104results about How to "Avoid light decay" patented technology

The electroluminescent device successively comprises a cathode, an electroluminescent layer, a transparent electrode layer, an evanescent light-scattering layer comprising a matrix composed of a low-refractive material containing light-scattering particles, and a transparent sheet / plate. Such an electroluminescent device is decreased in total reflection not only at a boundary surface between a transparent substrate and an outside air layer but also at a boundary surface of the transparent electrode layer on its light extraction side, and therefore, is considerably improved in light extraction efficiency. In addition, in the electroluminescent device provided with a barrier layer, the transparent electrode layer and the electroluminescent layer can be well protected so that deterioration of electroluminescent pigments and occurrence of dark spots can be effectively prevented, resulting in enhanced life of the device.

A front light includes: a light source, a light guide plate, and a plurality of prism-shaped lenses, each being in contact with a lower surface of the light guide plate. A cross-section of each of the prism-shaped lenses, in a plane perpendicular to the side surfaces thereof, has a shape of equally-sided trapezoid. An obtuse angle Φout of the equally-sided trapezoidal cross-section and a critical angle θc for the total reflection of the prism-shaped lenses satisfy the relationship of 90°<Φ out≦90°+θc. When the light emitted from the light source enters the prism-shaped lens, the light is allowed to be reflected at a side surface defined by side-edges of the trapezoidal cross-section and thereafter exit through a lower surface. Thus, the light can illuminate pixel electrodes in a liquid crystal panel from a direction normal thereto.

An optical tunable filter has a fixed substrate having a first recess formed therein and a movable substrate bonded to the fixed substrate. The movable substrate includes a movable portion having an opening formed at a location facing the first recess and a support portion for supporting the movable portion so that the movable portion can be displaced. The optical tunable filter also has a light-transmittable substrate bonded to the movable portion, a fixed reflection film formed on a bottom of the first recess, and a movable reflection film formed on a surface of the light-transmittable substrate. The optical tunable filter includes an interference gap formed between the fixed reflection film and the movable reflection film. The optical tunable filter also includes an actuator operable to displace the movable portion relative to the fixed substrate.

An optical semiconductor device (A1) comprises a light reflector (5) and an optical semiconductor chip (3). The reflector (5) includes two first reflecting surfaces (50a) spaced from each other in direction x, and two second reflecting surfaces (50b) spaced from each other in direction y. The chip (3) includes a rectangular upper surface and a rectangular lower surface spaced from each other in direction z perpendicular to both of the directions x and y. The chip (3) further includes at least one light-emitting surface (31) extending between the upper and the lower surfaces. The light-emitting surface (31) faces a corresponding one of the second reflecting surfaces (50b). The light-emitting surface (31) is non-parallel to the corresponding second reflecting surfaces (50b) as viewed in parallel to the direction z.

An LED lamp tube comprises a tube body, at least one circuit board inside the tube body, at lease one LED module on the circuit board, and electrical connectors at the ends of the tube, wherein the tube body is an integrally formed hollow tube, and has at least one group of supporting and positioning ribs on the inner wall thereof along the length direction; the circuit board is fixed by the supporting and positioning ribs; the LED lamp tube disclosed by the present invention has a firm assembly structure with less thermal deformation, and more particularly just like the conventional fluorescent tubes it has a wide light-emitting angle, thereby providing better illumination effects.

The invention discloses an iris collecting device for controlling turn-on time of an infrared lamp. The device comprises an image sensor, a camera module, an infrared lamp, a micro control unit; the micro control unit detects a frame synchronization signal sent by the image sensor and computes exposure time of the image sensor, computes the turn-on time of the infrared lamp, and controls the on-ffof the infrared lamp. Through the iris collecting device disclosed by the inventio, the infrared lamp power consumption can be reduced, and the motion blurring is eliminated; the bad frame phenomenoncan be avoided in an alternate lighting scheme, thereby guaranteeing that each frame image can acquired exposure with uniform brightness.

The invention discloses a YAG fluorescent ceramic as well as a preparation method and application thereof. Light-emitting center ions of the YAG fluorescent ceramic comprise Ce<3+> and M capable of emitting red light / green light; the molecular formula is (Y1-xCex)3(Al1-yMy)5O12, wherein x is greater than or equal to 0.004 and is less than or equal to 0.5, and y is greater than 0 and is less than or equal to 0.5. The preparation method of the YAG fluorescent ceramic comprises the following steps: uniformly mixing powder of raw materials, molding to prepare biscuits and carrying out high-temperature solid-phase synthesis reaction sintering to prepare the YAG transparent ceramic. After rare earth-doped YAG transparent ceramic is encapsulated with a commercial blue light LED chip, high-qualityemitted light capable of simulating sunlight can be obtained; compared with the rare earth-doped YAG transparent ceramic prepared by a two-step method, the step of synthesizing YAG:Ce<3+>, M fluorescent powder is avoided in the reaction sintering method; the preparation method has the characteristics of simple process and low production cost.

The invention discloses a light emitting diode (LED) lamp with a heat dissipation circuit board, which comprises a circuit board and an LED light emitting unit which is electrically connected on the circuit board, wherein the circuit board is a double-layer copper foil board; an insulating layer is integrally formed between the upper and lower copper foil layers; the circuit board is provided with a through hole; a heat conduction material is arranged in the through hole to form a heat conduction column; the upper and lower copper foil layers are communicated with each other by the heat conduction column; and heat, which is formed by the LED light emitting unit arranged on the upper copper foil layer, is evenly transferred to the upper and lower copper foil layers through the heat conduction column, thereby effectively radiating heat through the upper and lower copper foil layers. Therefore, the lamp has simple design structure, and the heat dissipation circuit board adopted in the invention can be freely provided with LED light emitting units with different powers according to the power of the lamp in actual demands, so that heat inside the LED lamp can be effectively radiated, thereby prolonging the service life of the lamp and effectively preventing light attenuation of the lamp.

The invention relates to an LED lamp radiator with a heat tube function and a combined LED illumination lamp. The radiator comprises a heat tube, radiating fins and a mounting connecting body, whereinthe mounting connecting body comprises a mounting base and a column which is arranged in the center of the mounting base and is provided with an inner hole; the radiating fins are fixedly connected with an outer margin vertical surface of the column, radially and uniformly distributed at the periphery of the outer margin vertical surface of the column and integrally cast with the mounting connecting body; the hole wall of the inner hole of the mounting column is the tubular shell of the heat tube; a copper wire net is attached to the hole wall, or the hole wall is coarsened and processed to form particles, or grooves are processed on the hole wall so as to form a liquid-absorbing core of the heat tube; both ends of the inner hole of the column are sealed, and working liquid is filled in the column. The combined LED illumination lamp comprises 1-100 groups of radiators with LED lamps and an LED light source; and every two radiators are mutually connected by a buckle into a whole. The LED lamp radiator has reasonable structure, small size and better radiation function, and the combined LED illumination lamp has attractive appearance and long service life.

The invention discloses an isolation type heat dissipation device of an LED (light-emitting diode) lamp. The isolation type heat dissipation device comprises an insulating lamp cap, an LED driving plate, an isolating base, heat transfer columns and a heat transfer plate. Heat conducting fins are uniformly distributed on the inner walls of the heat transfer columns, heat conducting strips are arranged on the outer circumferences of the heat transfer columns in sections and are arranged in a one-to-one correspondence manner, corresponding fins and convection covers extend from the tail ends of the heat conducting strips, cooling fins are arranged between one pair of heat conducting strips and another pair of heat conducting strips and are enclosed by the convection covers. The upper surface of the heat transfer plate is connected with the heat conducting fins. The isolation type heat dissipation device has the following advantages: heat on the heat transfer plate is quickly transferred to a pair of heat conducting fins and the cooling fins by the heat transfer columns, and then with the chimney effect of the convection cover, the heat is dissipated into air so as to reduce the temperature rise of the heat transfer plate and an LED aluminium base plate, thereby prolonging the service life of the LED lamp. The isolating base and an insulating lead tube isolate the LED driving plate completely from an external heating part and a conducting metal part, so as to ensure the safety performance of the lamp, reduce the temperature of the LED driving plate, improve the working stability of the LED driving plate, and prolong the service life of electric components, especially the service life of electrolytic capacitors.

The invention relates to an LED lamp manufacturing method. An LED lamp includes a heat radiation housing, an LED chip and a pliable circuit board provided with a lead. The manufacturing method includes the steps of pasting a layer of heat-conducting medium on a position of the heat radiation housing in advance, while the position is assigned to install the LED chip; pasting the pliable circuit board on the heat-conducting medium; fixing the LED chip on the pliable circuit board in a die-attaching manner; welding the LED chip and the lead of the pliable circuit board so as to realize the electricity conduction; and sealing the LED chip and the pliable circuit board by silica gel and phosphor powder. Compared with the prior art, the LED lamp manufacturing method to manufacture high quality products solves the problem of light decay caused by poor heat radiation of the LED lamp, and has the advantages of simplified working process, high production efficiency, and low material consumption and cost. The LED lamp manufacturing method can adopt the automatic equipments to operate, thus further improving the production efficiency.

The invention discloses a preparation method for a light-emitting diode (LED) radiating substrate. The method comprises the following steps of: providing a heat conducting aluminium substrate; screen-printing insulating glue on the top of the substrate in a screen printing way after performing anti-corrosion treatment; pressing a copper foil with the substrate at the temperature of between 150 and 200 DEG C, wherein the copper foil is jointed with the insulating glue but forms a gap with the substrate; etching the copper foil to form a copper foil line and an electroplated lead wire; forming a chemical nickel layer on a metal surface exposed outside in an electrolysis-free electroplating way, attaching a heat-resisting rubber belt at the bottom of the substrate and forming a metal layer on the chemical nickel layer on the top; removing the electroplated lead wire and performing welding-proof treatment so as to obtain the LED radiating substrate. The invention can avoid the insulating glue between the substrate and the LED, so that the LED can smoothly and quickly transfer heat to the substrate to prevent the LED from having high temperature and further causing light decline; therefore, the service life of the LED can be prolonged.

The invention discloses an LED bulb light circuit protected by linear temperature control. The LED bulb light circuit comprises an LED driving circuit and a temperature protection circuit, wherein the LED driving circuit comprises an overcurrent and overvoltage protection unit, a rectification filtering unit, a switch constant-current unit and an output unit, the temperature protection circuit comprises a negative temperature coefficient thermistor, a reference resistor and a temperature detection and control circuit, the negative temperature coefficient thermistor is arranged on an LED light source, and the output unit is connected with a power supply unit. The LED bulb light circuit has the advantages that the negative temperature coefficient thermistor and the reference resistor are adopted, a first working temperature point is set, no any influence of the negative temperature coefficient thermistor on an LED bulb light is generated when the temperature of the LED light source is lower than the first working temperature point, a resistance value of the negative temperature coefficient thermistor changes to make current change of the LED light source linear when the temperature of the LED light source is equal to or higher than the first working temperature point, the luminous brightness of the LED lights source changes unobviously, thus, a lighting effect cannot be affected, and the LED bulb light is prevented from being overheated.

The invention provides a color temperature adjustable LED integrated light source. The color temperature adjustable LED integrated light source comprises: a substrate; a light source which comprises an array composed of at least two white-light LEDs coated with different fluorescent materials for realizing different color temperatures, wherein each white-light LED is coated with a corresponding fluorescent material and then is packaged on the substrate; and a control unit which is installed on the substrate for controlling the luminescence effect of a lamp group composed of the white-light LEDs with the different color temperatures. According to the invention, through a mode of respectively coating the white-light LEDs with the fluorescent materials, the effect of obtaining high- luminous flux output on a small luminescence surface and color temperature adjustability are achieved. By use of an array type COB packaging mode, the space occupied by the white-light LEDs is reduced, more space is reserved on the substrate for a peripheral circuit, and the expandability is improved. By use of the LED packaging mode, after a support is omitted, light attenuation brought by aging of a support material can be avoided, and the long-term reliability of an optical engine is guaranteed.

The invention relates to an overheating protection circuit, which is used for detecting the temperature of a key point of a lamp and regulating the output current of a working circuit, the overheating protection circuit comprises a first resistor, a second resistor, a third resistor, a controllable precision voltage source and a first switching transistor; the second resistor and the third resistor which are connected in series are connected in parallel with the controllable precision voltage source and then connected with an external driving power supply through the first resistor, and one end of the third resistor is grounded; the control end of the first switching transistor is connected with the common end of the second resistor and the third resistor, the high-potential end of the first switching transistor is connected with an LED (light-emitting diode) light source, and the low-potential end of the first switching transistor is grounded; the second resistor is a positive temperature coefficient thermistor. The invention also discloses an LED drive circuit and a lamp which apply the overheating protection circuit. By detecting the temperature of the lamp, the overheating protection circuit can automatically regulate the output current of the lamp, so that the heat produced by the lamp can be reduced. The service life of the lamp is long.

The invention relates to the technical field of display, in particular to a backlight module and a display device. The backlight module comprises a PCB (printed circuit board) substrate, a plurality of light source devices are arranged on one side of the PCB substrate, and the other side of the PCB substrate is provided with a graphite heat conduction layer. The backlight module and the display device have the advantages that heat in a machine body is conducted by means of the graphite heat conduction layer, heat conduction is realized by taking advantages of intrinsic special characteristics of graphite, the horizontal heat conductivity is up to 1000w / mk, the attachment direction of the graphite heat conduction layer is enabled to be identical to thermal air orientation direction for heat dissipation, and accordingly heat dissipation efficiency can be improved maximally, light attenuation is avoided, and service lives of light sources are prolonged.

The invention discloses a luminous decay resistant furnace, which comprises a furnace bracket and a plurality of constant-current sources, wherein a conveying device for conveying wafers circularly is arranged on the furnace bracket, the furnace bracket is sequentially provided with a preheating region, a luminous region and a cooling region along a direction from a charging end to a discharging end of the conveying device, a plurality of groups of LED lamp luminous modules which are arranged side by side are positioned just above the luminous region, each group of LED lamp luminous modules is composed of a plurality of LED lamp strips having a water cooling function, and each LED lamp strip is controlled by one of the constant-current sources independently. According to the luminous decay resistant furnace, one constant-current source controls one LED lamp strip independently, so that the LED lamp strip has ultra-high luminous intensity, the heating temperature thereof can be controlled, and the LED lamp strip operates at constant temperature. In the process that the wafers enter the luminous decay resistant furnace, the wafers are subjected to strong light exposure by means of the plurality of groups of LED lamp luminous modules, and the hydrogen passivation effect of the wafers is obvious.

After entering a transparent substrate 9 of an organic EL device and passing through this substrate 9, an outside light L1 further passes through a transparent layer 10, a transparent electrode 12, and an organic light emitting layer 13 to be reflected by a reflective electrode 14. Herein, the reflective electrode 14 has irregularities and therefore the outside light L1 is diffused and reflected by this at various angles. These reflected lights are further diffused when passing through a boundary between the organic light emitting layer 13 and the transparent electrode 12 and through an irregularity surface 11 of the transparent layer 10, and outgo from the transparent substrate 9 toward a liquid crystal panel. On the other hand, lights L2 to L4 emitted from the organic light emitting layer 13 are diffused when passing through the boundary between the organic light emitting layer 13 and the transparent electrode 12 and through the irregularity surface 11 of the transparent layer 10, and outgo from the transparent substrate 9 toward the liquid crystal panel.

The invention provides an AlGaInP light-emitting diode, which sequentially comprises a substrate, a DBR reflecting layer, an N-type semiconductor layer, a quantum well light-emitting layer, a P-type semiconductor layer, a transition layer and a P-type current diffusion layer from bottom to top, wherein multi-spectral doping is adopted by the DBR reflecting layer; the P-type semiconductor layer comprises a first P-type semiconductor layer and a second P-type semiconductor layer; the first P-type semiconductor layer is adjacent to the quantum well light-emitting layer; the second P-type semiconductor layer is adjacent to the transition layer; and the doping concentration of the second P-type semiconductor layer is smaller than that of the first P-type semiconductor layer. Diffusion of a current in the DBR reflecting layer is facilitated by improving the multi-spectral DBR doping concentration; the ageing property is improved; a concentration difference is formed by the P-type semiconductor doped layer and the transition layer for balancing doping of the transition layer by lowering the P-type semiconductor doped layer adjacent to the transition layer; light attenuation caused by nonradiative recombination increase introduced by high doping of the transition layer in long-term ageing is avoided; and the ageing property is further improved.

The invention discloses an LED packaging method and an LED, comprising filling a cavity with colloid, the filled colloid includes fluorescent glue, and then inverting the bracket filled with fluorescent glue so that the opening of the inverted bracket is downward, and the inverted The bracket is baked, so that the fluorescent glue in the cavity is cured and formed. During the baking molding process, due to the inversion of the bracket, the phosphor powder in the fluorescent glue will settle down due to gravity, so controlling the proper baking time and temperature can keep the final formed phosphor layer away from the metal layer at the bottom of the cavity And the LED chip arranged on the metal layer, avoiding the heat on the metal layer at the bottom of the cavity and the LED chip from being directly transferred to the phosphor powder in the phosphor powder layer, avoiding the decrease of luminous efficiency due to the rapid temperature rise of the phosphor powder in the phosphor powder layer, The phenomenon that the attenuation speed is accelerated and the LED light decay is accelerated.

The invention discloses an LED light source component which comprises an LED light source and joints respectively sleeved on two ends of the LED light source. The LED light source is a cylindrical surface type LED light source which comprises at least one cylindrical surface type baseplate; and the cylindrical surface type baseplate is in electric connection with a plurality of LED chips. Therefore, the cylindrical surface type LED light source can be directly arranged inside the prior lamp shell through the joints and can be directly exchanged with the prior light source, thereby greatly reducing the cost for reconstructing the prior light source to the LED light source and being favorable for popularization and application of the LED light source. In addition, a photosensor is arranged near the cylindrical surface type baseplate of the LED light source; and the photosensor is used to sense the attenuation of a light intensity signal of the LED light source and control the size of output power of the LED light source so as to solve the phenomenon of light attenuation of the prior LED light source.

The invention discloses a temperature compensation LED lamp system of body type temperature sampling. The temperature compensation LED lamp system comprises an LED light source module and a temperature compensation circuit, wherein the LED light source module is composed of a set of LEDs, a temperature sensor is arranged in the LEDs, the LED light source module is an illuminant and also a temperature sampling device, the temperature sensor is connected with an LED driving power source to conduct current adjustment through the temperature compensation circuit, the output current is reduced by the temperature compensation circuit at the high temperature, when the temperature is reduced, the output current is increased by the temperature compensation circuit, and the LED light source module reaches the hot balance state in the safe temperature region. The temperature compensation LED lamp system has the advantages that the LED body is used as the temperature detecting technology, when the temperature of an LED lamp exceeds or is lower than the set control temperature, output of a driver can be increased or decreased, the phenomena that light failure and short service life, caused by the excessive heat, of an LED lamp are caused are avoided, and the LEDs stably and reliably work at the constant temperature from beginning to end.

An image sensor to which is provided an image sensing plane that receives light from a subject whose image has been formed by a lens, the image sensing plane having a flat shape portion and a curved shape portion.

The invention provides a light emitting module. The light emitting module comprises a transparent flexible light guide substrate, at least one light emitting member, a light guide heat dissipation layer and at least a vertical heat conduction structure, wherein the transparent flexible light guide substrate is provided with an upper surface and a lower surface; the light emitting member is arranged on the upper surface of the transparent flexible light guide substrate; the light guide heat dissipation layer is arranged on the lower layer of the transparent flexible light guide substrate; the vertical heat conduction structure is embedded in the transparent flexible light guide substrate for connection with the light emitting member and the light guide heat dissipation layer in a heat-conducting manner. According to the invention, the heat energy generated by the light guide member when the light guide member works is conducted to the light guide heat dissipation layer through the vertical heat conduction structure and is dissipated through the light guide heat dissipation layer, so that light attenuation generated due to an overheat light emitting module is prevented, thus the reliability and the service life of the light emitting module are improved.