The invention discloses a
semiconductor circuit, a packaging structure using the same and a preparation method of the packaging structure. The
semiconductor circuit comprises a driving HVIC
chip, a high-side driving module and a low-side driving module, the driving HVIC
chip is electrically connected with the high-side driving module, the high-side driving module comprises three upper bridge power elements, and each upper bridge power element is of an RC-IGBT structure; the driving HVIC
chip is electrically connected with the low-side driving module, the low-side driving module comprises three lower bridge power elements, and each lower bridge power element comprises an IGBT (Insulated Gate Bipolar Translator) tube and a fly-wheel
diode; the input end of the upper bridge power element is electrically connected with the driving HVIC chip; according to the
semiconductor circuit, the packaging structure using the semiconductor circuit and the preparation method of the packaging structure, an upper bridge uses an RC-IGBT structure, a lower bridge uses a structure of an IGBT tube and a fly-wheel
diode, the module cost is reduced, and the reliability of the module is improved. And meanwhile, the module has the advantages of
high input impedance, low
control power, simple
driving circuit, high switching speed, low conduction
voltage drop, large on-state current, low loss, better
reverse recovery capability and the like.