The invention discloses an ultrahigh cleaning process for
semiconductor parts, and relates to the technical field of cleaning of
semiconductor parts. Comprising the following steps: S1,
degreasing and cleaning; s2, filtering and cleaning for the first time; s3, soaking in hot water; s4, soaking in an
alkaline etching tank; s5, filtering and cleaning for the second time; s6, soaking in an
acid etching tank; s7, filtering and cleaning for the third time; s8, soaking in a
pickling tank; s9, filtering and cleaning for the fourth time; s10, performing high-pressure flushing treatment; s11, hot water ultrasonic cleaning; s12, filtering and cleaning for the fifth time; s13, carrying out blow-
drying treatment; and S14, high-temperature
drying. The ultrasonic
degreasing agent tank is arranged for cleaning the aluminum
alloy parts, then hot water soaking, alkali
etching tank soaking,
acid etching tank soaking, high-pressure flushing treatment and hot water ultrasonic cleaning are sequentially carried out, and first-time filtering cleaning, second-time filtering cleaning, third-time filtering cleaning, fourth-time filtering cleaning and fifth-time filtering cleaning are matched; therefore,
dust particles,
metal ions, oil stains and smudginess of the parts are removed.