Micro-stirring friction welding process for electronic packaging

Abstract

The invention discloses a micro-stirring friction welding process for electronic packaging and belongs to the technical field of electronic packaging. The problem that an existing electronic packagingtechnology is not ideal in densification and pollution freeness achieving effect and the problem that an existing stirring friction welding technology can hardly achieve direct welding on micro, small and thin structures. Firstly, a first bonding pad and a second bonding pad to be welded serve as a welding pad set; when the welding pad set is arranged at single points, a press-in hole is prefabricated and machined in a first substrate, the welding pad set is arranged between the first substrate and a second substate in parallel, the press-in hole and the center position of the welding pad setare arranged in a centering manner, and then the first substrate and the second substrate are compressed through a clamp; and a stirring head is coaxially aligned to the upper portion of the press-inhole, the stirring head is controlled to rotate at high speed and move downwards into the press-in hole and then is pressed into the first welding pad; and under the set press-in amount and holding time, the permanent metallurgy connection of the first welding pad and the second welding pad is achieved, and finally the stirring head is controlled to move out of the press-in hole upwards.

Description

technical field [0001] The invention relates to a micro-stir friction welding process for electronic packaging, belonging to the technical field of electronic packaging. Background technique [0002] With the rapid development of information technology and electronic industry, electronic products are increasingly integrated into daily life, such as mobile communication equipment, computers, etc. are widely used; on the other hand, in aerospace, intelligent transportation and national defense military In the high-tech field, electronic products also play an irreplaceable role. These applications require electronic products to be smaller, lighter, higher density, better performance, and more reliable, which drives the rapid development of integrated circuit packaging and electronic packaging technology, which puts forward two key points for the current electronic packaging field Sexual science issues: high-density and pollution-free. [0003] The first is high density. The p...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to solve the problem of unsatisfactory high-density and pollution-free effect of the existing electronic packaging technology, and the problem that the existing friction stir welding technology is difficult to realize direct welding of micro, small and thin structures, and further provides A Micro Friction Stir Welding Process for Electronic Packaging

Images