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31results about How to "Optimize write performance" patented technology

Split gate flash memory and manufacture method thereof

The invention provides a split grating flash memory and a manufacture method thereof. The split gate flash memory comprises a semiconductor substrate, a gate oxide and split structure units, wherein the gate oxide is positioned on the surface of the semiconductor substrate; and the split structure units are positioned on the gate oxide. Each split structure unit is provided with a floating gate, a gate medium layer, a control gate, a first side wall layer, a second side wall layer, a third side wall layer, a word line and side walls, wherein the floating gate is positioned on the gate oxide, and the surface of the floating gate is in a cambered shape with an inclined angle; the gate medium layer is positioned on the surface of the floating gate; the control gate is positioned on the gate medium layer; the first side wall layer is positioned on the control gate; the second side wall layer is positioned on the inner side wall of the control gate; the third side wall layer is positioned in the first side wall, the second side wall layer, the gate medium layer and the inner side wall of the floating gate; the word line is positioned between two split structure units and fills a gap; and the side walls are positioned at the outside walls of the split structure units. The invention improves the performance of flash memory erasure or writing and the electric performance of the flash memory.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Pixel driving circuit, driving method thereof, array substrate and display device

PendingCN107481675ASolve the problem of uneven brightnessReduce the numberStatic indicating devicesBackplanePower flow
The invention discloses a pixel driving circuit. The pixel driving circuit comprises a driving transistor, a first switching element, a second switching element, a third switching element, a fourth switching element and a storage capacitor. Different control signals control the on-off states of the switching elements so as to achieve the compensation function of the pixel driving circuit, and the light emitting current of an OLED is only related to a threshold voltage and data signals of the OLED and is irrelevant to a threshold voltage of the driving transistor and the voltage drop of a back plate power supply, so that the problem that the light emitting brightness is uneven due to the deviation of the threshold voltage of the driving transistor and the voltage drop of the back plate power supply is solved. The invention further discloses a driving method, an array substrate and a display device.
Owner:BOE TECH GRP CO LTD

Pixel circuit and display panel

The invention discloses a pixel circuit and a display panel. The pixel circuit comprises a driving transistor, a writing transistor, a first capacitor and a second capacitor, wherein the ratio of thecapacitance value of the second capacitor to the capacitance value of the first capacitor is not less than 50% and not more than 150%; by configuring the proportional relation between the capacitancevalue of the second capacitor and the capacitance value of the first capacitor, the write-in effect of data signals can be improved; moreover, the voltage range of the data signal is increased, and the gray-scale precision can be improved.
Owner:WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD

Method for scanning error bits

The invention discloses a method for scanning error bits. The method comprises the following steps: S1, averagely dividing a first data partition of a storage unit into N equal second data partitions; S2, forming a third data partition by using the second data partitions, scanning the third data partition and setting the permissible number of the error bits; S3, comparing the actual number of the error bits of the third data partition with the permissible number of the error bits, if the actual number of the error bits is greater than the permissible number of the error bits, executing step 4, if not, executing step 5; S4, carrying out one-time programming operation on the storage unit and returning to carry out the step S3; and S5, recording the current actual number of the error bits of the third data partition. According to the method, the qualification rate of storage chips can be adjusted through modifying the setting conditions; the corresponding data region and the error correcting capability of the own ECC (Error Correction Code) of a controller can be adjusted on the basis of final statistical results; and therefore, a better write performance is obtained.
Owner:GIGADEVICE SEMICON (BEIJING) INC

SRAM memory cell, memory array and memory

ActiveCN105206298ATroubleshoot write operation failuresBoost reverse voltageDigital storageEngineeringMemory array
The invention relates to a SRAM memory cell, a memory array and a memory. The SRAM memory cell comprises a first PMOS transistor, a second PMOS transistor, a first NMOS transistor, a second NMOS transistor, a first transmission transistor, a second transmission transistor, a first dual-gate PMOS transistor, a second dual-gate PMOS transistor, a first dual-gate NMOS transistor and a second dual-gate NMOS transistor. The SRAM memory cell solves the problem that the existing SRAM memory cell has write operation failure possibility.
Owner:SPREADTRUM COMM (SHANGHAI) CO LTD

Split gate flash memory and manufacture method thereof

The invention provides a split grating flash memory and a manufacture method thereof. The split gate flash memory comprises a semiconductor substrate, a gate oxide and split structure units, wherein the gate oxide is positioned on the surface of the semiconductor substrate; and the split structure units are positioned on the gate oxide. Each split structure unit is provided with a floating gate, a gate medium layer, a control gate, a first side wall layer, a second side wall layer, a third side wall layer, a word line and side walls, wherein the floating gate is positioned on the gate oxide, and the surface of the floating gate is in a cambered shape with an inclined angle; the gate medium layer is positioned on the surface of the floating gate; the control gate is positioned on the gate medium layer; the first side wall layer is positioned on the control gate; the second side wall layer is positioned on the inner side wall of the control gate; the third side wall layer is positioned in the first side wall, the second side wall layer, the gate medium layer and the inner side wall of the floating gate; the word line is positioned between two split structure units and fills a gap; and the side walls are positioned at the outside walls of the split structure units. The invention improves the performance of flash memory erasure or writing and the electric performance of the flash memory.
Owner:SHANGHAI HUAHONG GRACE SEMICON MFG CORP

Structure for optimizing writing performance of magnetic random access memory and preparation method thereof

The invention discloses a structure for optimizing the writing performance of a magnetic random access memory. The structure comprises a writing accelerator, the writing accelerator is positioned on the lower side of a bottom electrode of the magnetic random access memory and the upper side of a bottom electrode through hole, and the writing accelerator is directly connected with the bottom electrode and the bottom electrode through hole. The invention further discloses a preparation method of the structure for optimizing the writing performance of the magnetic random access memory. The preparation method comprises the following steps: 1, providing a CMOS substrate with a polished surface and a metal connecting line Mx; 2, manufacturing a bottom electrode through hole in the flattened CMOSsubstrate, and grinding the bottom electrode through hole; 3, on the bottom electrode through hole, performing graphical definition and etching to manufacture writing accelerator metal, filling a writing accelerator dielectric medium, and grinding the writing accelerator dielectric medium by adopting chemical mechanical planarization; and 4, sequentially depositing a bottom electrode, a magnetictunnel junction multilayer film and a top electrode on the writing accelerator, manufacturing a magnetic tunnel junction storage unit, and finally manufacturing bit line connection on the top electrode.
Owner:SHANGHAI CIYU INFORMATION TECH
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