Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
Hiro

40results about How to "Achieve high density" patented technology

Micro-vessel liver chip based on cell clusters and making method and using method thereof

The invention discloses a micro-vessel liver chip based on cell clusters. The micro-vessel liver chip comprises a micro-vessel system located on the upper layer, a blood-vessel-endothelium-like barrier system in the middle and a liver-organ multi-cell co-culture system on the lower layer, wherein the micro-vessel system and the liver-organ multi-cell co-culture system are arranged on own substrates respectively. The micro-vessel system comprises a bent vessel composed of multiple flow-stopping barriers in a staggered mode, and a micro-vessel inlet and a micro-vessel outlet are formed in the two ends of the bent vessel respectively. The blood-vessel-endothelium-like barrier system is composed of a porous film. The liver-organ multi-cell co-culture system comprises a cell cluster enrichment region and a multi-cell co-culture region, and a culture system inlet and a culture system outlet are formed in the two ends of the liver-organ multi-cell co-culture system respectively. A liver disease model can be established, research on pharmacokinetics and medicine activity can be performed, and the micro-vessel liver chip has the advantages of using a small quantity of samples, achieving medicine low consumption and being portable, economical, efficient and accurate.
Owner:SOUTHEAST UNIV

Packaging and interconnecting structure and method for copper protruded points filled up with double layers of underfill

The invention relates to a packaging and interconnecting structure and method for copper protruded points filled up with double layers of underfill. The packing and interconnecting structure is characterized in that the chip end is filled up with the first layer of underfill, the first layer of underfill is manufactured on a wafer through spin coating process, the substrate end is filled up with the second layer of underfill, the substrate end is filled through capillary effects after flip-chip welding is finished, the glass transition temperature and the Young modulus of the first layer of underfill are lower than those of the second layer of the underfill, a chip and a substrate are connected through the copper protruded points and tin-contained solder protruded points to achieve high-density connection, and the copper protruded points are manufactured in twice to guarantee that the first layer underfill is completely filled and the contact between the protruded points and the tin-contained solder is enough. The whole technological process is compatible with existing IC process and has higher vertical interconnection density, better electric connection characteristics and higher mechanical stability. Heating thermal circulation tests show that the service life of chips of the packaging structures is greatly prolonged.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

Iron-based soft magnetic powder for powder magnetic core, method for producing the iron-based soft magnetic powder for powder magnetic core, and powder magnetic core

The present invention provides an iron-based soft magnetic powder for powder magnetic cores, which does not use rare metals, can maintain electrical insulation between iron powder particles even when heat treatment is performed at a high temperature, and has excellent thermal stability and mechanical strength. In addition, the present invention provides a method for producing the above-mentioned iron-based soft magnetic powder for powder magnetic cores and a powder magnetic core. In the iron-based soft magnetic powder for dust cores of the present invention, a phosphoric acid-based chemical conversion coating is formed on the surface of the iron-based soft magnetic powder, and a silicone resin coating is formed on the surface of the phosphoric acid-based chemical conversion coating. The phosphoric acid-based chemical conversion coating contains P, B, Mg, and Al.
Owner:KOBE STEEL LTD

Micro-stirring friction welding process for electronic packaging

The invention discloses a micro-stirring friction welding process for electronic packaging and belongs to the technical field of electronic packaging. The problem that an existing electronic packagingtechnology is not ideal in densification and pollution freeness achieving effect and the problem that an existing stirring friction welding technology can hardly achieve direct welding on micro, small and thin structures. Firstly, a first bonding pad and a second bonding pad to be welded serve as a welding pad set; when the welding pad set is arranged at single points, a press-in hole is prefabricated and machined in a first substrate, the welding pad set is arranged between the first substrate and a second substate in parallel, the press-in hole and the center position of the welding pad setare arranged in a centering manner, and then the first substrate and the second substrate are compressed through a clamp; and a stirring head is coaxially aligned to the upper portion of the press-inhole, the stirring head is controlled to rotate at high speed and move downwards into the press-in hole and then is pressed into the first welding pad; and under the set press-in amount and holding time, the permanent metallurgy connection of the first welding pad and the second welding pad is achieved, and finally the stirring head is controlled to move out of the press-in hole upwards.
Owner:HARBIN INST OF TECH

Production process of high-density velvet

The invention discloses a production process of high-density velvet. The production process comprises the following steps of interweaving warp yarns, weft yarns and pile warp yarns, cutting velvet, and carrying out after-treatment to obtain the high-density velvet. Pile heads protruding out of the base cloth are arranged between every two wefts of the prepared high-density velvet. In a first dent,one pile warp is added to two pile warps to form three pile warps, in the second dent, one pile warp is added to two pile warps to form three pile warps, and the pile warp consolidation weft of the second dent is one-weft staggered with the pile warp consolidation weft in the first dent. In this way, the pile warps in the two dents are clamped by the left ground warp and the right ground warp which are adjacent to each other, the W consolidation fastness is improved, pile roots of the pile warps are protected by the other two ground warps, and therefore although only one pile warp is additionally arranged in each dent, one pile head can be arranged between every two wefts due to the fact that the pile warps are properly added, and the velvet can truly reach high density and is deeply loved by the customer.
Owner:ZHEJIANG INNOVATION TEXTILE CO LTD

Copper bump package interconnection structure and method filled with double-layer underfill glue

The invention relates to a packaging and interconnecting structure and method for copper protruded points filled up with double layers of underfill. The packing and interconnecting structure is characterized in that the chip end is filled up with the first layer of underfill, the first layer of underfill is manufactured on a wafer through spin coating process, the substrate end is filled up with the second layer of underfill, the substrate end is filled through capillary effects after flip-chip welding is finished, the glass transition temperature and the Young modulus of the first layer of underfill are lower than those of the second layer of the underfill, a chip and a substrate are connected through the copper protruded points and tin-contained solder protruded points to achieve high-density connection, and the copper protruded points are manufactured in twice to guarantee that the first layer underfill is completely filled and the contact between the protruded points and the tin-contained solder is enough. The whole technological process is compatible with existing IC process and has higher vertical interconnection density, better electric connection characteristics and higher mechanical stability. Heating thermal circulation tests show that the service life of chips of the packaging structures is greatly prolonged.
Owner:SHANGHAI INST OF MICROSYSTEM & INFORMATION TECH CHINESE ACAD OF SCI

A kind of microvascular liver chip based on cell aggregates and methods of making and using the same

The invention discloses a micro-vessel liver chip based on cell clusters. The micro-vessel liver chip comprises a micro-vessel system located on the upper layer, a blood-vessel-endothelium-like barrier system in the middle and a liver-organ multi-cell co-culture system on the lower layer, wherein the micro-vessel system and the liver-organ multi-cell co-culture system are arranged on own substrates respectively. The micro-vessel system comprises a bent vessel composed of multiple flow-stopping barriers in a staggered mode, and a micro-vessel inlet and a micro-vessel outlet are formed in the two ends of the bent vessel respectively. The blood-vessel-endothelium-like barrier system is composed of a porous film. The liver-organ multi-cell co-culture system comprises a cell cluster enrichment region and a multi-cell co-culture region, and a culture system inlet and a culture system outlet are formed in the two ends of the liver-organ multi-cell co-culture system respectively. A liver disease model can be established, research on pharmacokinetics and medicine activity can be performed, and the micro-vessel liver chip has the advantages of using a small quantity of samples, achieving medicine low consumption and being portable, economical, efficient and accurate.
Owner:SOUTHEAST UNIV

Terminal mounting structure, cable connector and connector assembly

The invention relates to a terminal mounting structure, a cable connector and a connector assembly. The terminal mounting structure comprises an insulator seat (51) andterminal assemblies. The terminal assemblies are installed in the insulator seat in a row mode, each terminal assembly comprises paired signal terminals (61) and grounding terminals (62), the paired signal terminals form a differential signal pair (63), and the differential signal pair (63) is arranged between the grounding terminals (62); one end, extending out of the insulator seat, of the terminal assembly is an elastic contact area (601), and the other end of the terminal assembly is a wiring area (603) connected with a cable; and the insulator seat (51) is provided with at least two rows of terminal assemblies at intervals in the front-back direction. By means of the technical scheme, the terminals are arranged in rows and assembled on the front row and the rear row of the insulator seat respectively, the high-speed transmission performance is improved, and meanwhile the size of the connector can be effectively reduced.
Owner:CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD

Imaging apparatus

This imaging apparatus includes a solid-state imaging device and a substrate. The solid-state imaging device includes a pixel array in which a plurality of pixels is arranged in a two-dimensional matrix, and a pad (51) which is provided corresponding to a pixel column of the pixel array and outputs signals from the pixels in the pixel column. A group of signal output terminals has a plurality of the pads (51) arranged in a line along the column direction of the pixel array. The group of signal output terminals is arranged in the row direction of the pixel array. A substrate (6) includes, for each group of signal output terminals, a laminated wiring obtained by laminating a plurality of wiring layers extending in the column direction of the pixel array. The laminated wiring (32) includes first terminal portions (61) provided at the positions corresponding to the pads (51) of the group of signal output terminals. The pad (51) and the first terminal portion (61) are coupled to each other via a bump (9).
Owner:NIKON CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products