Light emitting diode packaging structure

Abstract

A light emitting diode (LED) packaging structure comprises a base, a LED chip and a packaging colloid. The LED chip is disposed in the base. The packaging colloid comprises a first optical resin material and at least one second optical resin material. The first optical resin material is transparent and packages the LED chip. The second optical resin material is disposed to a side of the first optical resin material. The second optical resin material is doped with a second fluorescent-powder. By disposing multilayered second optical resin materials, the fluorescent-powder is far from the LED chip to prevent the fluorescent-powder from being heated to cause light attenuation, thereby extending the service life of the LED chip.

Description

technical field [0001] The invention relates to a light emitting diode structure, in particular to a light emitting diode packaging structure. Background technique [0002] Light Emitting Diodes (LED) is a light source system made of solid materials such as semiconductors, which is different from traditional light sources such as incandescent lamps or various gas discharge lamps that must be operated in a vacuum or filled with a small amount of special gas . Compared with traditional light sources, white light-emitting diode light sources have many advantages, such as low power consumption, small size, fast response, high efficiency, environmental protection, and flat packaging. In terms of energy saving, its available life is as long as 60 years, which is 100 times that of traditional light bulbs, and the energy consumed is only 10% of traditional light bulbs. [0003] Since the successful development of high-power and high-brightness light-emitting diodes, the luminous e...

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Problems solved by technology

[0009] 1: Although the spin-coating method can reduce the thickness of the phosphor layer, it has the phenomenon of thin inside and thick outside, and due to the influence between the phosphor layers, it cannot be separated from the substrate

[0010] 2: Although the process method of sputtering coating can achieve the effect of uniform dispersion of the phosphor layer, the cost of the target material is too high, resulting in high manufacturing costs, making it difficult to compete

[0011] 3: Although the ㄇ-shaped coating process can make the thickness of the phosphor layer consistent, it cannot reduce the serious phenomenon of phosphor deposition

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