Fan-out packaging structure and production technology of high power device

Abstract

The invention relates to a fan-out packaging structure and the production technology of a high power device. The fan-out packaging structure is characterized by comprising a core board, wherein a groove body of the core board is provided with a chip, the core board, the chip, a lower-layer medium material and an upper-layer medium material are stitched together, the upper-layer medium material is arranged above the back surface of the core board, the surface of the upper-layer medium material is provided with a metal layer, the upper-layer medium material is provided with an opening, the opening is arranged above the back surface of the chip, a heat sink is filled in the opening, the lower surface of the lower-layer medium material is provided with a welding resistance layer, the welding resistance layer is provided with an RDL line layer, a welding disc of the RDL line layer is provided with a BGA ball, the lower-layer medium material is provided with a laser blind hole, the laser blind hole is filled with a plated metal, the RDL line layer is mutually connected with the welding disc on the front surface of the chip through the plated metal in the laser blind hole, and the surface of the chip is wrapped in a resin layer. The fan-out packaging structure solves a heat radiation problem existing in fan-out packaging of the high power device, the technology is simple, and the fan-out packaging structure is compatible with multiple chips.

Description

technical field [0001] The invention relates to a high-power device fan-out packaging structure and production technology, belonging to the field of microelectronic advanced packaging technology. Background technique [0002] The traditional fan-out packaging structural components are embedded in resin and dissipate heat through the front side. This structure has relatively large thermal resistance and is suitable for packaging low-power devices. [0003] At present, the mainstream fan-out packaging is still based on the injection molding (molding) method based on the wafer process. The main fan-out RDL uses sputtered metal film as the seed layer or wafer. The heat dissipation of the package made by this structure The management performance is very limited; in addition, the process is also characterized by high cost and complicated process, which leads to high cost and low performance. Contents of the invention [0004] The purpose of the present invention is to overcome ...

AI Technical Summary

Problems solved by technology

[0003] At present, the mainstream fan-out packaging is still based on the injection molding (molding) method based on the wafer process. The main fan-out RDL uses sputtered metal film as the seed layer or wafer. The heat dissipation of the package made by this structure The management performance is very limited; in addition, the process is also characterized by high cost and complicated process, which leads to high cost and low performance.

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