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138results about How to "Deterioration of property" patented technology

Electronics device, semiconductor device, and method for manufacturing the same

It is an object of the present invention to provide a high reliable EL display device and a manufacturing method thereof by shielding intruding moisture or oxygen which is a factor of deteriorating the property of an EL element without enlarging the EL display device.In the invention, application is used as a method for forming a high thermostability planarizing film 16, typically, an interlayer insulating film (a film which serves as a base film of a light emitting element later) of a TFT in which a skeletal structure is configured by the combination of silicon (Si) and oxygen (O). After the formation, an edge portion or an opening portion is formed to have a tapered shape. Afterwards, distortion is given by adding an inert element with a comparatively large atomic radius to modify or highly densify a surface (including a side surface) for preventing the intrusion of moisture or oxygen.
Owner:SEMICON ENERGY LAB CO LTD

Method for producing multilayer wiring substrate and multilayer wiring substrate

The present invention provides a method for producing a multilayer wiring substrate, including: forming a laminated body having an insulating resin layer and a polymer adhesive layer, on a surface of a first wiring substrate wherein the polymer adhesive layer contains a polymer precursor interacting with a plating catalyst or a precursor thereof, and a reactive group bonding with an adjacent layer on the first wiring substrate side; applying energy to a region outside of a via connection portion on the surface of the laminated body, to form a patterned polymer adhesive layer; applying a plating catalyst or a precursor thereof to the patterned polymer adhesive layer, and carrying out a first electroless plating, to form a second metal wiring on the surface of the patterned polymer adhesive layer; and forming a via by utilizing the patterned second metal wiring as a mask, and subsequently carrying out a desmear treatment.
Owner:FUJIFILM CORP

Heat dissipation structure

The present invention provides a heat dissipation structure that does not cause problems such as contact failures in electronic components and that is applicable to electronic components with high heat densities. The present invention also provides a method for easily repairing an electronic device. The heat dissipation structure is obtained by filling and curing a thermally conductive curable resin composition in an electromagnetic shielding case on a substrate on which an electronic component with a heat density of 0.2 W / cm2 to 500 W / cm2 is mounted, the thermally conductive curable resin composition containing a curable liquid resin (I) and a thermally conductive filler (II), having a viscosity at 23° C. of 30 Pa·s to 3000 Pa·s and a thermal conductivity of 0.5 W / (m·K) or more, and being curable by moisture or heat.
Owner:KANEKA CORP

Composition for forming layer to be plated, method of producing metal pattern material, and metal pattern material

The present invention provide a composition for forming a layer to be plated, including a solution in which from 1% by mass to 20% by mass of a polymer having a functional group that forms an interaction with a plating catalyst or a precursor thereof and a radical polymerizable group, and a water-insoluble photopolymerization initiator are dissolved in a mixed solvent comprising from 20% by mass to 99% by mass of a water-soluble flammable liquid and water; a method of producing a metal pattern material using the composition for forming a layer to be plated; and a metal pattern material produced by the method.
Owner:FUJIFILM CORP

Display

ActiveUS7420535B2Preventable from deterioration of scan propertyDeterioration of propertyStatic indicating devicesSolid-state devicesElectricityEngineering
A display capable of suppressing reduction of a scanning property is provided. This display comprises a shift register circuit formed by connecting a plurality of first circuit parts each including a first conductivity type first transistor connected to a first potential and turned on in response to a clock signal, a first conductivity type second transistor connected to a second potential and a first conductivity type third transistor, connected between the gate of the first transistor and the second potential, having two gate electrodes electrically connected with each other.
Owner:SANYO ELECTRIC CO LTD
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