The invention belongs to the technical field of the sensors and relates to a thermal convecting one-
chip three-axial accelerating sensor. Basic principles of the invention are that air inside a sealed cavity body is inducted to do thermal
convection through a heat-sensitive component, and an accelerating
signal is transmitted through calculations. The invention comprises a packing cavity which is located on the surface of a heating wire temperature sensor and an
etching cavity which is located under the surface of the heating wire temperature sensor. The packing cavity and the
etching cavity are arranged in symmetry in four groups of sensors around center. The invention applies for a plurality of fields as automobile, game industry,
aviation, ship
navigation system, product for civilian use, military, and the like. The invention adopts thermal
convection principles to test accelerating information, and has no
mass block, and can work under high-g. The invention has
impact resistance without adhesions or granules, low cost, low
failure rate,
high rate of good product, high sensibility, and strong anti-interference. Compared with original one-
chip three-axial accelerating sensors of MEMSIC Company, a test for accelerating inside a three-dimensional space is available.