103results about How to "Low cost mass production" patented technology

An interchangeable hearing aid control panel with at least one activation zone arranged in connection with a layered structure. The layered structure has an electrically non-conducting substrate, an electrically conducting path arranged in connection with the substrate, and an electrically conducting member, such as a conducting foil, arranged at a predetermined distance from the activation zone. The activation zone can be either in a deactuated or in an actuated state. In the actuated state the conducting member and the conducting path are electrically connected while disconnected in the deactuated state. Electrical connection to an associated hearing aid is by means of a connector, such as a plug, enabling the control panel to be easily changed. Preferably, the connector is formed by a piece of flexprint. The layered structure may comprise a second conducting path. In preferred embodiments activation zones are indicated by “poppel domes” formed by a surface layer covering the layered structure. The activation zones may form an MTO control or a volume control. To fit BTE hearing aids, the layered structure preferably has an elongated structure with a length of 1-4 cm. Other shapes can be formed to fit ITE, ITC and CIC hearing aids. In preferred embodiments, the control panel comprises one or more Silicon-based microphones protected behind a surface layer of the control panel.

A package with two or more stacked semiconductor chips and a method of manufacturing the same. In the method, an upper semiconductor chip package and a lower semiconductor chip package are prepared. Solder balls are formed on a substrate of the lower package to connect the upper and lower packages. A semiconductor chip and the solder balls are molded and then ground until the solder balls are exposed. Solder balls are formed on the bottom of a substrate of the upper package. The upper package is stacked on the lower package such that the solder balls of the lower package are in contact with the solder balls of the upper package. A reflow process is performed on the lower package and the upper package, which are stacked, to physically connect the upper and lower packages.

A combined toilet and bidet system that may be manufactured with a toilet or mounted and adapted to the design of an existing toilet comprising a first adjustable nozzle mountable near the front end of a toilet bowl, second adjustable nozzle mountable near the back end of the toilet bowl, faucet / valve system for receiving and controllably combining multiple water sources in a manner that controls the temperature of water outputted, conduit for delivering water from the selected water source(s) to the faucet / valve system, conduit for delivering water from the faucet / valve system to a splitter that outputs the water received to the nozzles, conduit for delivering the water from the splitter to the first and second nozzles, at least one directional control system for controllably adjusting the angle of at least one of and preferably all of the nozzles to dictate the direction(s) water is ejected therefrom and exhaust system for removing odors from the area of the toilet-bidet system.

A module for a bus rooftop air conditioner is self contained in that it has all the necessary components including a compressor, if desired, which when supplied with electrical power, can provide conditioned air to the passenger compartment of a bus. In addition, an electrically powered heater is provided in the air flowstream such that heated air can also be supplied to the passenger compartment when desired. Multiple units provide for incremental capacity requirements to be met as well as limp home capabilities.

A method and apparatus for delivering a mixture of compressed fluid and marking material and depositing the marking material in a pattern onto a substrate, includes a high pressure source of a mixture of compressed fluid and marking material. A micro-machined manifold includes a plurality of micro-nozzles, a fluid chamber, and an entrance port with portions of a first surface of the micro-machined manifold defining the entrance port with the entrance port being connected in fluid communication with the fluid chamber. Each of the micro-nozzles having an inlet and an outlet with the inlet being connected in fluid communication with the fluid chamber and the outlet being located on the second surface of the micro-machined manifold. Each micro-nozzle is shaped to produce a directed beam of the mixture of compressed fluid and marking material beyond the outlet of the micro-nozzle. A housing is connected in fluid communication with the high pressure source and the entrance port of the micro-machined manifold with the connection being a sealed connection. Optionally, a device operable to capture marking material that does not adhere to the substrate can be included.

Sensors and / or transducers can exhibit nonlinear response to temperature changes in terms of offset and also in terms of sensitivity to variations in a sensed physical attribute (pressure, strain, displacement, etc.). Padé Approximant function emulators are used to model the nonlinear offset and / or nonlinear sensitivity behaviors of a given sensing device relative to one or more temperature sub-ranges and to produce temperature compensating corrections for offset and / or sensitivity as may be desired.

Embodiments of the invention provide a device called a “G-Fresnel” device that performs the functions of both a linear grating and a Fresnel lens. We have fabricated the G-Fresnel device by using PDMS based soft lithography. Three-dimensional surface profilometry has been performed to examine the device quality. We have also conducted optical characterizations to confirm its dual focusing and dispersing properties. The G-Fresnel device can be useful for the development of miniature optical spectrometers as well as emerging optofluidic applications. Embodiments of compact spectrometers using diffractive optical elements are also provided. Theoretical simulation shows that a spectral resolution of approximately 1 nm can be potentially achieved with a millimeter-sized G-Fresnel. A proof-of-concept G-Fresnel-based spectrometer with subnanometer spectral resolution is experimentally demonstrated.