The invention belongs to the technical field of
semiconductor processing, and particularly relates to
wafer testing equipment which comprises a base and a mounting plate, the mounting plate is erected above the base, a rubber ball is in contact with a
wafer,
wafer lifting and
air pump operation are achieved, air inlet of an air
storage tank is achieved, air inlet of an air bag is achieved through a guide
pipe, and after air inlet of the air bag, the air inlet of the air bag is closed. A sliding buckle is arranged at the bottom of the supporting plate, in the pushing process, the sliding buckle slides along a guide rail, center positioning of a wafer is achieved, after clamping, the two sides of the wafer make contact with a trigger button,
extrusion of the trigger button is achieved, an
electric signal is connected and received by a PLC processor, and air inlet operation is stopped; flexible
extrusion and accurate positioning can be realized, clamping damage of a wafer is avoided, the feeding accuracy is ensured, abrasion under conventional calibration actions is reduced, the wafer is better protected, overturning discharging is realized, feeding is synchronously realized,
continuous operation can be realized, and the detection efficiency is improved.