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Taking and placing device and taking and placing method

A pick-and-place device and mounting hole technology, applied in the manufacturing field, can solve problems such as defects, OLED display screen collision stress, concentration, etc., and achieve the effects of protecting products, increasing yield, and reducing scrap

Inactive Publication Date: 2019-05-10
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a pick-and-place device and a pick-and-place method to solve the problem that in the prior art, during the pick-and-place process of the OLED display, the carrier is not parallel to the OLED display, and the OLED display is prone to local collision and stress concentration, resulting in bad problems.

Method used

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  • Taking and placing device and taking and placing method
  • Taking and placing device and taking and placing method

Examples

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Embodiment 1

[0057] refer to figure 1 , shows a schematic structural view of a pick-and-place device provided by an embodiment of the present invention. The device includes a three-axis balance joint 10, an adsorption assembly 20 and a control handle 30, referring to figure 2 The exploded structure diagram of the pick-and-place device shown;

[0058] The three-axis balance joint 10 has rotational degrees of freedom in three directions in a three-dimensional coordinate system;

[0059] The adsorption assembly 20 and the control handle 30 are respectively fixedly connected to the three-axis balance joint 10;

[0060] The suction assembly 20 is used for vacuum suctioning the target object 40 .

[0061] In this embodiment, the adsorption assembly 20 and the control handle 30 are respectively fixedly connected to the three-axis balance joint 10. Since the three-axis balance joint 10 has rotational degrees of freedom in three directions in the three-dimensional coordinate system, the target ...

Embodiment 2

[0109] refer to Figure 5 , shows a flowchart of steps of a pick-and-place method provided by an embodiment of the present invention. Applied to the pick-and-place device as described in Embodiment 1, the method includes:

[0110] Step 501 , turn on the vacuum of the adsorption assembly 20 through the control handle 30 .

[0111] In this embodiment, the control handle 30 includes a handle and a vacuum system, and the vacuum system includes a vacuum generator, a vacuum control valve, and a positive pressure air interface. The air path between the vacuum generator and the adsorption assembly 20 is connected through the vacuum control valve, so as to open the vacuum of the adsorption assembly 20 .

[0112] Step 502, hovering the adsorption assembly 20 directly above the target object, and controlling the pick-and-place device to fall, so that the adsorption assembly 20 vacuum-adsorbs the target object.

[0113] In this embodiment, the adsorption assembly 20 includes a fourth c...

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Abstract

The invention provides a taking and placing device and a taking and placing method. The device comprises a three-axis balance joint, an adsorption assembly and a control handle. The three-axis balancejoint has rotating freedom degrees in the three directions in a three-dimensional coordination system, the adsorption assembly and the control handle are fixedly connected with the three-axis balancejoint, and the adsorption assembly is used for adsorbing a target object under vacuum. The three-axis balance joint can enable the taking and placing device to keep balanced when taking and placing the target object, the target object is prevented from being collided and scratched in the taking and placing process, therefore, scrap is reduced, and the yield is improved.

Description

technical field [0001] The invention relates to the field of manufacturing technology, in particular to a pick-and-place device and a pick-and-place method. Background technique [0002] With market development and consumer demand, OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode) displays are more and more used in electronic equipment due to their light weight, thin thickness, and high resolution. However, domestic production of OLED displays is still in its infancy due to insufficient technology and other factors. [0003] In the process of picking and placing the OLED display, it is necessary to ensure that the OLED display is relatively parallel to the carrier, otherwise it is easy to cause local collision and stress concentration of the OLED display to cause defects, especially after the panel and the flexible circuit board are bonded. Before the cover glass is attached, the panel and the flexible circuit board are relatively soft, which is prone to scr...

Claims

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Application Information

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IPC IPC(8): B65G47/91
Inventor 吴兆明程乾黄修雄王鹏
Owner BOE TECH GRP CO LTD
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