A method executes computerized instructions within an integrated and packaged
semiconductor device using a centralized
programming interface within the packaged
semiconductor device to perform in-
system preventive and
recovery actions, configure and issue stimulus to chips, components and sensors within the
semiconductor device. The method monitors
chip, components and sensors within the packaged
semiconductor device, using the centralized
programming interface, to measure characteristics of the packaged
semiconductor device in response to the stimulus. The structure including chips, components and sensors produce outputs representing the characteristics. The method performs an evaluation to determine whether the
chip, component and sensor outputs are within predetermined limits, using the centralized
programming interface; and reports occurrences of instances of the
chip, component and sensor outputs being outside the predetermined limits, using the centralized programming interface, to an on-chip storage medium, external
test equipment or computerized device outside of the packaged
semiconductor device.