The invention relates to environment-friendly and low-temperature residue-free
solder paste and a preparing method thereof. According to the technical scheme, the environment-friendly and low-temperature residue-free
solder paste is characterized in that the
solder paste comprises, by weight, 41.0%-60.0% of Sn, 26.6%-37.7% of Bi, 2.1%-4.4% of a third element
alloy and 9.0%-19.0% of scaling
powder; and the scaling
powder comprises, by weight, 67.0%-75.0% of a carrier, 14.8%-18.8% of an activating agent, 4.6%-8.72% of a thixotropic agent, 0.32%-3.2% of a surface
active agent and 1.48%-3.5% of
corrosion inhibitor. The environment-friendly and low-temperature residue-free solder paste is provided,
halogen-free components are adopted in a formula, volatile components are avoided in the
tin paste, and smells are avoided during using. After
welding, residues are colorless and transparent, and the effect of replacing Pb containing
tin paste or
halogen-containing
tin paste is achieved. Under the low-temperature
welding condition, nano aluminum
powder is added, a high-temperature
solid solution is formed during
welding to serve as an auxiliary part for supplementary welding, poor welding of a Sn-Bi
alloy is effectively improved, and the welding requirement for aluminum components on the surface of an
electronic component can be met; and meanwhile, the storage period of the tin paste is prolonged, and better wettability is brought.