The invention discloses an improved direct
laser drilling
processing method. The improved direct
laser drilling
processing method is characterized by including the steps of laminating and direct
laser drilling. The laminating includes the steps of opening a window in a
copper foil on a
skylight layer in a milled mode to form a
window opening target region, conducting laminating
processing by using a folded plate table
infrared ray generator to generate
infrared rays to form four intersected
ray pots to locate
window opening target regions when folded plates are laminated, and conducting melanism processing. The direct
laser drilling includes the steps of conducting
ablation on prepregs exposed out of the four
window opening target regions of the
copper foil on the
skylight layer through a preset procedure, enabling a sub-outer-layer receiving disc and an aligning target hole to be exposed out, and conducting direct
laser drilling with the aligning target hole serving as a location standard. According to the improved direct
laser drilling processing method, the mode that the window is directly opened at the position of a location target in the
copper foil on the
skylight layer is adopted, the problem that the
ablation state of the location target is inconsistent due to uneven preprocessing is thoroughly solved, the production process is stable, the production efficiency is obviously improved, the
infrared ray intersected ray pots are used for locating, the location accuracy is improved, and the
laser ablation quality of the aligning target hole is sufficiently guaranteed.