203results about How to "Component with high" patented technology

Embodiments of the invention pertain to a method and apparatus for planar wireless power transfer where the receiver switches off and / or performs a duty cycle. In an embodiment, the switch can be used in a system that having a high voltage / current solid state switch, without having a high voltage control signal. An embodiment provides a switch that is capable of breaking, or greatly reducing, the connection of the receiver coil and the receiver circuitry in order to enable the receiver to decouple from the power transfer system. This embodiment can allow the transmitter to put out more power to other devices without providing power to the switched device. When the switch is used for a fully charged device, the switching can prevent or reduce damage to the fully charged device.

A process for producing and recovering light alcohols, particularly ethanol, alcohol mixtures containing ethanol, and ABE mixtures (alcohol mixtures containing acetone, butanol and ethanol), using a combination of steps including fermentation, first membrane separation, dephlegmation and dehydration by second membrane separation.

The present invention provides olefin polymerization catalysts and processes for preparing a polypropylene and a propylene block copolymer using the olefin polymerization catalysts. The olefin polymerization catalyst (1) of the invention is formed from: (I-1) a contact product obtained by contacting: (A) a solid titanium catalyst component, (B) an organometallic compound catalyst component, and (C) a specific organosilicon compound; (II-1) (D) a specific polyether compound; and optionally, (III) an organometallic compound catalyst component. The olefin polymerization catalyst (2) of the invention is formed from: (I-2) a contact product obtained by contacting: (A) a solid titanium catalyst component, (B) an organometallic compound catalyst component, and (D) a specific polyether compound; (II-2) (C) a specific organosilicon compound; and optionally, (III) an organometallic compound catalyst component. The propylene is polymerized in the presence of the above-mentioned olefin polymerization catalysts to prepare highly isotactic polypropylene. The propylene block copolymer is prepared by the steps of polymerizing propylene to form a polypropylene component and copolymerizing ethylene and an alpha-olefin of 3 to 20 carbon atoms to form an ethylene / alpha-olefin copolymer component in the presence of the polymerization catalysts.

An improved integrated circuit package for providing built-in heating or cooling to a semiconductor chip is provided. The improved integrated circuit package provides increased operational bandwidth between different circuit devices, e.g. logic and memory chips. The improved integrated circuit package does not require changes in current CMOS processing techniques. The structure includes the use of a silicon interposer. The silicon interposer can consist of recycled rejected wafers from the front-end semiconductor processing. Micro-machined vias are formed through the silicon interposer. The micro-machined vias include electrical contacts which couple various integrated circuit devices located on the opposing surfaces of the silicon interposer. The packaging includes a Peltier element.

A cardiac signal processing apparatus includes: a unit for acquiring, from a heartbeat sensor, cardiac signals relating to heartbeats of a subject; a low-pass filter for allowing passage of those cardiac signals having a first predetermined frequency or lower, among the cardiac signals; higher harmonic noise acquisition unit for acquiring harmonic signals of low-frequency noise by performing high frequency extrapolation on the signals output from the low-pass filter; a high-pass filter for allowing passage of those cardiac signals having a second predetermined frequency or higher, among the cardiac signals; and higher harmonic noise removal unit for removing the harmonic signals of low-frequency noise from the signals output from the high-pass filter. It is thus made possible to remove noise from the cardiac signals and to obtain desirable heartbeat detection characteristics.

A watertight connection includes a male side and female side pair of terminal fittings. Each of the terminal fittings is mounted to an end part of an electrical line. Plug housings having male side and female side terminal fittings of two poles are correspondingly mounted, male side-to-male side and female side-to-female side. Insulation members each house a rear end part of a plug housing and an end part of an electrical lines. A sealing material member prevents moisture from penetrating into the insulation member. Openings, which expose the front end part of each plug housing outside of the insulation member, are formed in an inner wall surface of the insulation member. An outer circumferential surface of the rear end part of each of the plug housings is brought into close contact with the sealing material member to couple the plug housings and the insulation member in a watertight state.

The specification describes flip bonded dual substrate inductors wherein a portion of the inductor is constructed on a base IPD substrate, a mating portion of the inductor is constructed on a cover (second) substrate. The cover substrate is then flip bonded to the base substrate, thus mating the two portions of the inductor. Using this approach, a two level inductor can be constructed without using a multilevel substrate. Using two two-level substrates yields a four-level flip bonded dual substrate inductor.

Non-planar transistors, such as FINFETs, may be formed on the basis of a globally strained semiconductor material, thereby preserving a high uniaxial strain component in the resulting semiconductor fins. In this manner, a significant performance enhancement may be achieved without adding process complexity when implementing FINFET transistors.