The invention relates to the technical field of
semiconductor manufacturing, and in particular relates to a
wafer horizontal deviation detection method, a
wafer horizontal deviation detection device and furnace tube equipment. The detection method comprises the steps of determining an excircle area of a reference
wafer; calculating the minimum circumscribed rectangle of the excircle area of the reference wafer; determining a tangent point between the minimum circumscribed rectangle and the excircle area of the reference wafer; transferring the wafer to be measured to the outer circle area of the reference wafer; controlling a
ray to enter from one side of the tangent point along the vertical direction; and judging whether the
ray is received at the other side of the tangent point or not. The detection device comprises a CPU, a program storage part, a memory and a data
bus, wherein the CPU, the program storage part and the memory are respectively connected with the data
bus. A program is stored in the program storage part and is used for executing the detection method. The furnace tube equipment comprises a
ray receiving and transmitting
system, a wafer boat, a moving device, a moving driving
system and a detection device. According to the invention, the offset vector of the wafer to be detected in the horizontal direction is detected through the ray, and the horizontal offset vector can be corrected in time according to the offset vector.