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Fan-out package structure and its production process

A technology of packaging structure and production process, applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of packaging thermal management performance limitations, complex process, low performance, etc., to enhance market application competitiveness, Good yield and reliability, low cost effect

Active Publication Date: 2019-01-04
NAT CENT FOR ADVANCED PACKAGING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] At present, the mainstream fan-out packaging is still based on the injection molding (molding) method based on the wafer process. Among them, the main fan-out RDL uses sputtered metal film as the seed layer or wafer. The thermal management of the package made by this structure The performance is very limited. In addition, the process also has the characteristics of high cost and complicated process, which leads to high cost and low performance.
[0003] At present, in the process of chip embedding based on the substrate, the process of electroless plating seed layer is used to metallize the blind holes, but there are certain restrictions on the material of the pad (pad) of the chip in the process of electroless plating.

Method used

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  • Fan-out package structure and its production process

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Embodiment Construction

[0034] The present invention will be further described below in conjunction with specific drawings.

[0035] The present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the disclosure are shown. These embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these examples are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that although a relatively complete manufacturing process of a chip package device will be described below, some process steps are optional and there are alternative implementations.

[0036] Such as Figure 9 As shown: the fan-out packaging structure includes a core board 1, and a slot body 2 connecting the front and back sides of the core board 1 is opened on the core board 1, and a ...

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Abstract

The invention relates to a fan-out packaging structure and its production process, which is characterized in that: it includes a core board, a chip is arranged in a groove on the core board, a pad is provided on the front side of the chip, and bumps are arranged on the pad; The board, the chip, and the dielectric material on the front and back of the chip are pressed together, the pads and bumps on the front of the chip are embedded in the dielectric material, and the gap between the chip and the tank is filled with the dielectric material; the dielectric material on the back of the chip A metal layer is provided on the outer surface, a solder resist layer is provided on the outer surface of the dielectric material on the front of the chip, an RDL circuit layer is arranged in the solder resist layer, and BGA balls are arranged on the pads of the RDL circuit layer; the dielectric material on the front of the chip The material is provided with laser blind holes, which are filled with electroplated metal, and the RDL circuit layer is interconnected with the bumps on the front of the chip through the electroplated metal in the laser blind holes. The invention eliminates the restrictive condition of the active chip embedded in the organic substrate, improves the yield rate of device packaging, and reduces the cost of fan-out packaging.

Description

technical field [0001] The invention relates to a fan-out packaging structure and a production process thereof, belonging to the technical field of advanced microelectronic packaging. Background technique [0002] At present, the mainstream fan-out packaging is still based on the injection molding (molding) method based on the wafer process. Among them, the main fan-out RDL uses sputtered metal film as the seed layer or wafer. The thermal management of the package made by this structure The performance is very limited, and the process also has the characteristics of high cost and complicated process, which leads to high cost and low performance. [0003] At present, in the chip embedding process based on the substrate, the electroless plating seed layer process is used to metallize the blind holes, but there are certain restrictions on the pad material of the chip in the electroless plating process. Contents of the invention [0004] The purpose of the present invention i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/488H01L21/60
CPCH01L2224/04105H01L2224/12105H01L2224/19H01L2224/32225H01L2224/73267H01L2224/92144
Inventor 郭学平于中尧
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD
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