The invention provides a surplus-glue
processing method of a circuit board, wherein the method is suitable for manufacturing a circuit board, and aims to solve the problems that by means of leveling and board brushing in the prior art, surplus glue cannot be removed, and the appearances of circuit boards cannot be guaranteed. The surplus-glue
processing method of the circuit board comprises the following steps that a
daughter board of a mixed-
voltage circuit board is prepared; a mother board of the mixed-
voltage circuit board is prepared; a core board of the mixed-
voltage circuit board is prepared; as for outer
processing, laminating technique processing, single-face
microetching copper reduction technique processing, leveling and board brushing technique processing, drilling technique processing,
electroplating technique processing and outer pattern
transfer technique processing are conducted in sequence. The invention further provides the circuit board formed in the surplus-glue processing method of the circuit board. According to the method, the surplus glue is removed in batches by means of leveling and board brushing, so that it is guaranteed that the thickness of
copper of the circuit board reaches a required value; besides, it is guaranteed that the appearance of the circuit board is undamaged, good reliability is obtained, the defects produced by manual glue removing can be overcome, and
batch processing of glue removing can be achieved.