The invention discloses a
chip-grade LED (
Light Emitting Diode) packaging device with a controllable light emitting angle and a packaging process. According to the
LED packaging device, first white wall
adhesive layers are arranged on side faces of an LED
chip, a
diffusion layer and a fluorescent
adhesive layer and are used as reflection surfaces; the reflection surfaces with different shapes can be designed aiming at requirements on different light emitting angles, so that the
LED packaging device with the controllable light emitting angle is obtained; furthermore, the
diffusion layer is arranged between the LED
chip and the fluorescent
adhesive layer, and the
diffusion layer has a
refractive index higher than that of a fluorescent adhesive; the difference between the refractive indexes of the LED chip and the fluorescent adhesive layer is reduced; the refractive indexes of the LED chip, the
diffusion layer and the fluorescent adhesive layer have a certain gradient and the light emitting efficiency of the LED chip is improved, so that the
luminous flux of the device is improved; the refractive indexes of diffusion
powder and a packaging adhesive in the
diffusion layer are different, and the condition that
light emission of
blue light of the LED chip is not uniform can be improved, so that the space color uniformity of the device is improved; and the design of a concave groove and white wall structure is adopted, so that the reliability problem of a product is greatly improved.