The invention discloses a full-
automatic control selective
wave soldering device. The device is characterized by comprising a main body, a controller, a conveying guide rail, a scaling
powder spraying mechanism, a double-layer preheating mechanism and a
selective soldering mechanism, wherein the controller, the conveying guide rail, the scaling
powder spraying mechanism, the double-layer preheating mechanism and the
selective soldering mechanism are arranged on the inner side of the main body, the controller comprises a conveying controller, a spraying controller, a preheating controller and a
soldering controller, the spraying controller comprises a
pressure controller, a
pressure sensor, a flowmeter and a pressure reducing valve, the
pressure controller is connected with the
pressure sensor, the flowmeter and the pressure reducing valve, the
pressure sensor is mounted on a spraying valve, and the flowmeter and the pressure reducing valve are mounted on a spraying
pipe at the bottom end of the spraying valve. Through the arrangement of the pressure sensor, the
pressure controller, the pressure reducing valve, the flowmeter and other structures, the situation that the pressure of a
sprayer on the spray valve is too high can be avoided; and through the arrangement of a
temperature control chip, a temperature sensor and other structures, the situation that the temperature of the preheating controller in use is too high can be avoided.