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97results about How to "Easily brought" patented technology

Method for producing cerium-based abrasive and cerium-based abrasive produced thereby

This invention is a method for producing a cerium-based abrasive which includes: a step of grinding raw material for the cerium-based abrasive; a step of roasting the ground raw material; and a step of subjecting the roasted raw material to wet processing, the method being characterized in that it further includes a lower-temperature re-roasting step of heating the wet-processed raw material at 200 to 700° C. In the invention disclosed in this application, an abrasive with particularly preferable properties can be produced by fully drying the wet-processed raw material in a drying step, and subsequently subjecting the dried raw material to the lower-temperature re-roasting step.
Owner:MITSUI MINING & SMELTING CO LTD

Convertible axle structure

A convertible axle structure includes a first shaft, a second shaft parallel to the first shaft, and a switch member disposed between the first shaft and the second shaft. The outer wall of the first shaft has a slide groove composed of a front radial slide groove portion, an axial slide groove portion, and a rear radial slide groove portion. The outer wall of the second shaft has a guide groove composed of a radial guide groove portion, a front inclined guide groove portion, and a rear inclined guide groove portion. The switch member has a first protrusion slidable in the slide groove and a symmetrical second protrusion slidable in the guide groove to guide the first shaft and the second shaft to carry out an asynchronous convertible turning.
Owner:FIRST DOME

Device and method for providing multimedia data in a motor vehicle

A device for providing multimedia data in a motor vehicle. At least one vehicle-internal hardware component serves to provide a first runtime environment for supporting at least one computer program application on the vehicle-internal hardware component. An interface serves for communication with at least one vehicle-external hardware component, which provides a second runtime environment for supporting the computer program application on the vehicle-external hardware component. Furthermore, either the vehicle-internal hardware component or the vehicle-external hardware component is selectable for executing the computer program application.
Owner:VOLKSWAGEN AG

Sanitizing devices for needleless medical fittings

Single-use devices configured to sanitize accessible surfaces of needleless medical valves at risk of contamination with infectious agents are described, as are methods for making and using such devices. Such devices include a sanitizing element securely attached to an inner surface of at least one of the two or more layers that make up the container inside of which the sanitizing element is stored until it is ready to be used. Examples of containers include laminated foil pouches or packets.
Owner:ZINC MEDICAL

Heat exchanger

A heat exchanger with the ends of tubes (10) connected by being inserted into a tank (2) is disclosed. Insertion holes are formed in a protrusion (210) convex outward of the tank (2) along the tube length (X). The junction length ratio B / A is not less than 1.15, where A is the outer peripheral surface length of the tubes (10) and B the peripheral length of the junction between the tubes (10) and the tank (2). The larger the junction length ratio, the more the stress generated in the tubes (10) is distributed and reduced. Especially in the case where the junction length ratio is not less than 1.15, the stress is reduced by one half as compared with the junction length ratio of 1.0.
Owner:DENSO CORP

Semiconductor device and method of manufacturing the same

A method of manufacturing a semiconductor device in which a semiconductor element 10 is mounted on a substrate 20 through a flip-chip connection, includes the steps of cladding gallium as a bonding material 30 to a connecting pad 22 formed on a surface of the substrate 20, diffusing copper from the connecting pad 22 formed of the copper into the bonding material 30 through heating under vacuum, thereby bringing a state of a solid solution of the gallium and the copper, and aligning a connecting bump 12 formed on the semiconductor element 10 with the connecting pad 22 and bonding the connecting bump 12 to the connecting pad 22 through the bonding material 30 in a state of a solid solution under heating.
Owner:SHINKO ELECTRIC IND CO LTD
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