1 is opened on the core board 1, and a ...
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