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57results about How to "Expand the luminous area" patented technology

Backlight module and liquid crystal displayer

The invention relates to the technical field of liquid crystal display, in particular to a backlight module and a liquid crystal displayer. The backlight module sequentially comprises a printed circuit board, a reflector plate, an LED light source and a diffusion plate from bottom to top. First protruding points are arranged on the light-in face, facing the LED light source, of the diffusion plate and around the projection, within the light-in face, of the LED light source. The first protruding points can conduct reflection diffusion on an illumination area, on the diffusion plate, of the LED light source, eliminate projection dark spaces and prevent light source gathering, so that the distribution of a light-emitting area on the diffusion plate is more uniform. Meanwhile, the LED light source can be independently controlled, local light control can be better achieved, and accordingly the display quality of a high-dynamic-comparison image is improved. The reflector plate can reflect leaking light again so that the light can irradiate the diffusion plate again, accordingly the utilization rate of the light source is increased, the light mixing distance is increased, and thinning design of the liquid crystal displayer is achieved easily.
Owner:TCL CHINA STAR OPTOELECTRONICS TECH CO LTD

LED (light-emitting diode) chip with novel structure and production method thereof

The invention discloses an LED (light-emitting diode) chip with a novel structure and a production method of the LED chip, and belongs to the field of a semiconductor device. The LED chip structure comprises an N-side electrode, a substrate, an active layer, a gallium phosphide layer, an indium-gallium-phosphorus layer, a P-side soldering wire electrode, an expanded electrode and a current barrier groove. The production method comprises the steps: growing the indium-gallium-phosphorus layer with the thickness of 1000 angstroms on a P side of a chip, etching and coarsing the gallium phosphide layer, evaporating the P-side soldering wire electrode and the expanded electrode by utilizing a vacuum film coating technology, etching the current barrier groove by virtue of plasma, and facilitating the ohm contact between the expanded electrode and the gallium phosphide layer in virtue of alloy. By adopting the produced LED chip, the current can be expanded to the entire chip surface through the expanded electrode, so that the effective application of the current is improved; meanwhile, by adopting the surface coarsing, the light emitting rate of the chip can be effectively improved. The LED chip has the advantages of simplicity in structure, simple and feasible production method and easiness in manufacturing.
Owner:马鞍山太时芯光科技有限公司

Light-expanding imaging device for eliminating moire of LED display screen

The invention discloses a light-expanding imaging device for eliminating moire of an LED (Light Emitting Diode) display screen. The light-expanding imaging device comprises a mask base plate and a light-expanding imaging dielectric slab, wherein the mask base plate is provided with a plurality of light-conducting cavities; the light-conducting cavities are arranged as back tapered holes with square cross sections; point light sources are arranged at the bottom of the light-conducting cavities; the light-expanding imaging dielectric slab is covered on the top surfaces of the light-conducting cavities of the mask base plate; the LED display screen is totally covered by the light-expanding imaging device provided by the invention, so that the point light sources can be turned into area light sources after the light emitted from the luminous points is subjected to the treatment, such as, the light conduction of the light-conducting cavities, the light emission of the walls of the light-conducting cavities, the light absorption, light filtering, color mixing and scattering of the light-expanding imaging dielectric slab, and the like, after the LED display screen is lightened; the luminous points are imaged on the surface of the light-expanding imaging dielectric slab after the light conduction of the light-conducting cavities, the light radiation of the walls of the light-conducting cavities and the color mixing treatment and scattering of the light-expanding imaging dielectric slab, the continuous light is formed, the grid structure and the granular sensation of the luminous points are eliminated, the moire generating conditions of a digital video (or camera) and the LED display screen are eliminated and the effect of eliminating the moire is good.
Owner:厦门科安技术开发有限公司

Group iii nitride semiconductor light-emitting device

A Group III nitride semiconductor light-emitting device includes an electrically conductive support; a p-electrode provided on the support; a p-type layer, an active layer, and an n-type layer, which are formed of a Group III nitride semiconductor and are sequentially provided on the p-electrode; an n-electrode which is connected to the n-type layer; a first trench extending from the surface of the p-type layer on the p-electrode's side to reach the n-type layer; an auxiliary electrode which is in contact with the surface of the n-type layer serving as the bottom of the first trench, but is not in contact with the side walls of the first trench; and an insulating film which exhibits light permeability and covers the auxiliary electrode and the bottom and side walls of the first trench. According another embodiment, the light-emitting device comprises a second trench which is provided in a region facing a portion of the auxiliary electrode in a direction perpendicular to the main surface of the device, and which has a depth extending from the surface of the n-type layer on the side opposite the side of the p-electrode to the auxiliary electrode; and the n-electrode is formed of only a pad portion and is provided on a portion of the auxiliary electrode exposed through the second trench.
Owner:TOYODA GOSEI CO LTD

LED display screen moire-eliminating and color-mixing face cover

InactiveCN105161012AEliminate grid structure and graininessConditions to exclude moiréIdentification meansColor mixingDigital camera
The invention discloses an LED display screen moire-eliminating and color-mixing face cover which is composed of a face cover bottom plate and a plurality of color mixing devices. A plurality of embedment grooves are formed in the face cover bottom plate. The color mixing devices are embedded in the embedment grooves in the face cover bottom plate. Due to the fact that the non-luminance areas between LED display screen luminance points are all covered with the face cover, after an LED display screen is turned on, light absorbing, light filtering, color mixing, scattering and other processing are conducted on light emitted by the luminance points through the color mixing devices, color-mixed light is scattered on the surfaces of all the color mixing devices, and therefore the non-luminance areas of the LED display screen all become luminance areas, and the luminance areas and light mixing areas of LED tube cores are enlarged. The luminance points form continuous light on the surfaces of the color mixing devices after color mixing and scattering are conducted on light through the color mixing devices, and therefore the grid structure and granular sensation of the luminance points are eliminated, the moire interference to LED display images shot by a digital camera or a camera is eliminated, and the moire eliminating effect is good.
Owner:厦门科安技术开发有限公司

Light-emitting diode structure and method for manufacturing the same

A light-emitting diode (LED) structure and a method for manufacturing the same. In one embodiment, the LED structure includes a carrying component, an LED chip, a first conductivity type electrode and a second conductivity type electrode. The carrying component includes a carrier, a sidewall disposed on the carrier and forms a carrying tank. The LED chip is fixed within the carrying tank and includes a first conductivity type semiconductor layer having a first region and a second region, an active layer and a second conductivity type semiconductor layer stacked in sequence. The LED chip further includes a second conductive finger disposed on the second semiconductor layer in the first region, and a first conductive finger disposed on the first semiconductor layer in the second region. The first electrode extends on the sidewall and the first conductive finger. The second electrode extends on the sidewall and the second conductive finger.
Owner:CHI MEI LIGHTING TECH

Organic light emitting diode package method and package structure and device containing structure

The invention discloses a package method of an organic light emitting diode. The package method comprises the following steps of: arranging a first substrate, wherein the first substrate is made of metal foil; arranging the organic light emitting diode on the first substrate; arranging a passivation layer for covering the organic light emitting diode; coating package glue on the whole first substrate, wherein the package glue covers the passivation layer; arranging a second transparent substrate on at least part of the passivation layer covered with the package glue; and curving the package glue to form the package of the organic light emitting diode. The invention also discloses a package structure of the organic light emitting diode and an organic light emitting diode device containing the package structure.
Owner:BOE TECH GRP CO LTD

LED lamp

The invention relates to an LED lamp. The LED lamp comprises a tube and a metal lamp holder capable of being used for high-frequency heating, wherein the tube comprises a straight part and necked parts arranged at two ends of the straight part, and smooth transition sections are arranged between the necked parts and the straight part; a lamp belt adheres to the straight part by the aid of an adhesive, and a patch power supply and LED light-emitting units are arranged on the lamp belt; the metal lamp holder is arranged outside the necked parts and is closely connected with the necked parts by the aid of welding mud; the metal lamp holder is 10-12 mm long, the necked parts are 6-8 mm long, and the gap between the metal lamp holder and the necked parts is 1-2 mm; the patch power supply is arranged in the position close to one end of the straight part, and the distance between the patch power supply and the end of the straight part is 3-5 mm. The LED lamp is simple in structure, high in lighting efficiency and low in rejection rate, comprises few components, is beneficial to industrial production line production and has unique technical advantages in aspects of breaking through the production bottleneck and substantially increasing the profit margin of products, and the welding mud is efficient and quick to solidify.
Owner:CHENHUI GUANGBAO TECH CO LTD

Organic electroluminescence display panel, manufacturing method thereof and display device

The invention discloses an organic electroluminescence display panel, a manufacturing method thereof and a display device. The organic electroluminescence display panel comprises a substrate, an anode, a cathode, an organic light-emitting layer and a semiconductor layer, wherein the anode and the cathode are located on the substrate, the organic light-emitting layer is located between the anode and the cathode, and the semiconductor layer covers the whole substrate; the semiconductor layer is located between the anode and the organic light-emitting layer or between the cathode and the organic light-emitting layer. The organic electroluminescence display panel has the advantages that a pixel definition layer in the prior art can be omitted, and pixel light-emitting areas can be increased.
Owner:BOE TECH GRP CO LTD

Thick-wall part structure, light-emitting device and light-emitting mode

PendingCN114046480AEnsure normal lightingMeet the demand for uniform light emissionVehicle headlampsOptical signallingLight guideEngineering
The invention discloses a thick-wall part structure, a light-emitting device and a light-emitting mode. The thick-wall part structure comprises a light guide structure body, and the light guide structure body is provided with a light source incident plane, a first reflecting plane set, a second reflecting plane set and a light-emitting plane perpendicular to the light source incident plane; the first reflecting plane set is suitable for reflecting incident light in a plane perpendicular to the light-emitting plane and the light source incident plane and forming a central light-emitting area on the light-emitting plane; and the second reflecting plane set diverges the incident light towards two opposite sides parallel to the light-emitting plane, and forms a diffusion light-emitting area on the light-emitting plane, so that the light-emitting width on the light-emitting plane is greater than the width of the light source incident surface. Light emitting of the central area is guaranteed, meanwhile, the diffusion light emitting area is added, the light emitting width is larger than the initial irradiation width of the light sources, when the distance between the light sources is large, the area between the two light sources can be completely irradiated, dark areas are avoided, and the uniform light emitting requirement of customers is met.
Owner:CHANGZHOU XINGYU AUTOMOTIVE LIGHTING SYST CO LTD

Mounting structure for solid-state light sources

A mounting structure for solid-state light sources, for example of the LED type (120), comprises: - a support board (10), - a submount (20) mounted on said support board (10) and having at least one solid-state light radiation source (120) mounted thereon, - a drive board (14) carrying drive circuitry (142) for the light radiation source (120), the aforementioned drive board being mounted on the support board (10) and extending peripherally with respect to the aforementioned submount (20), - electrical interface connections (16, 162) between the submount (20) and the drive board (14) for connecting the light radiation source (120) to the drive circuitry (142), and - mechanical and thermal interface connections (22; 162, 220) between the submount (20) and the support board (10).
Owner:OPTOTRONIC GMBH

A kind of LED chip of novel structure and its manufacturing method

The invention discloses an LED (light-emitting diode) chip with a novel structure and a production method of the LED chip, and belongs to the field of a semiconductor device. The LED chip structure comprises an N-side electrode, a substrate, an active layer, a gallium phosphide layer, an indium-gallium-phosphorus layer, a P-side soldering wire electrode, an expanded electrode and a current barrier groove. The production method comprises the steps: growing the indium-gallium-phosphorus layer with the thickness of 1000 angstroms on a P side of a chip, etching and coarsing the gallium phosphide layer, evaporating the P-side soldering wire electrode and the expanded electrode by utilizing a vacuum film coating technology, etching the current barrier groove by virtue of plasma, and facilitating the ohm contact between the expanded electrode and the gallium phosphide layer in virtue of alloy. By adopting the produced LED chip, the current can be expanded to the entire chip surface through the expanded electrode, so that the effective application of the current is improved; meanwhile, by adopting the surface coarsing, the light emitting rate of the chip can be effectively improved. The LED chip has the advantages of simplicity in structure, simple and feasible production method and easiness in manufacturing.
Owner:马鞍山太时芯光科技有限公司
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