42results about How to "Reduced likelihood of stripping" patented technology

When electric wires (joint conductors) are disposed adjacent each other in a peeled state of coatings, a gap corresponding to the total thickness of both conductors' insulating films as skin layers is formed between end joined face portions of the conductors. The gap becomes larger because the conductors are tapered. Therefore, the adhesion between both conductors is impaired, with a consequent fear of occurrence of joining imperfection. In opposed joined face portions of electric wires (joint conductors), the conductors are deformed from the tips of their axes to the joined face side in such a manner that exposed portions at the tips of the conductors and insulating film faces located in the vicinity thereof are flush with each other or the exposed portions are projected. The gap formed between the electric wires (joint conductors) can be diminished, whereby the reliability of connection is improved and it becomes easier to perform the work of joint conductors, with the result that the productivity of a stator of a rotary electric machine such as an AC generator for a vehicle could be improved.

The invention relates to a manufacturing process of a leakage liquid detection sensor of a circuit formed by utilizing ion sputtering coating. A heat-resistant and corrosion-resistant material is adopted to be taken as a substrate film, an insulating substance coating is formed on the upper surface of the substrate film by utilizing ion sputtering coating process, and two double-conduction lines are fabricated on the insulating coating through adoption of an ion sputtering coating manner; the upper surface of insulating coating is provided with a bonding layer and a protective film layer which are attached to each other; if a uniform conductive film is formed on a surface of the whole body of the substrate film or the insulating coating, film coating is performed after further coverage of a shielding adhesive tape, the shielding adhesive tape is removed after the ion sputtering coating process, and then a conduction line is formed; and a liquid leakage detection device is fabricated. The manufacturing process is advantageous in that various liquids or moisture can be prevented from resulting in corrosion occurring in the conduction line, leakage of a conductive liquid can be accurately detected, and occurrence of false alarms is minimized; reliability of the liquid leakage detection device is improved; and improvement of a bonding force between the film layers is facilitated, the stripping possibility of the upper-layer protective film layer is reduced, and the reject ratio of products is reduced.

The invention provides a paint prefabricated film, a protection structure and a preparation method of the protection structure. The surface, deviated from a back glue layer, of a substrate base material layer is a smooth plane, the smooth plane has the relatively low surface tension, and a paint coating formed on the surface of the smooth plane can be more uniform in thickness and fewer in insidedefects, so that the quality is higher; a plurality of bulge parts are arranged on the surface, facing the back glue layer, of the substrate base material layer, so that the binding force of the substrate base material layer and the paint coating is smaller than that of the substrate base material layer and the back glue layer, separation of the paint coating from a paint prefabricated film base body can be realized by the aid of the external force, and the paint coating is used for protecting the outer surface of a wind turbine blade base body. The paint prefabricated film is applied to preparation of the wind turbine blade protection structure, and the large-area damage to the paint coating due to sand erosion and rain erosion of the area having the low thickness of the paint coating dueto the non-uniform thickness of the paint coating can be avoided, so that the protection effect of the protection structure can be improved.

The invention belongs to the field of material chemistry and relates to a preparation method for a cathode material of a lithium ion battery. The method comprises three steps: preparing graphene oxide, preparing foam graphene and preparing a foam graphene compound indium zinc sulfide material. The cathode material with higher charge-discharge specific capacity and better cycle performance is acquired by introducing graphene foams and indium zinc sulfide as cathode active materials; the initial charge-discharge capacity can reach up to 742.17mAh/g; after 200 times of circulation, the cathode material still has a reversible capacity of 415.23mAh/g.

An electrode structure where a sacrifice film is removed without removing another insulating film and a method for manufacturing a thin-film structure. There are formed anchor holes for opening the surface of a wiring line which is covered with a sacrifice film and a nitride film. The anchor hole is formed of a hole portion of the nitride film and an opening of the sacrifice film. The diameter ofthe hole portion is smaller than the width of the wiring line by a first predetermined distance from the edge of the surface of the wiring. The diameter distance from the hole portion. Because of thepresence of the first and second predetermined distances, the distance by which the etchant for removing the sacrifice film penetrate into an oxide film.

The embodiment of the invention provides a display panel and a manufacturing method thereof, and a display device, and related to the field of display technology, which are used to solve the problem that the encapsulation layer in the display panel in the prior art is easy to peel off. The display panel includes a display area and a non-display area surrounding the display area; the display area includes a plurality of light emitting units; each of the light emitting units includes a first electrode, a light emitting layer and a second electrode which are arranged in a stack; the non-display area includes a metal layer and an inorganic layer, which contact each other, wherein the metal layer is electrically connected to the second electrodes located in the display region, and the metal layer includes an opening, the opening is filled with an organic layer, and the organic layer is in contact with the metal layer and the inorganic layer.

The invention discloses a semiconductor packaging mould, a semiconductor device and a packaging method of the semiconductor device. The semiconductor packaging method comprises the steps that a packaging substrate is provided, and a plurality of chips are stacked on the packaging substrate; the chips are covered with the packaging mould, thus a chip accommodating cavity accommodates all the chips,and the contour surface shape of the chip accommodating cavity is matched with the contour surface shapes of the stacked chips; and a packaging material is injected into the chip accommodating cavitythrough an injection hole. The outer contour surface of the chip accommodating cavity is matched with the outer contour surfaces of the stacked chips, so that the thickness of the subsequently formedpackaging material is small and uniform, and the chips and the packaging material are prevented from warping.

A ceramic tile (1) for combustion chambers lining, in particular of gas turbines, comprises a base body (2) made of ceramic material, for example in alumina or in alumina-mullite, and a coating (3) applied to at least one face (4) of the base body (2). The coating (3) is a multilayer ceramic coating, comprising at least one outer layer (6) made of alumina or ceramic material comprising alumina, and at least one intermediate layer (5), arranged between the outer layer (6) and the base body (2) and made of ceramic material comprising mullite and preferably in mullite or in alumina-mullite.

The invention provides a display device, a display panel and a packaging method of a display substrate, and relates to the technical field of display. The packaging method comprises that: a display substrate is provided, the display substrate comprises a driving backboard and a light-emitting function layer which are arranged in a laminated mode, and the light-emitting function layer comprises a plurality of light-emitting units distributed in an array mode and a pixel definition layer for separating the light-emitting units; at least one packaging layer is formed on the side, deviating from the driving backboard, of the light-emitting function layer, each packaging layer comprises a first inorganic layer, an organic layer and a second inorganic layer, the organic layer is located on the side, deviating from the driving backboard, of the first inorganic layer, and the organic layer is provided with a through hole right opposite to the pixel definition layer; and the second inorganic layer is located on the side, away from the light-emitting function layer, of the organic layer and connected with the first inorganic layer through the through hole. According to the display device, the display panel and the packaging method of the display substrate, stripping of the packaging layer can be avoided, and the packaging effect is improved.

The invention provides a physical quantity sensor, a manufacturing method thereof, electronic equipment, and a movable body. The physical quantity sensor can decrease the possibility that a cover might come off from a base. The physical quantity sensor (100) includes: a base (10); a cover (20); a function element (102) provided inside a cavity (2) formed by the base (10) and the cover (20); and a protection film (30) with which a principal surface (12) of the base (10), a bonding boundary portion (4) between the principal surface (12) of the base (10) and the cover (20), and the cover (20) are coated continuously, wherein the protection film (30) is an inorganic material film or an organic semiconductor film.

The invention discloses a flexible printed circuit board used for a touch panel. The flexible printed circuit board comprises flexible printed circuit board alignment marks arranged on the flexible printed circuit board and provided with outer sides, and dummy patterns arranged on the flexible printed circuit board and abutted to the outer sides of the flexible printed circuit board alignment marks.