36results about How to "Allow for any form" patented technology

The present invention relates to the identification and functional characterization of human cell-penetrating peptides (CPPs) and their use; in particular as transfection vehicles.

The present invention provides an aluminum alloy sheet for a lithographic printing plate which allows pits to be uniformly formed by electrochemical roughening, and excels in strength and heat softening resistance. The aluminum alloy sheet for a lithographic printing plate includes 0.1-0.3% of Mg, more than 0.05%, but 0.5% or less of Zn, 0.2-0.6% of Fe, 0.03-0.15% of Si, 0.02% or less of Cu, and 0.003-0.05% of Ti, the remainder being Al and impurities. The aluminum alloy sheet may include more than 0.05%, but 0.3% or less of Mn.

A method of forming a device, such as an electrode array for a cochlear implant. The method comprises a step of forming a predetermined pattern of relatively electrically conductive regions and relatively electrically resistive regions in a sheet of biocompatible electrically conductive material, such as platinum foil. The method can comprise a step of working on the sheet to remove predetermined portions therefrom to form the one or more discrete relatively conducting regions. The step of working on the sheet can comprise embossing the sheet, cutting or slicing the sheet, or using electrical discharge machining (EDM) to remove unwanted portions of the sheet, the EDM equipment having a cutting tool comprising an electrode.

A rotatable multi-operation tool for chip removing machining, including a plurality of replaceable cutting inserts of different types, and a basic body that is rotatable around a center axis and includes a rear end and a front end from which there is extending rearward an envelope surface in which at least one chip space, delimited by two opposite side surfaces, is countersunk, which opens in the envelope surface and in the front end. A first cutting insert is mounted in a first insert seat that is formed in one side surface of the chip space and situated in the immediate vicinity of the front end and included in a cavity that opens in the front end for the cutting insert to partly protrude axially forward from the front end. A second cutting insert, of a type other than the first cutting insert, is mounted in a second insert seat, which is formed in the same side surface as the first insert seat and situated axially behind the first insert seat. The second insert seat is included in a cavity that opens in a part of the envelope surface.

A custom-molded heat sink corresponds to an individual substrate and includes a heat sink lid having at least one cavity corresponding to at least one die mounted on a substrate. A conductive layer is deposited in the at least one cavity that substantially fills the space between the at least one cavity and the at least one die when the lid is coupled to the substrate.

A method of processing a semiconductor device is disclosed and comprises patterning a multi-layer photoresist which comprises an imaging layer overlying an underlying layer. The patterning of the resist defines an exposed portion of an underlying process layer. The method further comprises inspecting the patterned multi-layer photoresist for defects and re-working the patterned multi-layer photoresist upon a failed inspection. The re-work process comprises depositing a protection layer over the patterned multi-layer photoresist and over the exposed portion of the underlying process layer. A portion of the protection layer and the imaging layer are then removed in a concurrent manner while leaving a remaining portion of the protection layer covering the exposed portion of the underlying process layer. A remaining portion of the protection layer and the underlying layer are then removed in a concurrent manner and such removal does not adversely impact the process layer.

Provided is a support member assembly suitable for use in a contact probe head comprising a support member formed with a plurality of holder holes for supporting conductive contact members in a mutually parallel relationship, and a reinforcing member integrally formed with the support member and extending in a part of the support member devoid of any holder holes. The reinforcing member increases the overall mechanical strength of the support member assembly, and prevents the thermal deformation of the support member. Because the holder holes are formed in the support member made of material suitable for forming holes, such as plastic material and ceramic material, the holder holes can be formed at high precision and at low cost.

The present invention relates to a night vision system human machine interface and particularly to an HMI display that provides enhanced road scene imagery from low resolution cameras.

In a method for manufacturing a single electron memory device including a single electron storage element in a gate lamination pattern formed on a nano-scale channel region of a MOSFET, formation of the gate lamination pattern includes sequentially forming a lower layer and a single electron storage medium for storing a single electron tunneling through the lower layer on a substrate, forming an upper layer including a plurality of quantum dots on the single electron storage medium, forming a gate electrode layer on the upper layer to be in contact with the plurality of quantum dots, and patterning the lower layer, the single electron storage medium, the upper layer, and the gate electrode layer, in reverse order.

There is provided an electronic component including a ceramic sintered body having a plurality of internal electrodes formed therein, and external electrodes formed on an outer surface of the ceramic sintered body. Each of the external electrodes includes a copper (Cu) electrode layer electrically connected to the internal electrodes, a copper (Cu)-tin (Sn) alloy layer formed on an outer surface of the electrode layer, and a tin (Sn) plating layer formed on an outer surface of the alloy layer.

The present invention refers to a method for producing a quartz glass crucible for use in pulling silicon single crystal, said crucible having at least a double-layer structure comprising a pore-free transparent inner layer and an opaque base body or outer layer having pores, characterized in that at least the base body is formed with a silica powder maintained in a gas having a mixing ratio of 0.0005 to 0.0065 kg / kg (dry gas), and a quartz glass crucible produced by said production method. The obtained crucible has an average OH group concentration of 50 ppm or lower and is capable of suppressing the vibration occurring on the surface of silicon melt during pulling the silicon single crystal. Further the obtained crucible suffers less deformation of the crucible on pulling the silicon single crystal.

In the field of contactless power transfer for medical devices, more specifically, to contactless power transfer for intra-corporeal medical devices, a rechargeable power supply for an intra-corporeal medical device comprises an implantable power receiving means for wirelessly receiving power, and implantable power storage means. The implantable power receiving means is arranged and configured to receive power from an extra-corporeal power transmitting means for wirelessly transmitting power. The apparatus is particularly useful in the context of minimally invasive procedures.

In the field of contactless power transfer for medical devices, more specifically, to contactless power transfer for intra-corporeal medical devices, a system and method for transmitting power to a rechargeable power supply are provided, the rechargeable power supply comprising implantable power receiving means, and an implantable power storage means. The system comprises an extra corporeal power transmitting means arranged and configured to supply power to the rechargeable power supply by wirelessly transmitting power to the implantable power receiving means. The system and method are particularly useful in the context of minimally invasive procedures.

Provided is a support member assembly suitable for use in a contact probe head comprising a support member formed with a plurality of holder holes for supporting conductive contact members in a mutually parallel relationship, and a reinforcing member integrally formed with the support member and extending in a part of the support member devoid of any holder holes. The reinforcing member increases the overall mechanical strength of the support member assembly, and prevents the thermal deformation of the support member. Because the holder holes are formed in the support member made of material suitable for forming holes, such as plastic material, the holder holes can be formed at high precision and at low cost.

An electrochemical cell 30 which contains both a cathode 32 and an anode 34. The anode contains a mixture of uniformly shaped particles 10 and electrolyte. The anode can also contain a zinc powder comprising non-uniform shaped, which can be mixed with the uniformly shaped particles of the present invention.

Integrated circuits (1) on a wafer comprise a wafer substrate (2) and a structure applied on a surface (4) of the wafer substrate (2). The structure forms a plurality of integrated circuits (1) formed on the wafer substrate (2) and the integrated circuits (1) are separated by saw lines (6, 7). The structure comprises a plurality of superposed layers (9a-9e) formed on the wafer substrate (2) and a top layer (10) formed on the superposed layers (9a-9e). The integrated circuit (1) on the wafer further comprise a plurality of alignment marks (3) intended for aligning a separating device (18) for separating the integrated circuits (1) on the wafer into individual integrated circuits (1) during a separation process, wherein the alignment marks (3) are formed from at least one of the superposed layers (9a-9e).

Temperature compensation is performed using a computation program for temperature compensation, a computation processing, and a sensor. Deformation in a diaphragm caused by a pressure change due to the temperature of the gas in a cavity is cancelled out, and deformation of the diaphragm is minimized within the target temperature range, thereby allowing an optimum temperature compensation to be performed. The temperature compensation in a capacitance-type sensor executes calculation steps which include including a calculation step (S17) of acquiring the amount of change ΔC′ in capacitance. A parameter ΔC′ is obtained, through which it is possible to determine the degree of compensation for the deformation in the diaphragm section caused by a pressure change due to the temperature changes of the gas in the hermetically sealed space.

Provided is a support member assembly suitable for use in a contact probe head comprising a support member formed with a plurality of holder holes for supporting conductive contact members in a mutually parallel relationship, and a reinforcing member integrally formed with the support member and extending in a part of the support member devoid of any holder holes. The reinforcing member increases the overall mechanical strength of the support member assembly, and prevents the thermal deformation of the support member. Because the holder holes are formed in the support member made of material suitable for forming holes, such as plastic material and ceramic material, the holder holes can be formed at high precision and at low cost.

A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a CMP process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.

A housing part for a measurement device includes a single metal body having an outer circumferential side wall with an upper end and a lower end and an inner disc-shaped base wall located between the upper and lower ends, wherein the side wall and the base wall define two partially enclosed areas, where the base wall comprises a central hole into which a microwave-permeable glass or ceramic window is fused, microwave guides and dielectric matching elements are provided on both sides of the microwave-permeable or ceramic window to propagate microwaves between the desired points such as a radar antenna and radar electronics, and where the matching elements not only adjust the impedance of the microwave window to the impedances of the microwave guides but also put additional compression stress on the surfaces of the fused window, which are preferably ground flat to be flush with those of the center portion.

The present invention provides a core board and a manufacturing method thereof, in which the core board includes a nickel layer as a seed layer to improve the binding strength between an insulation layer and a conductive layer, so that it allows forming fine inner circuits by the semi-additive method.

Disclosed are various construction techniques for erecting a multistory building with an elevator shaft. In accordance with the method, upper and lower shaft components are formed at an offsite facility. These shaft components are then joined together to form a segment of the larger elevator shaft. Once constructed, the segment is transported to a jobsite and erected. Once an individual segment is installed, a floor slab can be formed about the segment. Using pre-cast elevator segments simplifies and expedites the construction process. In one embodiment, each segment includes a serrated edge that facilitates a connection between the floor slab and the shaft segment. Rebar and reinforcing dowels can also be used to improve the connection. Associated shaft constructions are also disclosed.

Disclosed are various construction techniques for erecting a multistory building with an elevator shaft. In accordance with the method, upper and lower shaft components are formed at an offsite facility. These shaft components are then joined together to form a segment of the larger elevator shaft. Once constructed, the segment is transported to a jobsite and erected. Once an individual segment is installed, a floor slab can be formed about the segment. Using pre-cast elevator segments simplifies and expedites the construction process. In one embodiment, each segment includes a serrated edge that facilitates a connection between the floor slab and the shaft segment. Rebar and reinforcing dowels can also be used to improve the connection. Associated shaft constructions are also disclosed.