Product
Feature
Quick Research
Generate reliable direction feasibility study reports for your R&D in just a few steps.
Technical Q&A
Discover and master advanced knowledge NOW. Basics, ideas, possibilities, all at once.
Find Solutions
As an expert in R&D theories, this can generate solutions to your technical problems instantly.
Evaluate Feasibility
Analyze your overall solution with one click, know your potential R&D risks in advance.
Monitor Landscape
Get weekly tech updates, stay abreast of the latest tech innovations and key insights.
Patents
Literature
Hiro is an intelligent assistant for R&D personnel, combined with Patent DNA, to facilitate innovative research.
46results about How to "Easily radiated" patented technology
Efficacy Topic
Property
Owner
Technical Advancement
Application Domain
Technology Topic
Technology Field Word
Patent Country/Region
Patent Type
Patent Status
Application Year
Inventor
Wafer level system in package and fabrication method thereof
ActiveUS20080290496A1Easy to integrateEasily radiatedSemiconductor/solid-state device detailsSolid-state devicesDielectricUnit system
There is provided a system-in-package (SiP), which includes a substrate obtained by cutting a wafer for each unit system; one or more first electronic devices mounted on the substrate by a heat radiation plate; a plurality of interlayer dielectrics sequentially formed on the substrate; and one or more second electronic devices buried between or in the interlayer dielectrics on the substrate. A heat sink may be additionally attached to the bottom surface of the substrate. In this case, a thermal conduction path including heat pipes connecting the heat radiation plate on the substrate and the heat sink is formed. In the SiP, various types of devices are buried at a wafer level, so that a more integrated semiconductor device is implemented corresponding to demand for a fine pitch. Further, the heat radiation of a device required in high-speed operation and high heat generation is maximized due to the multi-stepped heat radiation structure, and thus the operation of the device is more stabilized.
Owner:NEPES CO LTD
Optical projector with image enlarging and projecting capability and heat insulating and cooling means
InactiveUS6428170B1Improve cooling effectLong maintenance periodTelevision system detailsProjectorsOptical pathEngineering
A projector includes an enclosing structure that encloses an optical path from an electrooptical device to a projection lens with a heat insulating member, and a thermoelectric transducer for cooling air inside the enclosing structure. Since the enclosing structure is formed by the heat insulating member, the electrooptical device can be efficiently cooled while thermally blocking between the inside and the outside thereof. Since being enclosed, the entry of dust or oil mist from the outside is prevented, and dust or oil mist does not adhere to the electrooptical device and the like.
Owner:SEIKO EPSON CORP
Capacitor and method of connecting the same
InactiveUS20060034036A1Improves sealing reliabilityImprove reliabilitySolid electrolytic capacitorsHermetically-sealed casingsCapacitanceHigh humidity
An object of the present invention is to provide a capacitor of a large capacity in which a drive electrolyte will not leak to the exterior even when the capacitor is used for a long period of time in a high-temperature and high-humidity environment The capacitor includes a hollow capacitor element (1) formed by rolling a pair of flat sheet-like electrodes (2a) and (2b), with separators (4) interposed therebetween, a bottom-closed metallic casing (5) receiving the capacitor element (1) and a drive electrolyte therein, and an opening-sealing plate (7) sealing an opening portion of the metallic casing (5), the opening-sealing plate having an external connection terminal. A rubber-like elastic member (9) is provided on a surface of the opening-sealing plate (7) at a peripheral edge portion thereof, and an electrically-insulating layer (6) is formed on the metallic casing to cover at least a region extending from the open end of the metallic casing (5) to a recess (5b) provided for fixing the opening-sealing plate (7), and the rubber-like elastic member (9) is pressed by the open end portion of the metallic casing (5).
Owner:PANASONIC CORP
Method and equipment for discriminating materials by employing fast neutron and continuous spectral X-ray
ActiveUS20070096036A1High detection efficiencyImprove qualityMaterial analysis by optical meansNeutron radiation measurementDual energyImage resolution
Disclosed is a method of discriminating materials by employing fast neutron and continuous spectral X-ray and an equipment for the same. The method comprising the steps of: (a) transmitting a fast neutron beam produced by a fast neutron source and a continuous spectral X-ray beam produced by a continuous spectral X-ray source through inspected objects; (b) directly measuring the intensity of the transmitted X-rays and the intensity of the transmitted neutrons by a X-ray detector array and a neutron detector array respectively; and (c) identifying the materials of the inspected object by Z-dependency curves formed by the attenuation differences between the neutron beam and X-ray beam transmitted through different materials of the inspected object. This direct measurement of transmitted dual-ray technique has much more efficient than secondary radiations measurement such as neutron activation analysis, has much more material discrimination sensitivity than dual-energy x-ray technique. The respective measurements of neutrons and x-rays make the usages of high detect efficiency neutron detectors and x-ray detectors possible. The using continuous spectral x-ray produced by Linac adds more advantages such as: high penetration ability, high spatial resolution, and high image quality over monoenergetic dual-ray technique.
Owner:TSINGHUA UNIV +1
Light emitting diode type illuminating module
InactiveUS20130063937A1High light efficiencyIncrease powerPlanar light sourcesMechanical apparatusConductive polymerDie casting
Disclosed herein is an LED-type illuminating module, which independently functions as an illuminating apparatus and which is used to constitute various kinds of illuminating apparatuses having desired outputs by providing a plurality of the LED-type illuminating modules on a module fixing plate 8 of a predetermined area, including: a light transmission or diffusion plate; an LED substrate on which LEDs are fixed at regular intervals by soldering; a radiator formed by die-casting a light metal alloy; a waterproof ring; a plurality of radiating plates made of a light metal alloy; a housing formed by injection-molding a conductive polymer resin material; a waterproof packing; and a power supply converter.
Owner:AHN IN KYU +1
Nitride Semiconductor Light Emitting Device
InactiveUS20090127572A1Improve quality of filmKeep conductivitySemiconductor lasersSemiconductor devicesSic substratePhysics
There is provided a nitride semiconductor light emitting device capable of inhibiting output deterioration of light emission caused by quality deterioration of a nitride semiconductor layer due to lattice-mismatching between a substrate and the nitride semiconductor layer, and utilizing light traveling to the substrate efficiently, while forming a light emitting device of a vertical type which has one electrode on a back surface of the substrate by using the substrate made of SiC. A light reflecting layer (2) which is formed by laminating low refractive index layers (21) and high refractive index layers (22) having different refractive indices alternately is directly provided on the SiC substrate (1), and a semiconductor lamination portion (5) which is formed by laminating nitride semiconductor layers so as to form at least a light emitting layer forming portion (3) is provided on the light reflecting layer (2). An upper electrode (7) is provided on an upper surface side of the semiconductor lamination portion (5), and a lower electrode (8) is provided on a back surface of the SiC substrate (1).
Owner:ROHM CO LTD
Capacitor and method of connecting the same
InactiveUS7365962B2Improves sealing reliabilityImprove reliabilitySolid electrolytic capacitorsHermetically-sealed casingsEngineeringCapacitor
A capacitor includes a hollow capacitor element formed by rolling a pair of flat sheet-like electrodes and, with separators interposed therebetween, a bottom-closed metallic casing receiving the capacitor element and a drive electrolyte therein, and an opening-sealing plate sealing an opening portion of the metallic casing, the opening-sealing plate having an external connection terminal. A rubber-like elastic member is provided on a surface of the opening-sealing plate at a peripheral edge portion thereof, and an electrically-insulating layer is formed on the metallic casing to cover at least a region extending from the open end of the metallic casing to a recess provided for fixing the opening-sealing plate, and the rubber-like elastic member is pressed by the open end portion of the metallic casing.
Owner:PANASONIC CORP
Vehicular lamp unit and vehicular lamp
InactiveUS8348486B2Improve visibilityDifficult to recognizeVehicle headlampsVehicle interior lightingOptical axisDistribution pattern
Owner:KOITO MFG CO LTD
Deicing of a surface of structures in general such as wind turbine blades, aircraft wings using induction or radiation
InactiveUS20150083863A1Promote absorptionEasily radiatedOverhead installationEngine manufactureFiberElectrical conductor
A method is provided which allows the facile deicing of a surface of a structure in general. Electromagnetic induction or IR / Microwave radiation is used to heat up a layer or a coating on said surface of the structure in general whereby said layer preferably contains conductive particles such as carbon nano particles, such as graphite, carbon nano tubes, carbon nano cones, metal in powder form, metalized glass beads, carbon fibers, chopped or as woven structure, etc all collectively named Carbon Nano Tubes (CNTs) or cones or metallic particles at concentrations above 0.01% by weight. Heat conductors such as boron nitride may be used to improve the heat transfer to the surface. Constructions are disclosed which shield the microwave emitters from lightning receiving elements, and which protect the complete structure during lightning events. Radiation can be supplied both from the inside of the structure as well as from the outside.
Owner:JKA KEMI
Fluorescent lamp lighting device
InactiveUS7012376B2Decrease in number of on-off operation can be preventedEasily radiatedElectrode assembly support/mounting/spacing/insulationIncadescent body mountings/supportEffect lightEngineering
A fluorescent lamp lighting device includes a fluorescent light bulb having an electrode filament and an electronic lighting circuit substrate for lighting the fluorescent light bulb, wherein a capacitor connected in parallel with the fluorescent light bulb, a positive characteristic thermistor connected in parallel with the capacitor, and a negative characteristic thermistor connected in parallel with the electrode filament are mounted on the electronic lighting circuit substrate, and wherein the negative characteristic thermistor, having a mounting surface, is mounted in such a manner that the mounting surface is in abutment with the electronic lighting circuit substrate. The positive characteristic thermistor and the negative characteristic thermistor are preferably mounted on mutually different mounting surfaces among the two mounting surfaces of the obverse and reverse surfaces of the electronic lighting circuit substrate.
Owner:MURATA MFG CO LTD
Spectroscopic camera and spectroscopic image processing method
ActiveUS20140240513A1Accurate imagingEasily radiatedTelevision system detailsSpectrum investigationImaging processingLight flux
A spectroscopic analysis apparatus includes a light source section having a first light source and second light source that radiate light fluxes, a wavelength tunable interference filter, an imaging section that captures light having passed through the wavelength tunable interference filter to acquire a first spectroscopic image when the object being imaged is irradiated with the light from the first light source and a second spectroscopic image when the object being imaged is irradiated with the light from the second light source, a pixel detector that detects an abnormal pixel in the first spectroscopic image, and a light amount corrector that replaces the amount of light at the abnormal pixel in the first spectroscopic image with the amount of light at a pixel in the second spectroscopic image that is located in the same position as the abnormal pixel.
Owner:SEIKO EPSON CORP
Vehicular lamp unit and vehicular lamp
InactiveUS20100110716A1Improve forward visibilityDifficult to recognizeVehicle headlampsVehicle interior lightingOptical axisDistribution pattern
A vehicular lamp unit includes a projection lens disposed on an optical axis extending in a vehicular longitudinal direction; a light source disposed rearward of a rear side focal point of the projection lens; a reflector reflecting direct light from the light source forward towards the optical axis; a shade disposed between the projection lens and the light source such that the shade blocks a part of reflected light from the reflector and a part of the direct light from the light source to form a cut-off line of a light distribution pattern; a first reflective surface formed on a tip portion of the reflector such that the first reflective surface reflects a part of the direct light from the light source downward to the front of the shade; and a second reflective surface formed on the front of the shade and below the rear side focal point of the projection lens such that the second reflective surface reflects reflected light from the first reflective surface towards the projection lens. The first reflective surface is formed in a shape of an ellipsoidal reflective surface having a vertical cross-section that is generally ellipsoidal in shape, and the second reflective surface is formed in a generally flat shape having a linear vertical cross-section.
Owner:KOITO MFG CO LTD
Electric radiator filled with oil
InactiveUS20070065123A1Enhanced convectionGood warmth retentionDomestic stoves or rangesElectric heating systemTemperature controlVertical plane
An improved electric radiator filled with oil includes a plurality of radiating fins, an electric-control box and a heater. Within the electric-control box, a switch, a temperature controller, a heat protector and a wire are provided. The radiating fin is hollow and sheet-like with at least two grooves therein for leading oil. The upper and lower ends of the fins are provided with hollow connecting-sleeves, oil-inflow holes are formed inside the connecting-sleeves. Each of the radiating fins is communicated with the oil-inflow hole and is filled with oil. Either the upper and the lower ends of each radiating fin are in different vertical planes, or the upper and the lower ends of each radiating fin are in a same vertical plane, but at least a part of the middle of each radiating fin is curved to form a convex configuration towards the side. Each of the radiating fins has the same shape and dimensions.
Owner:YAO GUONING
Method and equipment for discriminating materials by employing fast neutron and continuous spectral x-ray
ActiveUS7399976B2Improve permeabilitySimple materialMaterial analysis by optical meansNeutron radiation measurementImaging qualityX-ray
Disclosed is a method of discriminating materials by employing fast neutron and continuous spectral X-ray and an equipment for the same. The method comprising the steps of: (a) transmitting a fast neutron beam produced by a fast neutron source and a continuous spectral X-ray beam produced by a continuous spectral X-ray source through inspected objects; (b) directly measuring the intensity of the transmitted X-rays and the intensity of the transmitted neutrons by a X-ray detector array and a neutron detector array respectively; and (c) identifying the materials of the inspected object by Z-dependency curves formed by the attenuation differences between the neutron beam and X-ray beam transmitted through different materials of the inspected object. This direct measurement of transmitted dual-ray technique has much more efficient than secondary radiations measurement such as neutron activation analysis, has much more material discrimination sensitivity than dual-energy x-ray technique. The respective measurements of neutrons and x-rays make the usages of high detect efficiency neutron detectors and x-ray detectors possible. The using continuous spectral x-ray produced by Linac adds more advantages such as: high penetration ability, high spatial resolution, and high image quality over monoenergetic dual-ray technique.
Owner:TSINGHUA UNIV +1
Flexible substrate
InactiveUS20070200220A1High densitySmall sizeSemiconductor/solid-state device detailsPrinted circuit aspectsEpoxyHeat resistance
A flexible substrate is provided which contains not only flexibility but also rigidity and hear resistance. A flexible substrate includes a first wiring layer, an insulating resin layer, a glass cloth and a second wiring layer. The insulating layer is formed by an insulating material, such as a BT resin, epoxy resin or the like that contains a high elastic modulus, heat resistance and moisture resistance. The film thickness of the insulating resin layer is thinned down to about 60 μm. As a reinforcing material, the glass cloth is embedded in the insulating resin layer. With this structure, the flexible substrate attains flexibility and at the same time in any of the first wiring layer and the second wiring layer, circuit elements can be mounted both on a curved area and a non-curved area of the wiring layers.
Owner:SANYO ELECTRIC CO LTD
Semiconductor laser apparatus and optical apparatus
InactiveUS20120027040A1Effective radiationEasily radiatedLaser detailsSolid-state devicesPhotodetectorPhotovoltaic detectors
In this semiconductor laser apparatus, a first wire-bonding portion is arranged at a position in a fourth direction from a first semiconductor laser device and in a first direction from a photodetector, and a second wire-bonding portion is arranged at a position in the fourth direction from the first semiconductor laser device and in a third direction from the first wire-bonding portion. A third wire-bonding portion is arranged at a position in a second direction from a third semiconductor laser device and in the first direction from the photodetector, and a fourth wire-bonding portion is arranged at a position in the second direction from the third semiconductor laser device and in the third direction from the third wire-bonding portion.
Owner:SANYO ELECTRIC CO LTD
Semiconductor light emitting device
InactiveUS20070237197A1Improve cooling effectImprove reliabilitySolid-state devicesLaser cooling arrangementsThermal radiationLight emitting device
A semiconductor light emitting device includes a light emitting element, a heat radiating member, and a submount interposed between the light emitting element and the heat radiating member. The light emitting element is fixed to heat radiating member by a brazing material with the submount interposed. The heat radiating member has a groove on its surface to which the submount is fixed. With this configuration, a semiconductor light emitting device that is applicable to a large-sized light emitting element that is excellent in heat radiation and that has high reliability can be provided.
Owner:SHARP KK
Surface-emitting laser array, optical scanning device, and image forming device
ActiveUS8705585B2Avoid contactPrevent oxidationLaser optical resonator constructionSemiconductor laser arrangementsLaser arrayRefractive index
A surface-emitting laser array includes a plurality of surface-emitting laser elements. Each surface-emitting laser element includes a first reflection layer formed on a substrate, a resonator formed in contact with the first reflection layer and containing an active layer, and a second reflection layer formed over the first reflection layer and in contact with the resonator. The second reflection layer contains a selective oxidation layer. The first reflection layer contains on the active layer side at least a low refractive index layer having an oxidation rate equivalent to or larger than an oxidation rate of a selective oxidation layer contained in the second reflection layer. The resonator is made of an AlGaInPAs base material containing at least In. A bottom of a mesa structure is located under the selective oxidation layer and over the first reflection layer.
Owner:RICOH KK
Thermal head and printing device
A thermal head includes a glass layer having a protruding section formed on one surface and a concave groove section formed on the other surface facing the protruding section, a heat generation resistor provided on the protruding section, and a pair of electrodes provided to both sides of the heat generation resistor, and a part of the heat generation resistor exposed between the pair of electrodes is defined as a heat generation section, the protruding section has a smaller curvature radius in both sides than a curvature radius in a central portion, and a width of the groove section is one of equal to and larger than a length of the heat generation section.
Owner:SONY CORP
Backlight assembly and display device having the same
InactiveUS20070132361A1Increase heat radiationEasily radiatedDischarge tube luminescnet screensLamp detailsDisplay deviceEngineering
A backlight assembly includes a flat fluorescent lamp, a buffering member and a bottom chassis. The flat fluorescent lamp includes a lamp body generating light and an electrode portion formed on the lamp body. The buffering member contacts the electrode portion and includes at least one hole. The bottom chassis includes a bottom plate and a sidewall to receive the flat fluorescent lamp and the buffering member and includes at least one hole.
Owner:SAMSUNG ELECTRONICS CO LTD
Voltage-multiplier circuit
InactiveUS20060125552A1Promote repairLow costApparatus without intermediate ac conversionElectric variable regulationCapacitanceVoltage multiplier
The invention provides a voltage-multiplier circuit, and comprises a voltage-pumping block and a functional generator. The voltage-pumping block is composed of a first diode, a second diode, a first couple capacitor, a second couple capacitor to pump an input voltage. The invention can form the multi-level voltage-pumping blocks, and the voltage-pumping block is only needed to replace the diode and the capacitor to repair and increase / decrease the numbers of the diodes and the capacitors to achieve easily adjust the range of the voltage-pumping to achieve the object of decreasing the time and costing saving.
Owner:NOSICA INT
Fluorescent lamp lighting device
ActiveUS20040085767A1Easily radiatedEasily to room temperatureIncadescent body mountings/supportElectrode assembly support/mounting/spacing/insulationEffect lightHeat sensitive
A fluorescent lamp lighting device includes a fluorescent light bulb having an electrode filament and an electronic lighting circuit substrate for lighting the fluorescent light bulb, wherein a capacitor connected in parallel with the fluorescent light bulb, a positive characteristic thermistor connected in parallel with the capacitor, and a negative characteristic thermistor connected in parallel with the electrode filament are mounted on the electronic lighting circuit substrate, and wherein the negative characteristic thermistor, having a mounting surface, is mounted in such a manner that the mounting surface is in abutment with the electronic lighting circuit substrate. The positive characteristic thermistor and the negative characteristic thermistor are preferably mounted on mutually different mounting surfaces among the two mounting surfaces of the obverse and reverse surfaces of the electronic lighting circuit substrate.
Owner:MURATA MFG CO LTD
Light emitting diode type illuminating module
InactiveUS8920005B2High light efficiencyIncrease powerPlanar light sourcesMechanical apparatusConductive polymerComputer module
Disclosed herein is an LED-type illuminating module, which independently functions as an illuminating apparatus and which is used to constitute various kinds of illuminating apparatuses having desired outputs by providing a plurality of the LED-type illuminating modules on a module fixing plate 8 of a predetermined area, including: a light transmission or diffusion plate; an LED substrate on which LEDs are fixed at regular intervals by soldering; a radiator formed by die-casting a light metal alloy; a waterproof ring; a plurality of radiating plates made of a light metal alloy; a housing formed by injection-molding a conductive polymer resin material; a waterproof packing; and a power supply converter.
Owner:AHN IN KYU +1
Projection display unit
ActiveUS20170329459A1Easy to operateShorten the lengthProjectorsPicture reproducers using projection devicesProjection planeProjection lens
A projection display unit includes, in a housing (120), a visible light illuminator, a light valve that modulates a first polarized component included in light outputted from the visible light illuminator, on a basis of an image signal, a projection lens that projects light modulated by the light valve onto a projection plane, a detection light-source section (30) that outputs invisible light for detection, and an imaging device that receives a second polarized component included in light that is based on the invisible light. The detection light-source section (30) is movable relative to the housing (120), and outputs the invisible light in a direction parallel to or a direction forming a fixed angle with respect to the projection plane (110).
Owner:SONY CORP
Door handle with light unit
ActiveUS9764684B2Reduce inconvenienceLess visibleVehicle locksOptical signallingLight guideEngineering
A door handle includes a casing inside which an accommodation space is provided, and a lamp unit disposed in the accommodation space. The lamp unit includes a light emission element, a circuit board on which the light emission element is mounted, a housing that supports the circuit board, and a light guiding lens that guides light emitted from the light emission element in a predetermined direction. The light guiding lens includes an incident surface that receives light emitted from the light emission element, and an emission surface that emits the light entering in the light guiding lens through the incident surface and is positioned below the incident surface. In the door handle, the emission surface is positioned above a lower surface of the casing.
Owner:KOITO MFG CO LTD +2
Surface-emitting laser array, optical scanning device, and image forming device
ActiveUS20130230070A1Avoid contactPrevent oxidationLaser detailsLaser optical resonator constructionLaser arrayRefractive index
A surface-emitting laser array includes a plurality of surface-emitting laser elements. Each surface-emitting laser element includes a first reflection layer formed on a substrate, a resonator formed in contact with the first reflection layer and containing an active layer, and a second reflection layer formed over the first reflection layer and in contact with the resonator. The second reflection layer contains a selective oxidation layer. The first reflection layer contains on the active layer side at least a low refractive index layer having an oxidation rate equivalent to or larger than an oxidation rate of a selective oxidation layer contained in the second reflection layer. The resonator is made of an AlGaInPAs base material containing at least In. A bottom of a mesa structure is located under the selective oxidation layer and over the first reflection layer.
Owner:RICOH KK
Electronic system having resistors serially connected
ActiveUS20120032503A1Substantial temperature increaseEasily radiatedSpeed controllerElectric devicesElectrical resistance and conductanceElectronic systems
An electronic system has a capacitor that smoothes voltage of a direct current source, a resistance circuit that discharges charge of the capacitor, and an inverter circuit that converts the smoothed voltage into a three-phase ac voltage and applies this ac voltage to a motor. The resistance circuit has resistors and patterned wires disposed on a substrate such that the wires serially connect the resistors to discharge charge of the capacitor. The resistors are aligned in a straight line. The resistors located at positions different from ends of the series of resistors have resistance values lower than resistance values of the resistors located at respective ends of the series of resistors. More preferably, as the position of one resistor approaches the center of the series of resistors, the resistor is set at a lower the resistance value.
Owner:DENSO CORP
Thermal head and printing device
A thermal head includes a glass layer having a protruding section formed on one surface and a concave groove section formed on the other surface facing the protruding section, a heat generation resistor provided on the protruding section, and a pair of electrodes provided to both sides of the heat generation resistor, and a part of the heat generation resistor exposed between the pair of electrodes is defined as a heat generation section, the protruding section has a smaller curvature radius in both sides than a curvature radius in a central portion, and a width of the groove section is one of equal to and larger than a length of the heat generation section.
Owner:SONY CORP
Lamp apparatus for vehicle
InactiveUS7287889B2Reduce weightSmall amountPoint-like light sourceLighting support devicesMiniaturizationEngineering
A lamp or blinker apparatus for a vehicle for saving power and providing a long life and for achieving miniaturization of a lamp body by using a light emitting diode as a light source. The lamp or blinker apparatus for a vehicle includes a front blinker having a light emitting diode as a light source in a lamp body, and a resistance circuit for adjusting the voltage to be applied to the light emitting diode. The resistance circuit is provided separately outside the lamp body. The lamp body case may be formed from a heat transfer member with the light emitting diode attached to the lamp body case.
Owner:HONDA MOTOR CO LTD
Wafer level system in package and fabrication method thereof
ActiveUS7906842B2Easy to integrateEasily radiatedSemiconductor/solid-state device detailsSolid-state devicesDielectricUnit system
There is provided a system-in-package (SiP), which includes a substrate obtained by cutting a wafer for each unit system; one or more first electronic devices mounted on the substrate by a heat radiation plate; a plurality of interlayer dielectrics sequentially formed on the substrate; and one or more second electronic devices buried between or in the interlayer dielectrics on the substrate. A heat sink may be additionally attached to the bottom surface of the substrate. In this case, a thermal conduction path including heat pipes connecting the heat radiation plate on the substrate and the heat sink is formed. In the SiP, various types of devices are buried at a wafer level, so that a more integrated semiconductor device is implemented corresponding to demand for a fine pitch. Further, the heat radiation of a device required in high-speed operation and high heat generation is maximized due to the multi-stepped heat radiation structure, and thus the operation of the device is more stabilized.
Owner:NEPES CO LTD
Who we serve
- R&D Engineer
- R&D Manager
- IP Professional
Why Patsnap Eureka
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com