The invention relates to the technical field of glue injection, in particular to a quantitative glue
injection device for high-temperature resin
transfer molding. The device comprises a tank, a tank cover and an
air pump, the tank cover is mounted at the top of the tank, a second sealing ring is mounted at the bottom of the tank cover, a
piston rod of the
air pump penetrates the center of the tankcover and hermetically connected with the tank cover, a vertical rod is fixedly mounted at the bottom of the
piston rod of the
air pump, a pressing disk is connected at the bottom of the vertical rod, a first sealing ring is arranged on the out edge of the pressing disk, a plurality of first through holes are formed in the pressing disk, a driving component is arranged on one bottom side of the vertical rod, a guide component is arranged in the middle of the
piston rod, a vacuum component is arranged on one top side of the tank, and a heating component is arranged on the outer side of the tank. The device has the functions of heating and quantitatively injecting glue, glue in the tank is heated by the heating component, the temperature of the glue is kept by the heating component, air inthe glue can be effectively discharged when the temperature is kept,
extrusion of the glue cannot be affected by the air,
extrusion amount of the glue is controlled by the air pump, and quantitative output of the glue is ensured.