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47results about How to "Heat radiation" patented technology

Radiation generating apparatus and radiation imaging apparatus

A radiation generating apparatus includes: an envelope 1 having a first window 2 through which a radiation is transmitted; and a radiation tube 10 being held within the envelope 1, and having a second window 15 which is arranged in opposition to the first window 2, and through which the radiation is transmitted; and a radiation shielding member 16 thermally connected to the second window 15, having a radiation transmitting hole 21 arranged in communication with the second window 15, and having a protruding portion protruding from the second window 15 toward the first window 2. A thermal conducting member 17 having a higher thermal conductivity rather than that of the radiation shielding member 16 is connected to the protruding portion of the radiation shielding member 16. The radiation generating apparatus can shield an unnecessary radiation and cool a target with a simple structure and is entirely reduced in weight.
Owner:CANON KK

Reactor and power converter incorporating the reactor

A reactor is provided with a coil, a core, and a case. The coil generates magnetic flux in response to supply of current thereto. The core is made of magnetic powder-containing resin filled in spaces inside and outside of the core. The case accommodates therein the coil and the core. The reactor is also provided with a cooling pipe (cooling member), which is arranged to be in contact with the core. A power converter is provided with semiconductor modules, a cooler, and the reactor. In the power converter, the cooler is arranged partially being in contact with the core of the reactor.
Owner:TOKIN CORP

Wafer level system in package and fabrication method thereof

There is provided a system-in-package (SiP), which includes a substrate obtained by cutting a wafer for each unit system; one or more first electronic devices mounted on the substrate by a heat radiation plate; a plurality of interlayer dielectrics sequentially formed on the substrate; and one or more second electronic devices buried between or in the interlayer dielectrics on the substrate. A heat sink may be additionally attached to the bottom surface of the substrate. In this case, a thermal conduction path including heat pipes connecting the heat radiation plate on the substrate and the heat sink is formed. In the SiP, various types of devices are buried at a wafer level, so that a more integrated semiconductor device is implemented corresponding to demand for a fine pitch. Further, the heat radiation of a device required in high-speed operation and high heat generation is maximized due to the multi-stepped heat radiation structure, and thus the operation of the device is more stabilized.
Owner:NEPES CO LTD

Electronic apparatus

An enclosure has an edge for defining a window opening. A keyboard is set in the window opening. A support member attached to the enclosure from the inside of the enclosure to receive the edge of the enclosure and the keyboard. A wall stands upright from the surface of the support member at a position outside the window opening. When coffee is spilled on the keyboard, the liquid flows into a space between the keyboard and the window opening. The surface tension of the liquid serves to prevent the liquid from immediately leaking outside the window opening through the gap between the edge and the support member. The liquid then starts leaking outside the window opening through the gap. The wall of the support member blocks the liquid. It thus takes a while before the liquid flows over the wall.
Owner:FUJITSU CLIENT COMPUTING LTD

Passive phase change radiators for LED lamps and fixtures

Heat management devices and structures are disclosed that can be used in lamps having solid state light sources such as one or more LEDs. Some lamp embodiments comprise one or more phase change radiators that utilize the latent heat of fluids to circulate and draw heat away from the LEDs and radiate the heat into the ambient, allowing for the LEDs to operate at a lower temperature. Some phase change radiators according to the present invention can comprise a main radiator body and multiple radiator coolant loops mounted to the body. The present invention relies on the circulation of heated fluid through the radiator body to radiate heat from the LEDs. The heated liquid moves away from the LEDs and is circulated back to thermal contact with the LEDs thought the coolant loops.
Owner:IDEAL IND LIGHTING LLC

Heat exchanger structure of automatic transmission

A heat exchanger structure of an automatic transmission stabilizing a temperature of oil is provided. A heat exchanger structure of an automatic transmission includes an automatic transmission, a first heat exchanger provided on an upstream side and a second heat exchanger provided on a downstream side, each capable of cooling oil ejected from the automatic transmission, and a thermo valve capable of supplying oil subject to heat exchange by at least one of first and second heat exchangers to the automatic transmission. When a temperature of the oil is relatively low, the thermo valve supplies oil passed through the first heat exchanger to the automatic transmission and shuts off a flow of oil from the second heat exchanger to the automatic transmission. When a temperature of the oil is relatively high, the thermo valve supplies oil passed through first and second heat exchangers to the automatic transmission.
Owner:TOYOTA JIDOSHA KK

Ceramic package with radiating lid

A ceramic package with a lid attached thereon, which has radiating grooves at its upper surface and / or lower surface to radiate heat generated from a chip-type device is disclosed. The ceramic package includes a laminated ceramic substrate comprised of a plurality of ceramic substrate such that a cavity is centrally defined in the laminated ceramic substrate, a chip-type device mounted on the bottom of the cavity of the laminated ceramic substrate, and a lid attached to the top of the laminated ceramic substrate to close the cavity, which is provided at its upper and / or lower surface with protrusions to efficiently radiate heat generated from the chip-type device.
Owner:SAMSUNG ELECTRO MECHANICS CO LTD

Electric Power Steering Device

An electric power steering device which has, on the outer surface of its gear box, the circuit modules of a control device such as a power module, a frame module, and a control module, and which is easily mountable on a vehicle and less affected by heating. The upper half of the gear box (11) is formed in a rectangular parallelepiped box (11b) in which a reduction gear mechanism is assembled. The first flat face (11b1) of the gear box (11) on the outside of the axis of the center shaft of an electric motor (12) as viewed from a worm gear meshing point is formed as a mounting face for the power module (PM), and the second flat face (11b2) of the gear box crossing the first flat face is formed as a mounting face for circuit parts forming the frame module (FM) and the control module (CM).
Owner:NSK LTD

Heat transfer film, semiconductor device, and electronic apparatus

A heat transfer film includes a heat transfer layer formed of a first constituent material containing C (carbon) for transferring heat in an in-plane direction thereof and a layer thickness direction thereof; and a strain relaxation layer formed of a second constituent material and laminated on the heat transfer layer for relaxing a strain in the heat transfer layer. The first constituent material includes a graphite, and the second constituent material includes an amorphous material.
Owner:FURUKAWA ELECTRIC CO LTD

Light source apparatus, image display apparatus and television receiving apparatus

A light source apparatus, an image display apparatus and a television receiving apparatus are provided, which can electrically connect boards with each other even if the boards are separated from each other by more than or less than a predetermined distance. In a light source unit in which plural LEDs are aligned on one surface of a LED board 2, plural stoppers 20 are arranged at another surface 2b of LED board 2 to stop the stopper 20 at stop slits 63, 63, . . . 63 of a support member 6 which is to hold the light source unit, and to hold the light source unit to be slidable along one surface of the support member 6.
Owner:SHARP KK

Terminal block and motor provided therewith

A terminal block (10) to be fixed to a motor case (C) which houses a motor body and includes a coolant flow path (C1) and adapted to fasten busbars by tightening bolts includes nuts (30) for tightening the bolts, and a heat sink (40) made of aluminum die-cast and held in close contact with the nuts (30) via an insulation plate (20) behind the nuts (30). The heat sink (40) includes a heat radiating portion (46) which comes into contact with cooling water passing in the coolant flow path (C1) of the motor case (C).
Owner:SUMITOMO WIRING SYST LTD

Display device provided with radiating structure and plasma display device provided with radiating structure

A display device provided with a radiating structure for cooling heat of heat generating parts is provided. In a PDP device provided with a display panel which displays videos, reinforcement support members which reinforce the display panel fixed to an enclosure is made to contact heat generating parts which are heated in the enclosure and the reinforcement support members are made to have a dual-function as radiating members for radiating heat from the heat generating parts. This makes it possible to cool heat of the heat generating parts and suppress an increase in the number of parts and an increase in the manufacturing cost.
Owner:ORION ELECTRIC CO LTD

Pad layout structure of driver IC chip

A pad layout structure of a driver IC chip of a liquid crystal display device includes dummy power pads and dummy ground pads, which are disposed in corners of the driver IC chip and are connected to main power pads and main ground pads by metal lines in a chip-on-film (COF) package. Accordingly, it is possible to reduce the resistance of power supply lines and ground lines, to minimize a power dip of a block located far away from the main power pads and main ground pads, and to prevent a failure in power application, which may occur due to a decrease of adhesive strength at a specific position, by dispersing the adhesion positions of the power pads and ground pads.
Owner:SILICON WORKS CO LTD

Motor Drive Apparatus

A motor drive apparatus includes a motor; and an ECU. The ECU includes an ECU housing. The ECU housing includes a heat sink having a module receiving portion. The module receiving portion includes a heat-receiving surface and an opening portion open to one-end side of the ECU housing. The ECU further includes a control substrate received by the ECU housing to be perpendicular to the heat-receiving surface and to face the motor; a plurality of semiconductor modules each received in the module receiving portion and connected electrically with the control substrate to control a power supply of the motor. Each of the plurality of semiconductor modules includes a heat-radiating surface at an outer portion thereof. The ECU further includes a module retaining section pressing the heat-radiating surface to the heat-receiving surface to retain each of the plurality of semiconductor modules in the module receiving portion.
Owner:HITACHI ASTEMO LTD

Compact thermal exchang unit of thermo-electric cooling mode using heat pipe

The present invention relates to a thermal exchange device using heat pipes to effectively discharge heat from inside of an open-air communication system. The present invention provides a plurality of heat pipes directly inserted between the plates of the thermo-electric cooling unit for accommodating a plurality of fins thereon. According to the structure suggested by the invention, since the heat pipes can be placed laterally with the thermo-electric cooling unit, the size of the overall communication system can be reduced with the same discharge capability.
Owner:TRANSPACIFIC SONIC

Heat storage member

A heat storage member including: a substrate containing a SiC sintered body as a principal ingredient; a coating layer disposed at least to a part of surface of the substrate; and a heat storage material disposed at least to a part of a surface of the coating layer and configured to store and radiate heat by a reversible chemical reaction with a reaction medium or a heat storage material configured to store and radiate heat by physical adsorption to a reaction medium and by physical desorption from a reaction medium. A softening point of the coating layer is a temperature at 1000° C. or less.
Owner:NGK INSULATORS LTD +1
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