Surface-treated copper foil for printed circuit board, copper-clad laminate for printed circuit board, and printed circuit board
A technology for printed circuit boards and copper clad laminates, which is applied in the secondary processing of printed circuits, printed circuits, and printed circuit manufacturing. , Excellent durability and high adhesion
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[0103] Hereinafter, the present invention will be described in more detail based on examples. In addition, the following is an example of the present invention, and in carrying out the present invention, various forms can be adopted as long as they do not deviate from the gist of the present invention.
[0104] [production of copper foil]
[0105] Electrolytic copper foil or rolled copper foil is used as the copper foil of the base material for roughening treatment.
[0106] In Examples 1, 2, 4, 5, 7, 8, Comparative Examples 1 to 4, and 7, and Reference Example 1, an electrolytic copper foil having a thickness of 12 μm produced under the following conditions was used.
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[0109] (additive)
[0110] 3-mercapto 1-propanesulfonate sodium: 2mg / L,
[0111] ·Hydroxyethyl cellulose: 10mg / L,
[0112] ·Low molecular weight glue (molecular weight: 3000): 50mg / L.
[0113] In Examples 3 and 6 and Comparative Examples 5 and 6, a commercially available 12 μm toughe...
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