50results about How to "Improve static noise margin" patented technology

A static random access memory (14) has a normal mode of operation and a low voltage mode of operation. A memory array (15) includes memory cells (16) coupled to a first power supply node (VDD) for receiving a power supply voltage. A plurality of word line drivers is coupled to word lines of the memory array (15) and to a second power supply node (37). A word line driver voltage reduction circuit (36) has an input coupled to the first power supply node (VDD) and an output coupled to the second power supply node (37) for reducing a voltage on the output in relation to a voltage on the input in response to a low power supply voltage signal, and thus improving a static noise margin of the memory cells (16).

A multi-port SRAM with shared write bit-line architecture and selective read path for low power operation includes a first memory cell, a second memory cell, and a common switch set. The second memory cell makes use of the common switch set to share the A-port write bit-line and the B-port write bit-line with the first memory cell so as to reduce half write bit-line number and reduce the write current consumption caused by pre-charging the bit-line to VDD. It also provides a selective read path structure for read operation. Replacing the ground connection in the read port with a virtual VSS controlled by a Y-select signal reduces read-port current consumption.

An embedded Static random access memory (SRAM) chip includes a first SRAM array of first SRAM unit cells. Each first SRAM unit cell includes a data latch for data storage and at least two pass gates for data reading and writing access. The cell area is defined by a first X-pitch and a first Y-pitch, the X-pitch being longer than the Y-pitch. A plurality of logic transistors are formed outside of the first SRAM array, the plurality of logic transistors including at least first and second logic transistor having first and second gate pitches defined between their source and drain contacts. The second gate pitch is the minimum logic gate pitch for the plurality of logic transistors. The first Y-pitch is equal to twice the first gate pitch and the ratio of the first Y-pitch to twice the second logic gate pitch is greater than one. The invention can improve the SER reliability, improve static noise margin and transistor match.

A dummy bit line is provided between a pair of bit lines. The pair of bit lines is set at a power supply voltage and the dummy bit line is set at a ground voltage, and then the pair of bit lines and the dummy bit line are equalized. When a word line is activated in subsequent read operation, the pair of bit lines is at an intermediate potential lower than the power supply voltage, so that an apparent current drive capability of an access transistor decreases, and the static noise margin of a memory cell increases.

Methods and a circuit for writing to an SRAM memory cell of an array are discussed that provide improved static noise margin, and minimal risk of data upsets during write operations. The write method first rapidly raises the wordline to a lower read voltage level for access, then after a time delay that allows the cells in the selected row to establish a stabilizing differential voltage on the associated bitlines, raises the wordline voltage to a boosted or higher write voltage level. An SRAM bitline enhancement circuit may also be utilized in association with the SRAM memory array and writing method, for enhancing the differential voltage produced by an SRAM memory cell of the array on associated first and second bitlines of the array of conventional SRAM cells (e.g., a conventional 6T differential cell). In one implementation, the SRAM bitline enhancement circuit comprises a half-latch or a sense amplifier connected to associated bitline pairs of the array for amplifying the differential voltage.

A solid-state memory in which each memory cell is constructed of complementary metal-oxide-semiconductor (CMOS) inverters implemented with dual stress liner (DSL) technology. Asymmetry is incorporated into each memory cell by constructing one of the inverter transistors or the pass-gate transistor using the stress liner with opposite stress characteristics from its opposing counterpart. For example, both of the p-channel load transistors and one of the n-channel driver transistors in each memory cell may be constructed with a compressive nitride liner layer while the other driver transistor is constructed with a tensile nitride liner layer. In another implementation, one of the n-channel pass-gate transistors is constructed with a compressive nitride liner layer while the other pass-gate transistor is constructed with a tensile nitride liner layer. Improved cell stability due to the resulting asymmetric behavior is implemented in a cost-free manner.

A semiconductor integrated circuit includes a plurality of memory cells arranged in a matrix, a plurality of word lines corresponding to respective rows of the plurality of memory cells, a plurality of word line drivers for driving the plurality of word lines, respectively, and a plurality of pull-down circuits connected to the plurality of word lines, respectively, for causing voltages of the respective connected word lines to be lower than or equal to a power supply voltage when the respective word lines are in an active state. The word line drivers each have a transistor for causing the corresponding word line to go into the active state. The pull-down circuits each have a pull-down transistor for pulling down the corresponding word line, the pull-down transistor being a transistor having the same conductivity type as that of the transistor included the word line driver for driving the corresponding word line.

A Random Access Memory (RAM) with a plurality of cells is provided. In an embodiment, the cells of a same column are coupled to a same pair of bit-lines and are associated to a same power controller. Each cell has two inverters; the power controller has two power-switches. For the cells of the same column, the two power-switches respectively perform independent supply voltage controls for the two inverters in each cell according to data-in voltages of the bit-lines during Write operation.

A contact connected to a word line is formed on a gate electrode of an access transistor of an SRAM cell. The contact passes through an element isolation insulating film to reach an SOI layer. A body region of a driver transistor and that of the access transistor are electrically connected with each other through the SOI layer located under the element isolation insulating film. Therefore, the access transistor is in a DTMOS structure having the gate electrode connected with the body region through the contact, which in turn is also electrically connected to the body region of the driver transistor. Thus, operations can be stabilized while suppressing increase of an area for forming the SRAM cell.

A three-dimensional (3D) memory cell separation among 3D integrated circuit (IC) (3DIC) tiers is disclosed. Related 3DICs, 3DIC processor cores, and methods are also disclosed. In embodiments disclosed herein, memory read access ports of a memory block are separated from a memory cell in different tiers of a 3DIC. 3DICs achieve higher device packing density, lower interconnect delays, and lower costs. In this manner, different supply voltages can be provided for the read access ports and the memory cell to be able to lower supply voltage for the read access ports. Static noise margins and read / write noise margins in the memory cell may be provided as a result. Providing multiple power supply rails inside a non-separated memory block that increases area can also be avoided.

A 10-transistor dual-port SRAM with shared bit-line architecture includes a first memory cell and a second memory cell. The first memory cell has a first storage unit, a first switch set, and a second switch set. The second memory cell has a second storage unit, a third switch set, and a fourth switch set. The second switch set is coupled to a complement first A-port bit line and a complement first B-port bit line, and connected to the first storage unit. The third switch set is connected to a complement second A-port bit line, a complement second B-port bit line, and the second storage unit. Thus, the second memory cell can make use of the third switch set to share the complement first A-port bit line and the complement first B-port bit line with the first memory cell.

The invention provides a semiconductor device and a manufacturing method thereof. The method comprises the steps of providing a substrate which at least comprises a pull-down region and a channel region, wherein the width of the pull-down region is equal to the width of the channel region, forming a gate oxide layer on the substrate, wherein the gate oxide layer covers the pull-down region and thechannel region, forming a polycrystalline silicon layer on the gate oxide layer, forming a patterned photoresist layer on the polycrystalline silicon layer, wherein the patterned photoresist layer exposes the polycrystalline silicon layer on the pull-down region, carrying out ion doping on the exposed polycrystalline silicon layer, and removing the patterned photoresist layer, and etching the polycrystalline silicon layer and the gate oxide layer so as to form a pull-down gate structure on the pull-down region and form a channel gate structure on the channel region. According to the manufacturing method of the semiconductor device, the performance of the semiconductor device can be improved.

A read, write, and match circuit for a low-voltage content addressable memory. A write circuit inputs signals for storing data in the memory cells, a read circuit retrieves the stored data from the memory cells, and a match circuit compares the data stored in the memory cell with the data searched by the match circuit. The circuits for writing, reading and matching are separated from each other and exempt from mutual interference.

The invention provides an SRAM storage unit array, an SRAM memory, and a control method thereof. The SRAM storage unit array comprises a plurality of word line pair arranged along the row direction, wherein each word line pair comprises a write word line and a read word line; a bit line pair arranged along the row direction, wherein the bit line pair comprises a first bit line and a second bit line; a plurality of storage units arranged between the word line pairs and the bit line pair, wherein each storage unit is connected to the corresponding work line pair and bit line pair and comprises a read terminal; and a read unit, wherein the read unit comprises a read transistor and a read bit line, and the read bit line is connected to the read terminals of the plurality of storage units through the read transistor. The provided SRAM storage unit array reduces the transistor number and the stability is improved at the same time.