146results about How to "Prevent short circuits" patented technology

The present invention provides a translucent solar cell and a manufacturing method thereof. The translucent solar cell comprises, in stacking order, a substrate, a first electrode layer, a photoconductive layer and a second electrode layer. The translucent solar cell is characterized in that there are formed a plurality of first light-transmissive apertures on the second electrode layer and the plurality of first light-transmissive apertures are further extended in a depth direction to the photoconductive layer to form a plurality of second light-transmissive apertures corresponding to the first light-transmissive apertures. A projected area of each of the second light-transmissive apertures is equal to or smaller than that of a corresponding first light-transmissive aperture.

An object of the present invention is to provide a rectifier circuit which can suppress loss of power due to parasitic capacitance or parasitic inductance of a semiconductor element. The rectifier circuit matches or mismatches impedance between a circuit of a previous stage and the rectifier circuit in accordance with the amplitude of an input AC voltage. When an AC voltage to be input has a smaller amplitude than a predetermined voltage, impedance is matched and the AC voltage is applied as is to the rectifier circuit. Conversely, when an AC voltage to be input has a larger amplitude than a predetermined voltage, impedance is mismatched, and the amplitude of the AC voltage is decreased by reflection and then the AC voltage is applied to the rectifier circuit.

To provide an electrolytic copper foil for a negative electrode for a lithium-ion secondary battery with which it is possible to produce a long-life lithium-ion secondary battery in which there is no decline in the capacity retention ratio even when the charge-discharge cycling is repeated, that has long life, and no deformation of a negative electrode current collector occurs. The electrolytic copper foil constituting the negative electrode current collector for the lithium-ion secondary battery has, after heat treatment at from 200 to 400° C., a 0.2% proof stress of 250N / mm2 or more, and elongation of 2.5% or more; and the surface on which an active material layer of the electrolytic copper foil is provided has been rust-proofed, or roughened and rust-proofed. As a result of analysis of the depth profile (depth direction) obtained by performing secondary ion mass spectrometry (SIMS) in the thickness direction of the copper foil, the copper foil including: chlorine (Cl), carbon (C), and oxygen (O) each in a concentration of 1017 to 5×1020 atoms / cm3, and sulfur (S) and nitrogen (N) each in a concentration of 1015 to 1019 atoms / cm3.

An area with a low via pattern density is extracted from a semiconductor integrated circuit that includes the first wirings and the second wirings disposed on the upper layer of the first wirings, based on wiring layout information. Then, dummy via patterns connected either to the first wirings or the second wirings are disposed in the peripheral area of the via patterns within the selected area. With this, the dummy via can be disposed even in an area where the wirings are congested.

An LED packaging structure has a substrate having two holes formed thereon. One of two conductive elements extends through the two holes to connect electrically to a conductive pad and a first electrode pad on the upper and lower surfaces of the substrate and the other of the two conductive elements extends through the holes to connect to the conductive strip and the second electrode pad on the upper and lower surfaces the substrate. A light-emitting chip electrically connects to the conductive pad and the conductive strip. The light-emitting chip is encapsulated by a protection colloid on the substrate, so as to make LED packaging structure easy to fabricate and avoid the short circuits of adjacent LED packaging structures due to contact between conductor materials therebetween.

In a temperature sensor including a pair of electrode wires for signal lead-out, bonded to both opposing end faces of a thermistor device, this invention aims at preventing peeling, of bond portions, between the electrode wires and the thermistor device. This object can be accomplished by sealing the thermistor device 3 and the bond portions between the thermistor device 3 and the electrode wires 4 by using an electrically insulating glass member 6, and holding the pair of electrode wires 4 by using a holding member 8 made of an electrically insulating ceramic while a gap is kept between them.

A photovoltaic element (110) is proposed for conversion of electromagnetic radiation to electrical energy. The photovoltaic element (110) may especially be a dye solar cell (112). The photovoltaic element (110) has at least one first electrode (116), at least one n-semiconductive metal oxide (120), at least one electromagnetic radiation-absorbing dye (122), at least one solid organic p-semiconductor (126) and at least one second electrode (132). The p-semiconductor (126) comprises at least one metal oxide (130).

A film-covered battery 1 includes battery element 6 and laminate films 3 and 4 for sealing battery element 6. Laminate films 3 and 4 are realized by laminating a heat-seal resin layer and a metal foil layer and seal battery element 6 by arranging the films on either side of battery element 6 with the heat-seal resin layers disposed on the inside and then heat-sealing at sealing areas 3a and 4a on the outer peripheries of the films. The areas of the laminate films 3 and 4 other than sealing areas 3a and 4a are electron beam irradiation areas 3b and 4b that are irradiated by an electron beam. Cross-linked structures are formed in the heat-seal resin layers of electron beam irradiation areas 3b and 4b by irradiation by an electron beam.

A package substrate having an electrically connecting structure are provided. The package substrate include: a package substrate substance with at least a surface having a plurality of electrically connecting pads formed thereon, allowing an insulating protective layer to be formed on the surface of the package substrate substance and the electrically connecting pads and formed with a plurality of openings corresponding in position to the electrically connecting pads so as to expose a portion of the electrically connecting pads, respectively; and a metal layer provided on an exposed portion of the electrically connecting pads, walls of the openings of the insulating protective layer, and a circular portion of the insulating protective layer encircling each of the openings thereof, and provided with a slope corresponding in position to a bottom rim of each of the openings. Accordingly, solder bleeding and short circuits are prevented.

A DC switching device including a plurality of arc-extinguishing chambers and a plurality of contacting units conductively connected in series to each other, each of the contacting units including a stationary contact and a movable contact movable between a rest position and a working position, an air gap is formed between the contacts when the movable contact is moved from the working position to the rest position and each of the chambers enclosing a contacting unit and including a splitter plate unit including one or more splitter plates arranged for splitting and cooling an arc occurring in the air gap between the contacts. The chambers include a permanent magnet for generating a magnetic field between the contacting unit and the splitter plate unit and the splitter plates are made of non-ferromagnetic material, and the splitter plates of the chambers are made of ferromagnetic material.

An insulated gate type semiconductor device comprised of a semiconductor layer serving as an active region isolated from a semiconductor substrate by a substrate isolation insulating film and a T-shaped gate electrode comprised of a trunk-shaped main gate electrode and a crosspiece-shaped conductor pattern provided on the semiconductor layer, wherein the thickness of the gate insulating film directly under the crosspiece-shaped conductor pattern is made greater than the thickness of the gate insulating film directly under the main gate electrode, whereby it is possible to prevent short-circuits between electrodes, prevent short-circuits between separators, and prevent an increase of the parasitic capacitance.

A planar electrochemical gas sensor is provided with at least one working electrode (4), at least one counterelectrode (4″), at least one electrolyte-filled planar electrolyte carrier (10), at least one planar housing upper part (3) and at least one planar housing lower part (2). The electrodes (4, 4″) are arranged such that they are in two-dimensional contact with the electrolyte carrier (10). The housing upper part (3) and the housing lower part (2) are connected with one another such that the electrodes (4, 4″) and the electrolyte carrier (10) are pressed against one another in such a way that they are secured against displacement. The housing upper part (3) and the housing lower part (2) are partially in direct two-dimensional contact with one another, and the connection of the housing upper part (3) and the housing lower part (2) in the area of the direct two-dimensional contact is present at least along a closed figure, which surrounds the electrodes (4, 4″) and the electrolyte carrier (10).

The invention relates to a biological drop filter and relative method for treating volatile organic waste gas, wherein it comprises that: feeding volatile organic waste gas into gas inlet tube (1) and main body (7) of reactor to be degraded and purified to be discharged from ventilate tube (9); the nutriment (11) enters into main body (7) via the nutriment distributor (18); the invention is characterized in that: the entrance of volatile organic waste gas is along the horizontal central line of main body 97); the nutriment (11) flows along the main body (7) from up to down, to form gas-liquid alternative contact in the main body (7). The invention can strengthen the biological degrade ability, with small area.

The present invention relates to an organic electroluminescence element and the manufacturing method thereof comprising an anode, semiconductor layer, organic light-emitting medium, and a cathode, an organic light-emitting medium is located between the first electrode and the semiconductor layer comprising the non-monocrystal material and the second electrode is electrically connected to the edge section of the semiconductor layer when either one of the anode or cathode is designated to the first electrode and the other electrode to the second electrode.Because the first electrode and the second electrode are configured in such a manner not to be opposite to each other in this way, various electrode materials are able to be used and the light-emitting area is able to be increased, and therefore, the organic EL element with the luminous energy taken out to the outside and a manufacturing method that can efficiently obtain such organic EL element are able to be provided.

In an acoustic wave filter, first and second filter elements are connected between an unbalanced terminal and first and second balanced terminals on an acoustic wave substrate. The filter elements are longitudinally-coupled surface wave filters including at least three IDTs. One end of the IDTs is mutually connected and is connected to the unbalanced terminal. The other ends of the IDTs are connected by a second connecting line so as to define an unbalanced-side grounded portion. Grounded ends of the IDTs are connected to each other by a first connecting line so as to define a common midpoint grounded portion. The common midpoint grounded portion and the unbalanced-side grounded portion are electrically separated from each other.

A high density flexible wiring connection device comprises a flexible flat cable (FFC) having narrow-pitch conductors and a flat cable connector (FC connector) having a double-sided contact designed for narrow-pitch wiring and having upper and lower contact terminals. A supplementary wiring board having upper and lower wiring terminals is introduced to connect alternate ones and the other alternate ones of the narrow-pitch conductors of the FFC to alternate ones of the upper contact terminals and alternate ones of the lower contact terminals of the FC connector, respectively, thereby making the pitch of each of the upper and lower wiring terminals twice the narrow pitch of the FFC and the FC connector. The use of the supplementary wiring board to thus convert the wiring pitch makes it possible to prevent whiskers, even if formed on the contact terminals, from causing short-circuits between adjacent contact terminals and between adjacent wiring terminals.

Process for the production of an assembly having several magnetic heads and multiple head assembly obtained by said process.Production takes place of a first substrate (60) with first pole pieces (621, 622) and a second substrate (70) with second pole pieces (721, 733) and magnetic connectors (741, 742). One of the substrates is reversed and engaged on the other. The second substrate is thinned out so that the two pole pieces (721, 722) and the magnetic connectors (741, 742) are level or almost level. The assembly is completed by forming on the second thinned out substrate, magnetic circuit closing means and conductor coils.Application to the production of multiple magnetic head assemblies.

The present invention relates to an element of transition between a waveguide and a transition line on a substrate. The element of transition comprises a securing flange on the substrate, the flange being dimensioned so that at least, in the direction microstrip line, the width d of the flange is selected in such a manner as to shift the resonant modes away from the useful band. The invention is used particularly for circuits using SMD techniques at millimeter frequencies.

A method of manufacturing an ultrasound transducer for an ultrasound imaging device including a plurality of transducer elements arranged in a two dimensional array on a single carrier of semi-conductor material including the step of providing a buffer layer between the carrier and a layer including piezo electrical material, the buffer layer having a thickness arranged for dicing each of the plurality of transducer elements on the carrier.

The invention relates to an image sensor comprising a plurality of pixels operatively connected to a control unit that includes a readout circuit, characterized in that it comprises a monolithic three-dimensional integrated circuit comprising an upper level and a lower level; wherein each pixel comprises: a photosensitive element arranged in said upper level and comprising a photosensitizing layer associated to a transport layer; an active device arranged in said lower level and operatively coupled to the photosensitive element; and a first intermediate terminal and an output terminal circuitally connected, respectively, to the photosensitive element and to the readout circuit; wherein the image sensor further comprises a dark current suppressing circuit; and wherein the control unit is configured to, upon readout of a pixel, circuitally connect the first intermediate terminal of said pixel with its output terminal through the dark current suppressing circuit. The invention also relates to an optoelectronic system comprising said image sensor and to a method of manufacturing said image sensor.

A component has at least one MEMS element and at least one cap made of a semiconductor material. The cap, in addition to its mechanical function as a terminus of a cavity and protection of the micromechanical structure, is provided with an electrical functionality. The micromechanical structure of the MEMS element of the component is situated in a cavity between a carrier and the cap, and includes at least one structural element which is deflectable out of the component plane within the cavity. The cap includes at least one section extending over the entire thickness of the cap, which is electrically insulated from the adjoining semiconductor material in such a way that it may be electrically contacted independently from the remaining sections of the cap.

A planar electrochemical gas sensor is provided with at least one working electrode (4), at least one counterelectrode (4″), at least one electrolyte-filled planar electrolyte carrier (10), at least one planar housing upper part (3) and at least one planar housing lower part (2). The electrodes (4, 4″) are arranged such that they are in two-dimensional contact with the electrolyte carrier (10). The housing upper part (3) and the housing lower part (2) are connected with one another such that the electrodes (4, 4″) and the electrolyte carrier (10) are pressed against one another in such a way that they are secured against displacement. The housing upper part (3) and the housing lower part (2) are partially in direct two-dimensional contact with one another, and the connection of the housing upper part (3) and the housing lower part (2) in the area of the direct two-dimensional contact is present at least along a closed figure, which surrounds the electrodes (4, 4″) and the electrolyte carrier (10).

A method of etching a carbon-containing layer on a semiconductor substrate using a Si-containing gas and a related method of fabricating a semiconductor device in which a plurality of contact holes having excellent sidewall profiles are formed by etching an interlayer insulating layer using a carbon-containing layer pattern formed in accordance with the invention and having a width of several tens of nm as an etch mask are provided. To etch a carbon-containing layer to be used as a second etch mask, a first mask pattern is formed on the carbon-containing layer to partially expose a top surface of the carbon-containing layer. The carbon-containing layer is then anisotropically etched with a plasma of a carbon-etching mixture gas formed of O2 and a Si-containing gas using the first mask pattern as a first etch mask to form the carbon-containing layer pattern. Neighboring contact holes in a high-density cell array region fabricated in accordance with this invention are distinctly separated from each other, even when an interval between the neighboring contact holes is as small as several tens of nm or less; and, thus, a short-circuit between neighboring unit cells using such contact holes can be prevented.

An electrode manufacturing method which can form a flat short-circuit prevention coating film (solid polyelectrolyte layer) having a uniform thickness and prevent short circuits from occurring in an electrochemical device is provided. The electrode manufacturing method comprises a first step of applying an active material layer coating material containing an active material particle, an active material layer binder, and a first solvent to a current collector so as to form a coating film made of the active material layer coating material; a second step of applying a second solvent to the coating film; and a third step of applying a solid polyelectrolyte layer coating material containing a solid polyelectrolyte, a solid polyelectrolyte layer binder, and a third solvent to the coating film coated with the second solvent. The first solvent is a good solvent for the active material layer binder, the second solvent is a poor solvent for the solid polyelectrolyte layer binder, and the third solvent is a good solvent for the solid polyelectrolyte layer binder.

The invention relates to a pneumatic solid particle feeding system which comprises a main blowing pipe, a feeding pipe and a hopper. The feeding pipe is used for conveying solid particles from the hopper, and the main blowing pipe is used for providing conveying air for conveying the solid particles for the feeding pipe. The pneumatic solid particle feeding system is characterized in that an end notch of an air outlet of the main blowing pipe is flush with the side, close to the end of the feeding pipe, of a discharging opening of the hopper, and at least part of the end notch of the air outlet of the main blowing pipe inclines, so that the conveying air blown by the main blowing pipe has a vector in at least one other direction besides the horizontal direction. By means of the pneumatic solid particle feeding system, the shapes of solid materials can be kept good, and the pipeline blocking phenomenon is avoided. The pneumatic solid particle feeding system is directly connected with an inlet pipe of a device reactor through the feeding pipe in a sealed mode, and therefore the continuous material conveying process can be achieved, energy consumption is lowered, and environment pollution is avoided.

The invention relates to a photovoltaic insulating glazing comprising a multi-layer glazing with a photovoltaic module. The glazing is further characterized in that two contact strips for contacting the photovoltaic module are led out from an intermediate space between the glass layers and a spacer spaces the glass layers apart, thereby forming the intermediate space.

Method for fabricating a substrate comprising a nanostructured surface for an organic light emitting diode OLED, in which a layer of an organic resin or of a mineral material having a first nanostructuration is prepared by nano-imprint; the organic resin or mineral material is heated to a temperature equal to or higher than its glass transition temperature Tg or its melting point, and the organic resin or the mineral material is maintained at this temperature for a time tR called annealing time, whereby the organic resin or the mineral material flows and the first nanostructuration of the layer of organic resin or of mineral material is modified to produce a second nanostructuration; the organic resin or the mineral material is cooled.