111results about How to "Loss of characteristic" patented technology

A radiator includes a waveguide having an aperture and a patch antenna disposed in the aperture. In one embodiment, an antenna includes an array of waveguide antenna elements, each element having a cavity, and an array of patch antenna elements including an upper patch element and a lower patch element disposed in the cavity.

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

Provided is a bend-insensitive optical fiber including a core centered at the optical fiber, a cladding surrounding the core and having a lower refractive index than the core, a coating layer surrounding the cladding, and a region formed in the cladding and having a lower refractive index than the cladding, wherein the coating layer has a multilayered structure and a total outer diameter of 240 μm or less, and a bend-insensitive optical cable comprising the same.

A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.

A band-pass filter has a ladder-type circuit including first and second terminals whose characteristic impedances are Z0, and series elements and shunt elements disposed between a first terminal and a second terminal, each of the series elements and shunt elements containing a film bulk acoustic resonator. Assuming that characteristic impedance of any one of the series elements is Z1 and that characteristic impedance of any one of the shunt elements is Z2, the characteristic impedances Z0, Z1, and Z2 have a relation of 1<(Z1 / Z0)<2, preferably 1.3<(Z1 / Z0)<1.7, and 0.5<(Z2 / Z0)<1, preferably 0.6<(Z2 / Z0)<0.8.

A radiator includes a waveguide having an aperture and a patch antenna disposed in the aperture. In one embodiment, an antenna includes an array of waveguide antenna elements, each element having a cavity, and an array of patch antenna elements including an upper patch element and a lower patch element disposed in the cavity.

A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.

A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, or processor mounted on a circuit board to a backplane. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.

A wire to board connector is provided for connecting cables of cable bypass assemblies to circuitry mounted on a circuit board. The connector has a structure that maintains the geometry of the cable through the connector. The connector includes a pair of edge coupled conductive signal terminals and a ground shield to which the signal terminals are broadside coupled. The connector includes a pair of ground terminals aligned with the signal terminals and both sets of terminals have J-shaped contact portions that flex linearly when the connector is inserted into a receptacle. In another embodiment, the signal terminal contact portions are supported by a compliant member that may deflect when the connectors engage contact pads on a substrate.

The specification describes an improved optical fiber produced by a hybrid VAD / MCVD process. The core of the fiber is produced using VAD and the inner cladding layer has a depressed index and is produced using MCVD. In preferred embodiments, the optical power envelope is essentially entirely contained in VAD produced core material and the MCVD produced depressed index cladding material. Optical loss is minimized by confining most of the optical power to the VAD core where OH presence is low, as well as by maximizing the optical power in the un-doped silica region. The MCVD substrate tube material is essentially devoid of optical power.

A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, or processor mounted on a circuit board to a backplane. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.

A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a chip, processor or circuitry mounted on a circuit board to other similar components. The bypass cable assembly has a structure that maintains the geometry of the cable in place from the chip to the connector and then through the connector. The connector includes a plurality of conductive terminals and shield members arranged within an insulative support frame in a manner that approximates the structure of the cable so that the impedance and other electrical characteristics of the cable may be maintained as best is possible through the cable termination and the connector.

A connector assembly that is mountable on a circuit board includes a casing having a metallic housing. The housing has at least one receptacle where a connecting element is mounted. A shielded cable connects between the connecting element and an interconnect that is attached to the casing. The interconnect has a plurality of contact elements adapted to contact the circuit board. The metallic housing can be fitted with any one of variously colored insulating shells either during manufacture or in the field. The shell can later be slidably removed and replaced, even after the housing was attached to a circuit board. The casings can have dovetail slots that mate with dovetail ridges on an insert used to attach the casings together.

For an electrical reluctance rotary machine, a stator has a winding as an armature, and a rotor has permanent magnet implanting slots provided in a rotor core at lateral sides magnetic poles configured to produce reluctance torque along directions of magnetic flux passing through the magnetic poles to produce reluctance torque, and permanent magnets inserted in the permanent magnet implanting slots so as to cancel magnetic flux of the armature intersecting that magnetic flux, to control a magnetic field leaking at ends of the magnetic poles, having circumferential magnetic concavo-convex. The electrical reluctance rotary machine is configured to meet a relationship, such that1.6≤P×WpmR≤1.9where Wpm [mm] is a width of permanent magnet, R [mm] is an outer-diametrical radius of the rotor, and P is the number of poles.

A multilayer circuit board assembly includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the circuit board assembly. The RF interconnects can include one or more RF matching pads which provide a mechanism for matching impedance characteristics of RF stubs to provide the RF interconnects having desired insertion loss and impedance characteristics over a desired RF operating frequency band. The RF matching pads allow the manufacture of circuit boards having RF interconnects without the need to perform any back drill and back fill operation to remove stub portions of the RF interconnects in the multilayer circuit board assembly.

An extension housing (C) for a cable TV multi-tap device is made up of extension tubes (A) in coaxially aligned relation to one another for the purpose of providing wider bandwidth subscriber multi-taps with a longer extension coaxial connector to span the distance between a TV coaxial cable ends without affecting performance. An RF signal connector (H) is inserted in each tube having a dielectric insulator (D) at one end, an elongated conductor (15) having a bore (17) extending through its greater length and longitudinally split segments (14) surrounding the bore for insertion of a conductor pin (10) extending from a cable connector at the end of the extension tube and inserted through the dialectric insulator into the bore and a second conductor pin (16) extending from the elongated conductor into contact with a face plate connector (G) in the housing. In one form of invention the second conductor pin extends through a second dielectric insulator (E) into contact with the face place connector. In another form of invention, a printed circuit board (50) is interposed between the second conductor pin (10') and the connector (H') to establish a predetermined impedance in the RF signal connector.

A receiver optical amplifier assembly (ROSA) is disclosed that provides for greater tolerances in alignment. The ROSA includes a multimode fiber stub to receive a light beam from a single mode optical fiber. The light beam from the multimode fiber stub is focused by a lens system onto the active area of an optical detector chip. The multimode fiber stub acts as a GRIN lens and allows for optimization of the spot size on the active area. Additionally, in some embodiments the return loss characteristics of the ROSA can be greatly improved by including an angled surface on the multimode fiber stub and moving the active area of the optical detector chip off-axis to compensate.

This invention provides a rubber composition comprising: a softening agent including a hydrogenated naphthenic oil of which an extract quantity of dimethylsulfoxide (DMSO) by IP 346 method is controlled to less than 3% by weight and blending at least one selected from a group of (1) a styrene-butadiene copolymer rubber with a bond styrene quantity in molecular of from 10% by weight to 60% by weight and with a vinyl bond quantity of the butadiene part of from 10% to 80% and (2) a butadiene rubber with a cis bond quantity of at least 30%. The rubber composition is superior in fracture characteristics, loss characteristic and wear resistance, and it is applicable to various rubber products, a pneumatic tire and, in particular, a tire tread.

There is provided a high frequency switch which is satisfactory in terms of both insertion loss characteristics and harmonic characteristics. The high frequency switch includes: a common port outputting a transmission signal to an antenna; a plurality of transmission ports each having the transmission signal input thereto; and a plurality of switching units each connected between the plurality of transmission ports and the common port to conduct or block the transmission signal from each of the transmission ports to the common port, wherein each of the switching units includes a plurality of series-connected MOSFETs formed on a silicon substrate, the plurality of MOSFETs are any one of body contact-type FETs and floating body-type FETs, and each of the switching units includes both of the body contact-type FETs and the floating body-type FETs.

The present invention provides inexpensively a planar antenna module that is able to realize a loss reduction, a reduction in characteristic variation caused by an assembling error, and an improved stability in frequency characteristics. A planar antenna module according to one preferred embodiment of the present invention comprises an antenna portion (101), a feeder portion (102), and a connection plate (18). The antenna portion (101) includes a first ground plate (11) having a first slot (21), a second ground plate (12) having dielectrics, an antenna substrate having a radiation element (41), a third ground plate (13) having dielectrics, a fourth ground plate (14). The feeder portion (102) includes the fourth ground plate (14), a fifth ground plate (15), a feed substrate (50), a sixth ground plate (16), a seventh ground plate (17). The connection plate (18) has a second waveguide opening portion (64). The connection plate (18) to be connected with a high frequency circuit, the seventh ground plate (17), the sixth ground plate (16), the feed substrate (50), the fifth ground plate (15), the fourth ground plate (14), the third ground plate (13) including the third dielectric (33) and the fourth dielectric (34), the antenna substrate (40), the second ground plate (12) including the first dielectric (31) and the second dielectric (32), and the first ground plate (11) are stacked in this order.

The present invention relates to a plastic photonic crystal fiber for terahertz wave transmission and a method for the manufacturing thereof. More particularly, the present invention is directed to a plastic photonic crystal fiber that can be easily manufactured and has low loss characteristics to be used as a waveguide of terahertz waves. The plastic photonic crystal fiber includes a crystal defect component having a longitudinal axis and a photonic crystal component surrounding the crystal defect component. The photonic crystal component has an array of a plurality of plastic elements having longitudinal axes and forming a 2-dimensional photonic crystal structure with a predetermined lattice constant. Further, the plastic photonic crystal fiber of the present invention can be used as a preform from which a plastic photonic crystal fiber for an optical communication (400-800 nm) can be drawn.

A radome for an antenna is provided as a composite of an isotropic outer layer and a structural layer of foamed polymer material. The composite is dimensioned to enclose an open end of the antenna. The radome may be retained upon the antenna by a retaining element and fasteners. The outer layer may be a polymer material with a water resistant characteristic.

A piezoelectric thin film resonator includes a substrate, and a resonator section formed above the substrate and having a first electrode layer, a piezoelectric layer and a second electrode layer in which acoustic vibration is generated in a thickness direction of the piezoelectric layer by application of an electric field to the piezoelectric layer by the first electrode layer and the second electrode layer, wherein at least one pair of sides of a plane configuration of the resonator section are in parallel with each other, and the shortest distance in a spacing between the parallel sides in the pair is less than a thickness of at least the resonance section.

A soundproof material is provided with a first sound absorbing layer arranged on a vehicle panel, a second sound absorbing layer closer to an inner side of a passenger compartment, and an intermediate layer provided between the sound absorbing layers. The intermediate layer is constituted by two layers having a high-density layer and a low-density layer. The air permeability of the intermediate layer is set lower than the first sound absorbing layer and the second sound absorbing layer. The intermediate layer is arranged in such a manner that the high-density layer is adjacent to the second sound absorbing layer.