46results about How to "Suppress transmission loss" patented technology

A shielded flat ribbon cable includes a plurality of insulated conductors being spaced parallel to each other, the insulated conductors each including an inner conductor and an insulation coating the inner conductor; an outer conductor bundling the insulated conductors together, the outer conductor including a first shell and a second shell in association with each other to sandwich the insulated conductors therebetween, each of the first shell and the second shell including a plurality of grooves covering outer surfaces of the insulated conductors, and a plurality of edge portions integral with both sides of the grooves, and gap formation-suppressing means for suppressing formation of gaps between the edge portions of the first shell and the edge portions of the second shell, respectively.

A method of manufacturing a photonic band gap fiber base material includes: a forming step of continuously forming a columnar core glass body 10 and a clad glass body 20 which coats the core glass body to obtain an intermediate base material 110; a hole making step of making holes 30 in the clad glass body 20; an insertion step of inserting in the holes 30 a plurality of bilayer glass rods 40 in which an outer layer 42 which has the same refractive index as the clad glass body coats high refractive index portions 41 having a higher refractive index than a refractive index of the clad glass body 20; and a heating step of heating the intermediate base material 110 and integrating the intermediate base material 110 and the bilayer glass rods 40.

In the transmission apparatus comprising a PMMA plastic fiber 3 and a semiconductor light emitting element 5 to emit the light 9 transmitted through the plastic fiber 3, the element which can emit the light 9 having the wavelength within the range of 630 to 680 nm is used as the semiconductor light emitting element 5. Moreover, there is provided a temperature adjusting mechanism comprising a heating means 7 for heating the semiconductor light emitting element 5, a temperature detecting means for detecting the temperature of the semiconductor light emitting element 5, and a control circuit 8 for setting the temperature of the semiconductor light emitting element 5 to a predetermined target value which is lower than the maximum temperature assumed under the environment for locating thereof by controlling the drive of the heating means 7 based on a temperature detecting signal S outputted from the temperature detecting means 4.

The present invention relates to a surface-treated copper foil, a copper foil with a carrier, a laminate, a printed wiring board, an electronic device, a method for manufacturing a surface-treated copper foil, and a method for manufacturing a printed wiring board. It provides a surface-treated copper foil having good peel strength and capable of suppressing transmission loss well even if it is used for a high-frequency circuit board. The surface-treated copper foil has, in order, a copper foil, a metal layer containing one or more elements selected from the group consisting of Ni, Co, Zn, W, Mo, and Cr, and a surface-treated layer formed of chromium oxide. The total adhesion amount of elements selected from the group consisting of Ni, Co, Zn, W, Mo and Cr in the metal layer is 200-2000 μg / dm2, and after applying heat treatment at 250 ° C for 10 minutes, only the surface treatment layer is exposed When the state of the surface is immersed in a nitric acid bath with a concentration of 20mass% and a temperature of 25°C for 30 seconds, the amount of copper dissolved in the nitric acid bath is below 0.0030g / 25cm2.

A spin valve element including parallelly or serially connected magnetic element groups, each magnetic element group having a plurality of magnetic elements that each include an intermediate layer of an insulating member or a nonmagnetic member sandwiched by a pair of ferromagnetic layers. The plurality of magnetic elements are further connected either in series or in parallel.

The present invention provides a transmission apparatus including transmitting side line interfaces which convert packet format data sent from an asynchronous network to a SONET / SDH frame format and then transmit the data, multiple receiving side line interfaces which receive the SONET / SDH frame format data and convert the data to packet format data and a circuit switching section which performs circuit switching. The transmitting side line interfaces include a variable length frame mapping section which converts the packet format data to variable length frame format data and a time division multiplexing mapping section which converts the variable length frame format data to the SONET / SDH frame format data. The receiving side line interfaces include a variable length frame demapping section which reconverts the SONET / SDH frame format data to variable length frame format data.