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Light-emitting diode radiating substrate and preparation method thereof

A technology for light-emitting diodes and heat-dissipating substrates, which is applied in the manufacture of semiconductor/solid-state devices, electrical components, and electrical solid-state devices. Effect

Inactive Publication Date: 2011-04-20
陈 一璋
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0008] The purpose of the present invention is to provide a light-emitting diode heat dissipation substrate and its manufacturing method, to overcome the existence of insulating glue between the LED and the heat conduction substrate body in the known technology, so that the heat cannot be quickly transferred from the LED to the heat dissipation substrate. Substrate, so it will still cause the loss of LED, and reduce the defect of service life

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  • Light-emitting diode radiating substrate and preparation method thereof
  • Light-emitting diode radiating substrate and preparation method thereof
  • Light-emitting diode radiating substrate and preparation method thereof

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Embodiment Construction

[0040] The "electroless plating" described here is also called "electroless plating", so the terms "electroless nickel plating" and "electroless nickel" can be used interchangeably. It is a method of forming a uniform coating on the workpiece by using a redox reaction without electricity. The electroless plating includes displacement plating (such as ion exchange or charge exchange deposition), contact plating, and essentially electroless plating. This is a well-known technology in the art, but it has not been used to improve the welding characteristics of aluminum substrates.

[0041] The "pretreatment before electroplating" described here generally refers to the treatment carried out before electroplating, but in the present invention is the treatment carried out before electroless plating, and the treatment method is the same, including pickling and Remove the film, oxide layer or rust layer on the surface of the workpiece to increase the adhesion of the coating, and remove...

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Abstract

The invention discloses a preparation method for a light-emitting diode (LED) radiating substrate. The method comprises the following steps of: providing a heat conducting aluminium substrate; screen-printing insulating glue on the top of the substrate in a screen printing way after performing anti-corrosion treatment; pressing a copper foil with the substrate at the temperature of between 150 and 200 DEG C, wherein the copper foil is jointed with the insulating glue but forms a gap with the substrate; etching the copper foil to form a copper foil line and an electroplated lead wire; forming a chemical nickel layer on a metal surface exposed outside in an electrolysis-free electroplating way, attaching a heat-resisting rubber belt at the bottom of the substrate and forming a metal layer on the chemical nickel layer on the top; removing the electroplated lead wire and performing welding-proof treatment so as to obtain the LED radiating substrate. The invention can avoid the insulating glue between the substrate and the LED, so that the LED can smoothly and quickly transfer heat to the substrate to prevent the LED from having high temperature and further causing light decline; therefore, the service life of the LED can be prolonged.

Description

technical field [0001] The invention relates to a method for manufacturing a light-emitting diode (LED) heat dissipation substrate, in particular to a light-emitting diode heat dissipation substrate on which an insulating glue can be provided only on a non-encapsulation area by screen printing on a heat-conducting aluminum substrate, so that the LED There is no barrier of insulating glue between the heat-conducting aluminum substrate, so that the LED can quickly remove the heat. Background technique [0002] With the development of the light-emitting diode (LED) industry, in order to meet the market demand, the number of LEDs in a package has been greatly increased, and the luminous power of LEDs is also gradually improving. However, such changes have brought about accumulation of heat. When the heat cannot be effectively dissipated from the LED package, so the temperature of the LED grain is too high, it will inevitably lead to the phenomenon of "light decay", that is, the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L25/03H01L27/15H01L23/367H01L21/48
CPCH01L2924/0002
Inventor 陈一璋
Owner 陈 一璋
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